HBM W20 Search Results

lt 8232

Abstract: gsm transceiver lucent 451 Lucent w2020 MAX1032 UHF Phase Shifter VCO circuit diagram W2020 RMX01 CSP1088
Contextual Info: microelectronics Data Sheet December 1996 group Lucent Technologies Bell Labs Innovations W2020 GSM Transceiver Features Applications • First commercial single-chip EGSM transceiver ■ GSM handportables ■ 2.7 V operation ■ GSM data services ■ Low power consumption

Contextual Info: SEOUL SEMICONDUCTOR Z-POWER LED Series Technical Datasheet for W20191, W20192 Z-Power series is designed for high current operation and high flux output applications. Z-Power LED's thermal management perform exceeds other power LED solutions. It incorporates state of the art SMD design and Thermal

UV LED Seoul Semiconductor

Contextual Info: SEOUL SEMICONDUCTOR Z-POWER LED Series Technical Datasheet for W20190 Z-Power series is designed for high current operation and high flux output applications. Features • Super high Flux output and high Luminance Z-Power LED's thermal management perform exceeds

VCO circuit diagram

Abstract: GSM Transceiver uhf amp circuit diagrams l9100 Lucent w2020 circuit diagram GSM transmitter receiver lucent 451 "GSM hardware" pin configuration of ic 4518 W2020B
Contextual Info: Data Sheet December 1996 W2020 GSM Transceiver Features Applications • First commercial single-chip EGSM transceiver ■ GSM handportables ■ 2.7 V operation ■ GSM data services ■ Low power consumption ■ Single IF down conversion ■ Frequency agile synthesizer

tantalum nitride

Abstract: W0603 W0805 W1206 W2010
Contextual Info: Precision Thin Film Chip Resistors IRC Advanced Film Division PFC Series • Standard 60/40 Sn/Pb and Pb-free RoHS compliant terminations available Ultra stable Tantalum Nitride resistor film system • Available in 0402, 0603, 0805, 1206, 1505, 2010 and 2512 chip sizes

Contextual Info: Precision Thin Film Chip Resistors IRC Advanced Film Division PFC Series • Standard 60/40 Sn/Pb and Pb-free RoHS compliant terminations available Ultra stable Tantalum Nitride resistor film system • Available in 0603, 0805, 1206, 1505, 2010 and 2512 chip sizes

w1206r

Abstract: W080
Contextual Info: Precision Thin Film Chip Resistors IR C Ad vanced Film Di vision IRC Adv Division ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○

Contextual Info: Precision Thin Film Chip Resistors IRC Advanced Film Division PFC Series • Standard 60/40 Sn/Pb and Pb-free RoHS compliant terminations available Ultra stable Tantalum Nitride resistor film system • Available in 0402, 0603, 0805, 1206, 1505, 2010 and 2512 chip sizes

Contextual Info: Gold Terminations Precision Thin Film Chip Resistors Ultra stable Tantalum Nitride resistor film system PFC Gold Series • Wire, ribbon, or epoxy bondable gold plated terminations • Available in 0402, 0603, 0805, 1206, 1505, 2010 and 2512 chip sizes • Tested for COTS applications

Contextual Info: Precision Thin Film Chip Resistors IRC Advanced Film Division PFC Series • Standard 60/40 Sn/Pb and Pb-free RoHS compliant terminations available Ultra stable Tantalum Nitride resistor film system • Available in 0603, 0805, 1206, 1505, 2010 and 2512 chip sizes

W0603

Abstract: n irc W0805 W1206 W2010 W0402
Contextual Info: Gold Terminations Precision Thin Film Chip Resistors Ultra stable Tantalum Nitride resistor film system PFC Gold Series • Wire, ribbon, or epoxy bondable gold plated terminations • Available in 0402, 0603, 0805, 1206, 1505, 2010 and 2512 chip sizes • Tested for COTS applications

Contextual Info: Precision Thin Film Chip Resistors IRC Advanced Film Division PFC Series Ultra stable Tantalum Nitride resistor film system • Available in 0603, 0805, 1206,1505, 2010 and 2512 chip sizes • Standard 60/40 and lead-free terminations available • Tested for COTS applications

TE-5001

Abstract: MARKING W16 SOT23 HBM W20 rnx w16 DNA 1002 TVC 2 HB IEEE resistor color code RDA Q20 W16 sot 23 acd marking code
Contextual Info: NETWORKS Resistors / capacitors / diodes 3 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC 2 1 STRUCTURE 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 4 IDENTIFICATION TYPE COATING COLOR MARKING

TS127 08

Abstract: RXD55 RXD01 txd45 RXD4-8 RXD35 TSI-16 RXD26 TXD38 TXD37
Contextual Info: Advance Information May 2003 TSI-16 Time-Slot Interchanger Hardware Design Guide Introduction Related Documents This document describes the hardware interfaces to Agere Systems Inc. TSI-16 device. Information relevant to the use of the device in a board design is covered. Ball descriptions, dc electrical characteristics,

DNA 1002

Abstract: rnx w16 dn5 marking packaging resistor MARKING W16 SOT23 rnx Q24 DN6 marking diode
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)

Contextual Info: FT3001 Reset Timer with Configurable Delay Features Description • •       The FT3001 is a timer for resetting a mobile device where long reset times are needed. The long delay helps avoid unintended resets caused by accidental key presses. Four timer values can be selected by

mlp8 land pattern

Abstract: W2020 UMLP-10 FT3001MPX
Contextual Info: FT3001 Reset Timer with Configurable Delay Features Description • •       Delay Times: 3.0, 3.75, 4.5, 6.0 Seconds The FT3001 is a timer for resetting a mobile device where long reset times are needed. The long delay helps avoid unintended resets caused by accidental key

transistor wm

Abstract: smd transistor marking 1 da
Contextual Info: !" PRELIMINARY DATASHEET WS1213 Power Amplifier Module for J-CDMA 887-925MHz DATASHEET (DEVICE : WS1213, 4x4 JAPAN CDMA PAM) Issued Date : December 9 , 2004 S. W. Paek Director, Module Group 1 Preliminary Information WM-0410-02 !" PRODUCT DESCRIPTION WS1213

mlp8 land pattern

Contextual Info: FT3001 Reset Timer with Configurable Delay Features Description • •       Delay Times: 3.0, 3.75, 4.5, 6.0 Seconds The FT3001 is a timer for resetting a mobile device where long reset times are needed. The long delay helps avoid unintended resets caused by accidental key

IPC-7721

Abstract: J-STD-033 PCB JEDEC J-STD-033 TAPE AND REEL IPC-7711
Contextual Info: !" PRELIMINARY DATASHEET WS1411 Power Amplifier Module for CDMA PCS 1850-1910MHz PRELIMINARY DATASHEET (DEVICE : WS1411, 4x4 US PCS PAM) Issued Date : July 5th , 2004 S. W. Paek Director, Module Group 1 Preliminary Information WM-0407-03 !" PRODUCT DESCRIPTION

WS1111

Abstract: J-STD-020A J-STD-033
Contextual Info: !" PRELIMINARY DATASHEET WS1111 Power Amplifier Module for CDMA/AMPS 824-849MHz PRELIMINARY DATASHEET (DEVICE : WS1111, 4x4 CDMA/AMPS PAM) Issued Date : Dec. 22, 2003 S. W. Paek Senior MTS, Module Group 1 Preliminary Information WR20310-001 !" PRODUCT DESCRIPTION

IPC-7721

Abstract: JEDEC J-STD-033 TAPE AND REEL IPC-7711 IPC 7721
Contextual Info: !" PRELIMINARY DATASHEET WS1311 Power Amplifier Module for CDMA PCS 1750-1780MHz PRELIMINARY DATASHEET REV 1.02 (DEVICE : WS1311, 4x4 KOREAN PCS PAM) Issued Date : July 5th , 2004 S. W. Paek Director, Module Group 1 Preliminary Information WM - 0407 - 04

Contextual Info: SOLID STATE DISK PRELIMINARY AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG Solid State Disk On Chip SSDoC FEATURES • Capacities - 4 GB - 8 GB - 16 GB • PATA Compatibility - ATA-5 compatible - UDMA4 supported - PIO Mode 4 supported - MWDMA Mode 2 supported

A104

Abstract: AA10 AS3SSD16GB5PBG ata commands 16GB Nand flash dual channel flash chip 8gb silicon power 4GB AB22-AB23
Contextual Info: SOLID STATE DISK PRELIMINARY Solid State Disk On Chip SSDoC AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG Not recommended for new designs. Contact Micross Marketing & Sales to discuss availability. The new microSSD is the recommended replacement part. FEATURES