HBGA552 Search Results

sot706

Contextual Info: PDF: 2002 Nov 13 Philips Semiconductors Package outline HBGA552: plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT706-1 A ball A1 index area A E A2 A1 detail X C e1 ∅v M b e ∅w M AG AD AB Y AE e AC

Contextual Info: Package outline HBGA552: plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT706-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF Y AE e AC AA W V heatsink U T e2 R P N M L K J H G F E D C B A 1