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    SOT70-5

    Abstract: sot705 SOT70
    Contextual Info: PDF: 2002 Nov 13 Philips Semiconductors Package outline HBGA480: plastic thermal enhanced ball grid array package; 480 balls; body 33 x 33 x 1.42 mm; heatsink B D SOT705-1 A ball A1 index area A A2 A1 E detail X C e1 e 1/2 ∅v M b e ∅w M AF AE AD AC AB


    Original     		hbga480ot705-1sot70-5sot705+1sot70 PDF

    480TV

    Contextual Info: JEITA Package Code T-HBGA480-31x31-1.00 RENESAS Code TRBG0480FA-A Previous Code BT-480T/BT-480TV MASS[Typ.] 4.1g D w S B E w S A x4 v A1 y S A y1 S S ZD e e A AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Reference Symbol B Dimension in Millimeters


    Original     		t-hbga480-31x31-1trbg0480fa-abt-480t/bt-480tv480tv PDF