gs32
Abstract: Maruwa substrate amorphous head AS970 maruwa network resistor
Contextual Info: MARUWA GENERAL CATALOG ALUMINA SUBSTRATES [ Al2O3 ] The Alumina substrates are produced under severe quality control with carefully selected high-purity Alumina materials that ensures stable quality and excellent characteristics. a Features State : Good smoothness/flatness with less porosity due to fine particles. Excellent in adhesion with thick/thin film materials.
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110160m
Max430m
gs32
Maruwa substrate
amorphous head
AS970
maruwa
network resistor
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sem 5025
Abstract: gs 31 thermal printer head Al2O3 HA-96-2 AS970 amorphous head laser cutting circuit drilling machine applications
Contextual Info: アルミナ基板〔Al2O3〕 ALUMINA SUBSTRATES [ Al2O3 ] The Alumina substrates are produced under severe quality control with carefully selected high-purity Alumina materials that ensures stable quality and excellent characteristics. 回路部品 CIRCUIT CERAMICS
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maruwa
Abstract: AL2O3 AS970 submount MA92 MA92W PD submount
Contextual Info: 㩷 MARUWA 薄膜基板 CENERAL CATALOG 薄膜基板是多种久经检验的陶瓷材料与多年开发的薄膜金属化技术相结合 的成果。可根据客户的要求，生产复杂电路基板，满足客户需求的物理 化学性质以及高度集成和优越电气性质。
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MA92W
MA92B
AS970
HA996
5mm/4mil60mil
L/S10
L/S20m/20m
maruwa
AL2O3
AS970
submount
MA92
MA92W
PD submount
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AS970
Abstract: MA92W TCR505 Al2O3 20M100 Maruwa substrate thermal conductivity maruwa
Contextual Info: 薄膜回路基板 THIN FILM METALIZED SUBSTRATES MARUWAの薄膜回路基板は実績ある各種セラミッ ク素材と、長年培ってきた薄膜メタライズ技術の融合 の結果生まれた基板材料です。それ故、ユーザー要求
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5mm/4mil60mil
AS970
MA92W
TCR505
Al2O3
20M100
Maruwa substrate
thermal conductivity maruwa
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AS970
Abstract: HA-96-2 Al2O3 HA996 3216 gs 32 Maruwa
Contextual Info: 㩷 MARUWA CENERAL CATALOG 氧化铝基板[AL2O3] 氧化铝基板严格选用高纯度氧化铝为原料，并在严格的质量管理下生产，因此产品质 量稳定且性能优越。 特征 • 表面状态： • 尺寸精度： • 挠度：
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AS970
HA-96-2
HA-996
05min
whi00
AS970
HA-96-2
Al2O3
HA996
3216
gs 32
Maruwa
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capacitors coefficient of thermal expansion
Abstract: thermal conductivity maruwa Maruwa Capacitors a 92 similar Alumina submount Maruwa Thin Film Capacitors AS970 MA92W
Contextual Info: MARUWA GENERAL CATALOG THIN-FILM SUBSTRATES The thin-film substrates are the result of the fusion of various time-tested ceramic materials and the thin-film metalizing technology developed over many years. The materials permit the production of sophisticated circuit
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