H308 Search Results

V23818

Abstract: 10-PIN V23818-H308-L57 td106
Contextual Info: V23818-H308-L57 * Small Form Factor Multimode 850 nm 622 Mbit/s OC-12 Transceiver with LC Connector Dimensions in mm [inches] a) recommended bezel position shown design with collar V23 818 -H3 08-L 57 FEATURES • Small Form Factor transceiver • Excellent EMI performance

V23818-H308-L57

Abstract: INFINEON SERDES
Contextual Info: V23818-H308-L57 * Small Form Factor Multimode 850 nm 622 Mbit/s OC-12 Transceiver with LC Connector Preliminary Dimensions in [mm] inches Circuit Board Layout Recommended PCB Thickness: 0.1(2.54) max. 21.34 .840 8.17 .321 12.88 .507 1 1 +.00 .06 -.00 1.40

h308

Abstract: L-3541ED L-3541GD L-3541HD L-3541YD L-H322005B L-H322006B L-H322007B L-H322008B L-H322XXXX
Contextual Info: L-H322XXXX 3.0mm Dia LED LAMP, WITH H308 HOLDER Part No. L-H322005B L-H322006B L-H322007B L-H322008B LED LAMP Lens Color Chip Raw Material Wave Length ɡp nm Electro-Optical Characteristics Iv(mcd)20mA Vf(V)20mA Typ. Typ. Max. View Angle (deg) A=L-3541GD Green Diffused

PEC 622

Abstract: pec 830
Contextual Info: SIEMENS V23826-H308-C353 AC/AC Coupled Multimode 850 nm 622 MBd ATM 1x9 Transceiver with Signal Detect TTL Pre lim inary Absolute Maximum Ratings Exceeding any one of these values may destroy the device immediately. FEATURES • Compliant with existing standards

V23818

Abstract: 10-PIN V23818-H308-L57
Contextual Info: Fiber Optics Small Form Factor Multimode 850 nm 622 Mbit/s OC-12 Transceiver with LC Connector V23818-H308-L57 Features • Small Form Factor transceiver • Excellent EMI performance • RJ-45 style LC™ connector system • Half the size of SC Duplex 1x9 transceiver

LUCENT ELECTRO DEVICE

Abstract: V23818-H308-L57
Contextual Info: V23818-H308-L57 * Small Form Factor Multimode 850 nm 622 MHz OC-12 Transceiver with LC Connector Preliminary Dimensions in [mm] inches Circuit Board Layout Recommended PCB Thickness: 0.1(2.54) max. 21.34 .840 8.17 .321 12.88 .507 1 1 +.00 .06 -.00 1.40

TXD70

Abstract: RMII PHY MTD508
Contextual Info: MYSON TECHNOLOGY MTD508 Preliminary 8 Port 10M/100M Ethernet Switch FEATURES GENERAL DESCRIPTION • IEEE802.3 and IEEE802.3u compliant. • Provide 8 RMII (Reduced Media Independent Interface) ports. • Programmable 1K/8K MAC addresses filtering. • Store and forward switching function and bad

ddh 303 l

Abstract: ddh 302 l ddh 303 l connect H306 -04 tr/MJE13006/ddh 303 l
Contextual Info: PF781-01 SEDI 753 Series High Duty LCD Driver • 120 Output Common Driver • Slim TCP • Common Output On-resistance 0.3kii Typ. • DESCRIPTION SED1753 is a low output resistance-common (low) driver of 120 outputs suitable to drive dot matrix LCD panels

st LD33

Abstract: ld33 st LD3 TM dio ld26 "network interface cards"
Contextual Info: MDS213 12-Port 10/100Mbps + 1Gbps Ethernet Switch Data Sheet Features • • February 2003 12 10/100 Mbps Autosensing, Fast Ethernet ports with Reduced MII Interface Single Gigabit Ethernet port Ordering Information MDS213CG • Supports both GMII and integrated Physical Coding

TX1B

Abstract: tx-3b BCM5000 100BASE-T4 RD4N
Contextual Info: 100BASE-T4 LAN MAGNETICS MODULES Pulse Designed for 10/100 Mbps Transmission Over UTP-3 Cable Using the 100Base-T4 Standard A TECHNITROL COMPANY Conform to 802.3u standard Filter modules replace 68 discreet components Surface mount, 235°C peak IR reflow temperature rating

Contextual Info: Application Specification 114- 13037 PIVOT BLOCK* Connectors NOTE i 25 FEB 10 Rev G All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2_.

rd2n

Abstract: rd2p BCM5000 78Z9022SM Broadcom Ethernet EMI TX33
Contextual Info: 100BASE-T4 LAN MAGNETICS MODULES Designed for 10/100 Mbps Transmission Over UTP-3 Cable Using the 100Base-T4 Standard Conform to 802.3u standard Filter modules replace 68 discreet components Surface mount, 235°C peak IR reflow temperature rating Voltage or current driver modules

LSISAS2208

Abstract: LSI SAS 2208 LSi SAS2108 SAS2108 LSIiBBU08 LSICVM01 LSISAS2008 sff-8087 SFF 8088 LSI00264
Contextual Info: P RO D UC T SEL EC TOR GUID E Storage Adapters March 2012 MegaRAID Solutions MegaRAID Ordering Part No. PKG Host Bus Type Channel/ Ports I/O Processor External Connector Internal Connector Cache Protection Option Memory MB No. of Drives Supported RAID Levels

h184

Abstract: H7C4 st LD33 h140 motorola MDS212 MDS213 MDS213CG h28c 8032X "network interface cards"
Contextual Info: MDS213 12-Port 10/100Mbps + 1Gbps Ethernet Switch Data Sheet Features • • October 2003 12 10/100Mbps Autosensing, Fast Ethernet ports with Reduced MII Interface Single Gigabit Ethernet port Ordering Information MDS213CG • Supports both GMII and integrated Physical Coding

Contextual Info: Tape & Reel packaging with Pick and Place Cap 250pcs per reel • Reel-off direction PE Bag Packaging Q'ty Notes: 6.30 20 18 16 14 12 10 8 6 4 No. of positions Material and finish: Contact: Brass Gold over 30~80u" nickel plating Insulation: PA9T UL94-V0, color black

sew 088

Abstract: 9013 h128 astm b298 UL1199 UL 2468 22 awg 2 core 4XE24-1936STJ H149 2XE22-1934STJ UL 10086 TEFZEL M22759/16
Contextual Info: TABLE OF CONTENTS Pages 150° C. Constructions Braidless Silicone Rubber 10-50kVDC . . . . . . . . . . . . . . . . . . .20 200° C. Constructions UL SF-1/CSA SEW-1 300V . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 UL SF-2/CSA SEW-2 600V . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

HMC308E

Abstract: 308E HMC308 H308
Contextual Info: HMC308 / 308E v05.1107 DRIVER & GAIN BLOCK AMPLIFIERS - SMT 5 Typical Applications Features Broadband or Narrow Band Applications: Gain: 18 dB • Cellular/PCS/3G P1dB Output Power: +17 dBm@ +5V • Fixed Wireless & Telematics Single Supply: +3V or +5V • Cable Modem Termination Systems

H3084

Abstract: RMII PHY MTD505 h1838
Contextual Info: MYSON TECHNOLOGY MTD505 Preliminary 5 Port 10M/100M Ethernet Switch FEATURES GENERAL DESCRIPTION • • • • The MTD505 complies fully with the IEEE802.3, 802.3u and 802.3x specifications and is a non-blocking 5 port 10M/100M Ethernet switch device.

Contextual Info: HMC308 / 308E v05.1107 DRIVER & GAIN BLOCK AMPLIFIERS - SMT 9 Typical Applications Features Broadband or Narrow Band Applications: Gain: 18 dB • Cellular/PCS/3G P1dB Output Power: +17 dBm@ +5V • Fixed Wireless & Telematics Single Supply: +3V or +5V • Cable Modem Termination Systems

power generation POWER COMMAND HM 1211

Abstract: GMAC st LD33 "network interface cards"
Contextual Info: MDS213 12-Port 10/100Mbps + 1Gbps Ethernet Switch Data Sheet Features • • June 2003 12 10/100Mbps Autosensing, Fast Ethernet ports with Reduced MII Interface Single Gigabit Ethernet port Ordering Information MDS213CG • Supports both GMII and integrated Physical Coding

L1247

Abstract: ledex L-2975-0XX L-3271-0XX H-1218-0XX L-3378-0XX H15120 L-1132-0XX L1246 h13100
Contextual Info: ROTARY Solenoids Ledex Rotary Solenoids Size 4E Precision Elongated Coil Performance Specifications How to Order Stroke 25° 35° 45° 55° 671⁄2° 95° 1. Using the Performance Chart to the left, select one of the five columns which provides the appropriate

pio 8255

Abstract: DIG-64 PD71055 RUE110 RXE110 dil reed relay
Contextual Info: DIG-64 Digital Input / Output Card User Manual DIG-64 User Manual Document Part N°: Document Reference: Document Issue Level: 0127-1005 DIG-64\.\127_1005.DOC 1.2 Manual covers PCBs identified: DIG64 Issue 1.x & 2.x where x is any digit All rights reserved. No part of this publication may be reproduced, stored in any retrieval

H308

Abstract: gvrp H7C4 h140 motorola MDS212 MDS213 MDS213CG CHIP04 "network interface cards"
Contextual Info: MDS213 12-Port 10/100Mbps + 1Gbps Ethernet Switch Data Sheet Features • • October 2003 12 10/100Mbps Autosensing, Fast Ethernet ports with Reduced MII Interface Single Gigabit Ethernet port Ordering Information MDS213CG • Supports both GMII and integrated Physical Coding

Contextual Info: Tape & Reel packaging with Pick and Place Cap 350pcs per reel • Reel-off direction PE Bag Packaging Q'ty Notes: DIM. G ±o.4o 20 18 16 14 12 10 8 6 4 No. of positions Material and finish: Contact: Brass Gold over 30~80u" nickel plating Insulation: PA9T UL94-V0, color black