H 48-1-A G Search Results

JESD-30

Abstract: QFN-48 jedec package MO-220 jesd MO-220 qfn 48 C212 b237
Contextual Info: Package Dimensions QFN 48 Chrontel Package Dimensions TOP VIEW BOTTOM VIEW B A 48 37 1 36 B/2 37 F 48 48 A 1 D C C/2 12 13 12 25 25 13 24 24 H E D J G I 48 Pin QFN Package Table of Dimensions No. of Leads 48 7 X 7 mm MilliMIN meters MAX A 7 B 2.25 5.25 C

LQFP-48

Abstract: MS-026D JESD-30
Contextual Info: Package Dimensions LQFP 48 Chrontel with Exposed Pad TOP VIEW BOTTOM VIEW A B K 25 36 24 37 B 48 A K 13 12 1 EXPOSED PAD D C F E .008" I J H G 48 Pin LQFP Exposed Pad Package Table of Dimensions No. of Leads 48 (7 X 7 mm) MilliMIN meters MAX SYMBOL A B C

LQFP-48

Abstract: 015G
Contextual Info: Package Dimensions LQFP 48 Chrontel Package Dimensions A B I 1 A B H D C J LEAD CO-PLANARITY H F G Table of Dimensions No. of Leads 48 7 X 7 mm MilliMIN meters MAX .004 “ A 8.80 9.20 B 7 C 0.50 D 0.17 0.27 SYMBOL E F 1.35 0.05 1.45 0.15 G 1.00 H 0.45 0.75

Contextual Info: REV A ORDER INFORMATION ECN NO. NEW DESIGN APP. DATE 1802 48 OX 4 X "L_ Plating: 2: Selective Gold 4: Selective Gold 30u” 11.7 7.0 -No. Of Contact 4.6 06: S /H:4.5 KINK 0 7 :1 1 /H:4.5 (KINK) 2.0 1.0 Type 48:SMT 1.0 1.2 4 - 3 .Oxl.O 1 III I L

Contextual Info: COM’L: -12 a Advanced Micro Devices M A C H 1 2 0 -1 2 High-Density EE CMOS Programmable Logic DISTINCTIVE CHARACTERISTICS • 68 Pins ■ 48 Outputs ■ 48 Macrocells ■ 48 Flip-flops; 4 clock choices ■ 12nstro ■ 4 PAL blocks ■ 66.7 MHz max external

Contextual Info: Package Dimensions TFBGA 48 Chrontel Package Dimensions BOTTOM VIEW TOP VIEW A1 CORNER 0.08 M C 0.15 M C A B A1 CORNER 0.25 0.35 48X 6 5 4 3 2 1 1 2 3 4 5 6 A B C D E F G H A B C D E F G H D A C 0.20 C F 0.10 C E J I H B 0.15(4X) C G 48 Pin TFBGA Package

M85049

Abstract: MIL-DTL-24308 BACKSHELLS MIL-DTL-24308 cable entry
Contextual Info: Rectangular Backshells AS85049/48-1 Rectangular Backshells Connector Interface MIL-DTL-24308 M85049/48-1-3 F A Basic Part No. C Dash No. E Cable Entry in Shell Finish F = Yellow Chromate over Cadmium F Cable Entry in Shell H G TABLE I A Dash No. 1 2 3 4 5

Contextual Info: CO M ’L: -15/20 M A C H 1 2 0 - 1 5 /2 0 High-Density EE CMOS Programmable Logic a Advanced Micro Devices DISTINCTIVE CHARACTERISTICS 68 Pins • 48 Outputs 48 Macrocells ■ 48 Flip-flops; 4 clock choices ■ 15 ns tPD ■ 4 PAL blocks ■ 50 MHz fMAx external

Contextual Info: TTL DIGITAL. P R O G R A M M A B L E 48 PIN PA C K A G E SERIES PTTS ,_28 _ MAX. 2.55 MAX. T + 7 H- i .40 MAX. I 1 + 16 + 21 + 24 .300 48 + 27 26 25 -+• + 4- 35 34 33 32 + + + + 40 + 2.300 - W hite Dot locates Pin 1

NFC-93-601

Abstract: XS11
Contextual Info: K A /C 3 HC-48/U Q U A R TZ CRYSTAL TEC H NO LO G Y GIViBH A V E C T R O N IN T E R N A T IO N A L C O M P A N Y Quartz Crystal Units AT-Cut, 0.8 - 300 MHz - 1 9.4-— 12 34 — h DIN 45110: K3A IEC 122-3: DN NFC-93-601 n °3A MIL-H-10056: HC-48/U

HPD068PFM-H

Contextual Info: 1 I I _a_ 6 File No. H A - 1 1=1 - H H B H H H H 1=1 A H B 1=1 A 1- I4hlUklUklUkIUI*lUk U a Wa U a Wa i u i U u Ul 48 .80± 3.2 I 189 I SHEET 0~ 1/ 2 SPECIFICATION Contact Current Rating: 1 Amp Insulation R e sistan c:> 50 0 M egaohm s Min. Dielectric Withstanding Voltage:500V AC

P6-33

Contextual Info: TTL DIGITAL. PROGRAMMABLE DELAY LINES 48 PIN PACKAGE 6 BIT SERIES PTTG 2.55 M A X . - f I + -f1 7 + 21 16 + 24 .40 MAX. I 48 + 35 34 40 + 4- -h 33 32 27 26 25 + + + + H- 2 .3 0 0 Vcc Vcc 48 40 P4 35 O P5 m Pi PS VCC 34 33 32 Q O Pi W h it e D o t lo c a t e s P in 1

Contextual Info: SKD 100 ?$[¥ ?$$¥7 ?M$¥ KM V <>> ] SB'+ .%48'. -%4U ? `>> W>> <J>> <`>> ? `>> W>> <J>> <`>> SA. V ^H _NU [XM <>>Y>` [XM <>>Y>W [XM <>>Y<J [XM <>>Y<` <=>> <=>> [XM <>>Y<= Symbol Conditions KM A. V WI _N -48'.)-;/ +%,8 A, V `I _N7 .1, -( <U A, V `I _Na O<H]Y<JI SO<]Y<J>U

JESD-30

Abstract: jedec package MO-220 64 JESD QFN-64 jedec package MO-220 QFN 64 leads MO-220 MO-220 64
Contextual Info: Package Dimensions QFN 64 Chrontel Package Dimensions B A 16 B/2 1 1 16 17 1 7 64 64 Pin 1 A C C/2 32 49 49 33 32 48 48 F 33 E D I G H 64 Pin QFN Package 8 x 8 x 0.8mm Table of Dimensions No. of Leads 64 (8 X 8 mm) MilliMIN meters MAX A 8 B 6.1 6.3 C 6.1

M85049

Abstract: M85049/48 2625C
Contextual Info: MIL-C-24308 D-Subminiature M85049/48-1 Rectangular Strain-Relief Backshells for Unjacketed Wire Bundles M85049/48-1-3 F A Basic Part No. C Dash No. E Cable Entry in Shell Finish F = Yellow Chromate over Cadmium F Cable Entry in Shell H G TABLE I: CONNECTOR INTERFACE, CABLE ENTRY & BACKSHELL DIMENSIONS

M85049/48-1

Contextual Info: MIL-DTL-24308 D-Subminiature M85049/48-1 Rectangular Strain-Relief Backshells for Unjacketed Wire Bundles M85049/48-1-3 F Basic Part No. Dash No. A Finish F = Yellow Chromate over Cadmium C E Cable Entry in Shell F Cable Entry in Shell H G TABLE I: CONNECTOR INTERFACE, CABLE ENTRY & BACKSHELL DIMENSIONS

Contextual Info: FINAL COM’L: -12/15/20 IND: -18/24 a Advanced Micro Devices M A C H 1 2 0 -1 2 / 1 5 /2 0 High-Density EE CMOS Programmable Logic DISTINCTIVE CHARACTERISTICS • 68 Pins ■ 56 Inputs ■ 48 Macrocells ■ 48 Outputs ■ 12 ns tPDCommercial 18 ns tpD Industrial

48-PIN

Contextual Info: 48-PIN PLASTIC TSOP I (12x18) 1 48 detail of lead end Q 24 S 25 N K H D S L R M M B C S I J G A P NOTES 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excIudes mold flash. (Includes mold flash : 12.4 mm MAX.)

PKB4513PINBLC

Contextual Info: Ericsson Internal PRODUCT TABLE OF CONTENTS SPECIFICATION E Prepared also subject responsible if other SEC/S KevinJohan EAB/FAC/P Zhou Hörman Approved PKB 4513 SEC/D [BettyDirect Wu] Converters 1 (1) (4) No. Checked Input 48 V, Output 4 A/48 W 00152-EN/LZT

48-PIN

Contextual Info: 48-PIN PLASTIC TSOP I (12x18) 1 48 detail of lead end S R Q 24 25 P I H A J C S B D L N G M M S K NOTES 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excIudes mold flash. (Includes mold flash : 12.4 mm MAX.)

Contextual Info: 48-PIN PLASTIC DIP 15.24mm(600 48 25 1 24 A K J L I H G F D C N M NOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. M R B ITEM MILLIMETERS

Contextual Info: 48 PIN CERAMIC DIP SEAM WELD (600 mil) 48 25 1 24 A K J I G H L C F B D N R M M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel.

S48GY-50-MJH-3

Contextual Info: 48 PIN PLASTIC TSOP I (12x18) 1 48 detail of lead end S R Q 24 25 P I J H S A G C B L N S D K NOTES 1. Controlling dimension M M ITEM millimeter. 2. Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: 48 PIN CERAMIC SHRINK DIP SEAM WELD (600 mil) 48 25 1 24 A K J I L H C F M D G N M NOTES 1) Each lead centerline is located within 0.18 mm (0.007 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel.