H 48-1-A G Search Results

JESD-30

Abstract: QFN-48 jedec package MO-220 jesd MO-220 qfn 48 C212 b237
Contextual Info: Package Dimensions QFN 48 Chrontel Package Dimensions TOP VIEW BOTTOM VIEW B A 48 37 1 36 B/2 37 F 48 48 A 1 D C C/2 12 13 12 25 25 13 24 24 H E D J G I 48 Pin QFN Package Table of Dimensions No. of Leads 48 7 X 7 mm MilliMIN meters MAX A 7 B 2.25 5.25 C

LQFP-48

Abstract: MS-026D JESD-30
Contextual Info: Package Dimensions LQFP 48 Chrontel with Exposed Pad TOP VIEW BOTTOM VIEW A B K 25 36 24 37 B 48 A K 13 12 1 EXPOSED PAD D C F E .008" I J H G 48 Pin LQFP Exposed Pad Package Table of Dimensions No. of Leads 48 (7 X 7 mm) MilliMIN meters MAX SYMBOL A B C

LQFP-48

Abstract: 015G
Contextual Info: Package Dimensions LQFP 48 Chrontel Package Dimensions A B I 1 A B H D C J LEAD CO-PLANARITY H F G Table of Dimensions No. of Leads 48 7 X 7 mm MilliMIN meters MAX .004 “ A 8.80 9.20 B 7 C 0.50 D 0.17 0.27 SYMBOL E F 1.35 0.05 1.45 0.15 G 1.00 H 0.45 0.75

Contextual Info: COM’L: -12 a Advanced Micro Devices M A C H 1 2 0 -1 2 High-Density EE CMOS Programmable Logic DISTINCTIVE CHARACTERISTICS • 68 Pins ■ 48 Outputs ■ 48 Macrocells ■ 48 Flip-flops; 4 clock choices ■ 12nstro ■ 4 PAL blocks ■ 66.7 MHz max external

Contextual Info: Package Dimensions TFBGA 48 Chrontel Package Dimensions BOTTOM VIEW TOP VIEW A1 CORNER 0.08 M C 0.15 M C A B A1 CORNER 0.25 0.35 48X 6 5 4 3 2 1 1 2 3 4 5 6 A B C D E F G H A B C D E F G H D A C 0.20 C F 0.10 C E J I H B 0.15(4X) C G 48 Pin TFBGA Package

Contextual Info: CO M ’L: -15/20 M A C H 1 2 0 - 1 5 /2 0 High-Density EE CMOS Programmable Logic a Advanced Micro Devices DISTINCTIVE CHARACTERISTICS 68 Pins • 48 Outputs 48 Macrocells ■ 48 Flip-flops; 4 clock choices ■ 15 ns tPD ■ 4 PAL blocks ■ 50 MHz fMAx external

Contextual Info: SKD 100 ?$[¥ ?$$¥7 ?M$¥ KM V <>> ] SB'+ .%48'. -%4U ? `>> W>> <J>> <`>> ? `>> W>> <J>> <`>> SA. V ^H _NU [XM <>>Y>` [XM <>>Y>W [XM <>>Y<J [XM <>>Y<` <=>> <=>> [XM <>>Y<= Symbol Conditions KM A. V WI _N -48'.)-;/ +%,8 A, V `I _N7 .1, -( <U A, V `I _Na O<H]Y<JI SO<]Y<J>U

JESD-30

Abstract: jedec package MO-220 64 JESD QFN-64 jedec package MO-220 QFN 64 leads MO-220 MO-220 64
Contextual Info: Package Dimensions QFN 64 Chrontel Package Dimensions B A 16 B/2 1 1 16 17 1 7 64 64 Pin 1 A C C/2 32 49 49 33 32 48 48 F 33 E D I G H 64 Pin QFN Package 8 x 8 x 0.8mm Table of Dimensions No. of Leads 64 (8 X 8 mm) MilliMIN meters MAX A 8 B 6.1 6.3 C 6.1

Contextual Info: FINAL COM’L: -12/15/20 IND: -18/24 a Advanced Micro Devices M A C H 1 2 0 -1 2 / 1 5 /2 0 High-Density EE CMOS Programmable Logic DISTINCTIVE CHARACTERISTICS • 68 Pins ■ 56 Inputs ■ 48 Macrocells ■ 48 Outputs ■ 12 ns tPDCommercial 18 ns tpD Industrial

PKB4513PINBLC

Contextual Info: Ericsson Internal PRODUCT TABLE OF CONTENTS SPECIFICATION E Prepared also subject responsible if other SEC/S KevinJohan EAB/FAC/P Zhou Hörman Approved PKB 4513 SEC/D [BettyDirect Wu] Converters 1 (1) (4) No. Checked Input 48 V, Output 4 A/48 W 00152-EN/LZT

Contextual Info: 48-PIN PLASTIC DIP 15.24mm(600 48 25 1 24 A K J L I H G F D C N M NOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. M R B ITEM MILLIMETERS

mach 3 family amd

Contextual Info: FINAL COM’L : -12/15/20 IN D :-18/24 a Advanced Micro Devices M A C H 1 2 0 - 1 2 /1 5 /2 0 High-Density EE CMOS Programmable Logic DISTINCTIVE CHARACTERISTICS • 68 Pins ■ 56 Inputs ■ 48 Macrocells ■ 48 Outputs ■ 12 ns tpD Commercial 18 ns tpD Industrial

2258J

Abstract: open LVDS deserialization IP JB 2256
Contextual Info: PRELIMINARY SPECIFICATION > 4 M C SO N E T/SD H /A TM OC-48 1 :8 RECEIVER FEATURES • Micro-power Bipolar technology • Complies with ANSI, Bellcore, and ITU-T specifications • Supports 2.4 Gbps OC-48 • 8-bit LVDS data path • Compact 100 TQFP/TEP package

Contextual Info: 48-PIN PLASTIC SDIP 15.24mm(600 48 25 1 24 A K J L I H G F D C N M NOTES M R B ITEM MILLIMETERS 1. Each lead centerline is located within 0.17 mm of its true position (T.P.) at maximum material condition. A B C 44.46 MAX. 1.78 MAX. 1.778 (T.P.) 2. ltem "K" to center of leads when formed parallel.

Contextual Info: DEVICE SPECIFICATION SO N E T /S D H /A T M OC-48 1:16 RECEIVER FEATURES • Micro-power Bipolar technology • Complies with ANSI, Bellcore, and ITU-T specifications • Supports 2.4 GHz OC-48 • Interface to both LVPECL and TTL logic • 16-bit LVPECL data path

Contextual Info: FINAL COM’L: -15/20 IND:-18/24 S M A C H 1 2 0 - 1 5 / 2 0 High-Density EE CMOS Programmable Logic Advanced Micro Devices DISTINCTIVE CHARACTERISTICS • 68 Pins ■ 56 Inputs ■ 48 Macrocells ■ 48 Outputs ■ 15 ns tpoCommercial 18 ns tpo Industrial

TT 2246

Contextual Info: >4MCC PRELIMINARY SPECIFICATION S O N E T/S D H /A TM O C-48 8:1 TR AN SM ITTER FEATURES GENERAL DESCRIPTION • Micro-power Bipolar technology • Complies with ANSI, Bellcore, and ITU-T specifications • On-chip high-frequency PLL for clock generation • Supports 2.4 GHz OC-48

MT29C4G96MAZBBCJV-48 IT TR

Abstract: M/OC48 M/MT29C4G96MAZBBCJV-48 IT TR
Contextual Info: DEVICE SPECIFICATION w4 M C C S O N E T/S D H /A TM OC-48 16:1 TR AN SM ITTER FEATURES • Micro-power Bipolar supply • Complies with ANSI, Bellcore, and ITU-T specifications • On-chip high-frequency PLL for clock generation • Supports 2.4 GHz OC-48

Contextual Info: SKD 160 SEMIPONT 4 ?$¥Q ?$$Q7 ?N$Q LN X <H> P UB'+ .%48'. -%4W ? ? UA. X <>> ]OW =>> <K>> <^>> <H>> =>> <K>> <^>> <H>> ¥YN <H>Z>= ¥YN <H>Z<K ¥YN <H>Z<^ ¥YN <H>Z<H <=>> <=>> ¥YN <H>Z<= <W Symbol Conditions Values Units LN A. X =J ]O A, X ^J ]OS .1, -( KW

tQFP pitch

Contextual Info: 48-PIN PLASTIC TQFP FINE PITCH (7x7) A B 25 24 36 37 detail of lead end S C D Q 48 R 13 12 1 F G J H I M P K S N S L M NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 9.0±0.2

AB-36

Contextual Info: 48-PIN PLASTIC QFP 10x10 A B 36 25 detail of lead end 24 37 S C D Q 48 R 13 1 12 F J G H I M K P S N S L M NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 12.2±0.4 B 10.0±0.2

Contextual Info: 48-PIN PLASTIC QFP FINE PITCH (7x7) A B 36 37 25 24 detail of lead end S C D Q 48 R 13 12 1 F G J H I M K P S N S L M NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 9.0±0.2

10x14

Contextual Info: 48-PIN PLASTIC QFP 10x14 A B 38 25 39 24 detail of lead end S C D 48 R 15 1 Q 14 F J G H I M P K S N S L M NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 16.8±0.4 B 14.0±0.2

Contextual Info: Datum Id.-Nr. 17.4 ERNI 124095 50 max. 0.6 1 max. 3.7 ±0.2 XXXXXXX 12 date 1 max. 1 25 a 14 b 2 c 7x2= d e f g h 2 24 x 2 = Bestückungsplan 48 - contact layout 1 25 a b c d e f g h = bestückt - assemble Lochbild für Leiterplatte Board hole pattern Bestückungsseite