H/QFN 48 7X7 FOOTPRINT Search Results

BD 4914

Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Contextual Info: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance

1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

JEDEC Drawing MO-220 qfn

Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
Contextual Info: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the

jedec footprint MO-220 VHHD-2

Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Contextual Info: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the

FOOTPRINT MO-229 2X3 SOLDERING

Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level

Temperature sensor DC fan based on PSOC 3 kit

Abstract: "Digital Comparator" I2c cy8c29466-24pxi capacitive touch key sensor cypress MCU 12v and 5v regulated power supply circuit diagram QFN 7X7 32-pin CY8C20236 QFN 48 7x7 footprint qfn 32 5x5 footprint CYPRESS
Contextual Info: CY8C20X36/46/66/96 CapSense Applications Features • 1.71V to 5.5V Operating Range ■ Low Power CapSense Block ❐ Configurable Capacitive Sensing Elements ❐ Supports Combination of CapSense Buttons, Sliders, Touchpads, Touch Screens, and Proximity Sensor

CY8C20236A

Abstract: CY8C20436A CY8C27443A-24PXI CY8C20336A-24LQXI CY8C20646A-24LTXI 32 pins qfn 5x5 footprint CY8C20446A CY8C20236A-24LKXIT CY8C20536A CY8C20336A
Contextual Info: CY8C20X36A/46A/66A/96A CapSense Applications Features • 1.71V to 5.5V Operating Range ■ Low Power CapSense Block ❐ Configurable Capacitive Sensing Elements ❐ Supports Combination of CapSense Buttons, Sliders, Touchpads, Touch Screens, and Proximity Sensor

moving average filter

Contextual Info: CY8C20X36A/46A/66A/96A CapSense Applications Features 1.71 V to 5.5 V operating range Low power CapSense® block ❐ Configurable capacitive sensing elements ❐ Supports combination of CapSense buttons, sliders, touchpads, touchscreens, and proximity sensors

"Digital Comparator"

Abstract: CY8C20236-24LKXIT CY8C20x36 I2c cy8c29466-24pxi
Contextual Info: CY8C20X36/46/66/96 CapSense Applications Features • 1.71V to 5.5V Operating Range ■ Versatile Analog Mux ❐ Common Internal Analog Bus ❐ Simultaneous Connection of I/O ❐ High PSRR Comparator ❐ Low Dropout Voltage Regulator for All Analog Resources

32 pins qfn 5x5 footprint

Abstract: CY8C20236A CY8C20666A RID27
Contextual Info: CY8C20X36A/46A/66A/96A CapSense Applications Features • 1.71V to 5.5V Operating Range ■ Versatile Analog Mux ❐ Common Internal Analog Bus ❐ Simultaneous Connection of I/O ❐ High PSRR Comparator ❐ Low Dropout Voltage Regulator for All Analog Resources

prt0

Contextual Info: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB

SMB137B

Abstract: SMB136 summit SMB136 Camera AF actuator SMB329 smb137 SMB272 SMB273 SMB211 battery charger 48v 10A
Contextual Info: Product Selector Guide Q3/09 New Products from Summit SMB272/SMB273 Provide Low Power Auto-Focus and Shutter Control for Camera Modules SMB211 Single 10A Channel PWM Controller with Integrated Digital Control, drives System Power Savings Summit Expands Range of Battery Chargers with 3 New Products

mlag

Abstract: A NEW GENERATION OF HIGH PERFORMANCE MOSFET DRIVERS FEATURES HIGH CURRENT, HIGH SPEED OUTPUTS
Contextual Info: Shortform Catalog August 2013 Generation Innovation Delivering Innovation Through Te c h n o l o g y f o r t h e D i g i t a l G e n e r a t i o n Shortform Catalog August 2013 2013 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents

Contextual Info: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB

Contextual Info: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features • ■ Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB

Contextual Info: Freescale Semiconductor Product Brief Document Number:KL15PB Rev. 2, 6/2012 KL14/KL15 Product Brief Supports all KL14 and KL15 devices Contents 1 Kinetis L Series 1 Kinetis L The Kinetis L series is the most scalable portfolio of ultra lowpower, mixed-signal ARM Cortex-M0+ MCUs in the

kl15

Contextual Info: Freescale Semiconductor Product Brief Document Number:KL1xPB Rev. 2.1, 10/2012 KL14/KL15 Product Brief Supports all KL14, KL15 devices Contents 1 Kinetis L Series 1 Kinetis L The Kinetis L series is the most scalable portfolio of ultra lowpower, mixed-signal ARM Cortex-M0+ MCUs in the

MKL25Z128VLK4

Abstract: MKL25Z128VLH4 ARM cortex m0 MKL25Z64VFM4 MKL25Z128 MKL24Z64VFM4 KL25 MKL25Z128VFT4 MKL24Z32VFM4 MKL24Z32VLH4
Contextual Info: Freescale Semiconductor Product Brief Document Number:KL25PB Rev. 2, 6/2012 KL24/KL25 Product Brief Supports all KL24 and KL25 devices Contents 1 Kinetis L Series 1 Kinetis L The Kinetis L series is the most scalable portfolio of ultra lowpower, mixed-signal ARM Cortex-M0+ MCUs in the

302831

Abstract: QFN 56 7x7 footprint h/qfn 48 7x7 footprint
Contextual Info: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features • Powerful Harvard-architecture processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0 V to 5.5 V operating voltage without USB

c-2587

Abstract: 32 pins qfn 5x5 footprint 4x4 keypad sample code c language CY8C20236-24LKXIT CY8C20566-24PVXI capacitive touch key sensor cypress MCU touchpad CY8C20236 CY8C24
Contextual Info: CY8C20x36/46/66, CY8C20396 CapSense Applications Features • 1.71V to 5.5V Operating Range ■ Low Power CapSense™ Block ❐ Configurable Capacitive Sensing Elements ❐ Supports Combination of CapSense Buttons, Sliders, Touchpads, Touch Screens, and Proximity Sensor

Contextual Info: Shortform Catalog February 2013 Generation Innovation Delivering Innovation Through Te c h n o l o g y f o r t h e D i g i t a l G e n e r a t i o n Shortform Catalog February 2013 2013 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents

freescale QFN 32 5x5 footprint

Contextual Info: Freescale Semiconductor Product Brief Document Number:MCF51JxQxPB Rev. 4, 03/2013 ColdFire+ Portfolio Product Brief Entry-level, 32-bit, ultra-low power, low cost, small form-factor, fully software- and pin-compatible solutions Contents 1 ColdFire+ Portfolio

QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Contextual Info: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when