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    GSDC165AE

    Abstract: GSDC165GAE
    Contextual Info: GSDC165AE 165-Bump BGA 15 mm x 17 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 165-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—165-Bump FPBGA (Package E)


    Original     		GSDC165AE 165-Bump Dimensions--165-Bump GSDC165GAE GSDC165AE GSDC165GAE PDF