GS88236CD Search Results
GS88236CD Price and Stock
GSI Technology GS88236CD-300SRAM 2.5 or 3.3V 256K x 32 8M |
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GS88236CD-300 |
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GSI Technology GS88236CD-300ISRAM 2.5 or 3.3V 256K x 32 8M |
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GS88236CD-300I |
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GSI Technology GS88236CD-333ISRAM 2.5 or 3.3V 256K x 32 8M |
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GS88236CD-333I |
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GSI Technology GS88236CD-250IVSRAM 1.8/2.5V 256K x 32 8M |
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GS88236CD-250IV |
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GSI Technology GS88236CD-200ISRAM 2.5 or 3.3V 256K x 32 8M |
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GS88236CD-200I |
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GS88236CD Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Preliminary GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36C 165-Bump x18/x36 16are 882VxxC 119-BGA | |
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Contextual Info: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C 119-BGA | |
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Contextual Info: GS88218/36CB/D-xxxI 119- and 165-Bump BGA Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36CB/D-xxxI 165-Bump x18/x36 88218C | |
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Contextual Info: GS88218/36CB-300M GS88218/36CD-300M 119- and 165-Bump BGA Military Temp 300 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB-300M GS88218/36CD-300M 165-Bump x18/x36 882xxC-300M | |
GS88218CB-250
Abstract: GS88236CD-200I GS88236CD
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GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C 119-BGA 165-BGA GS88218CB-250 GS88236CD-200I GS88236CD | |
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Contextual Info: GS88218/36CB/D-xxx 119- and 165-Bump BGA Commercial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36CB/D-xxx 165-Bump x18/x36 88218C | |
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Contextual Info: Preliminary GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36C 165-Bump x18/x36 882VxxC | |
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Contextual Info: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp Features • • • • • • • • • • • • • • • 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs |
Original |
GS88218/36CB/D-333/300/250/200/150 165-Bump 88218C 119-BGA 165-BGA | |
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Contextual Info: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan |
Original |
GS88218/36C 165-Bump x18/x36 power-3/34 882VxxC 119-BGA 165-BGA | |
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Contextual Info: Preliminary GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C | |
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Contextual Info: GS88218/36C B/D -xxxIV 119- and 165-Bump BGA Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan |
Original |
GS88218/36C 165-Bump x18/x36 882VxxC 882xxC | |
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Contextual Info: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan |
Original |
GS88218/36C 165-Bump x18/x36 882VxxC 882xxC | |
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Contextual Info: Preliminary GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36C 165-Bump x18/x36 882VxxC 119-BGA 165-BGA | |
GS88218CB-300MContextual Info: GS88218/36CB-300M GS88218/36CD-300M 119- and 165-Bump BGA Military Temp 300 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB-300M GS88218/36CD-300M 165-Bump x18/x36 882xxC-300M GS88218CB-300M | |
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Contextual Info: Preliminary GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C 119-BGA | |