GS88236CD Search Results
GS88236CD Price and Stock
GSI Technology GS88236CD-150SRAM Chip Sync Quad 2.5V/3.3V 9M-Bit 256K x 36 7.5ns/3.8ns 165-Pin FBGA - Trays (Alt: GS88236CD-150) |
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GS88236CD-150 | Tray | 144 |
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GS88236CD-150 |
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GSI Technology GS88236CD-200ISRAM Chip Sync Quad 2.5V/3.3V 9M-Bit 256K x 36 6.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS88236CD-200I) |
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GS88236CD-200I | Tray | 144 |
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GS88236CD-200I |
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GSI Technology GS88236CD-200IVSRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 6.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS88236CD-200IV) |
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GS88236CD-200IV | Tray | 24 Weeks | 144 |
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GS88236CD-200IV |
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GSI Technology GS88236CD-150IVSRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 7.5ns/3.8ns 165-Pin FBGA Tray - Trays (Alt: GS88236CD-150IV) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS88236CD-150IV | Tray | 24 Weeks | 144 |
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GS88236CD-150IV |
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GSI Technology GS88236CD-250VSRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 5.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS88236CD-250V) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS88236CD-250V | Tray | 24 Weeks | 144 |
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GS88236CD Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Preliminary GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36C 165-Bump x18/x36 16are 882VxxC 119-BGA | |
Contextual Info: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C 119-BGA | |
Contextual Info: GS88218/36CB/D-xxxI 119- and 165-Bump BGA Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36CB/D-xxxI 165-Bump x18/x36 88218C | |
Contextual Info: GS88218/36CB-300M GS88218/36CD-300M 119- and 165-Bump BGA Military Temp 300 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB-300M GS88218/36CD-300M 165-Bump x18/x36 882xxC-300M | |
GS88218CB-250
Abstract: GS88236CD-200I GS88236CD
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Original |
GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C 119-BGA 165-BGA GS88218CB-250 GS88236CD-200I GS88236CD | |
Contextual Info: GS88218/36CB/D-xxx 119- and 165-Bump BGA Commercial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36CB/D-xxx 165-Bump x18/x36 88218C | |
Contextual Info: Preliminary GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36C 165-Bump x18/x36 882VxxC | |
Contextual Info: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp Features • • • • • • • • • • • • • • • 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs |
Original |
GS88218/36CB/D-333/300/250/200/150 165-Bump 88218C 119-BGA 165-BGA | |
Contextual Info: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan |
Original |
GS88218/36C 165-Bump x18/x36 power-3/34 882VxxC 119-BGA 165-BGA | |
Contextual Info: Preliminary GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C | |
Contextual Info: GS88218/36C B/D -xxxIV 119- and 165-Bump BGA Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan |
Original |
GS88218/36C 165-Bump x18/x36 882VxxC 882xxC | |
Contextual Info: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan |
Original |
GS88218/36C 165-Bump x18/x36 882VxxC 882xxC | |
Contextual Info: Preliminary GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable |
Original |
GS88218/36C 165-Bump x18/x36 882VxxC 119-BGA 165-BGA | |
GS88218CB-300MContextual Info: GS88218/36CB-300M GS88218/36CD-300M 119- and 165-Bump BGA Military Temp 300 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB-300M GS88218/36CD-300M 165-Bump x18/x36 882xxC-300M GS88218CB-300M | |
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Contextual Info: Preliminary GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation |
Original |
GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C 119-BGA |