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    GS88236CD Search Results

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    GS88236CD Price and Stock

    GSI Technology

    GSI Technology GS88236CD-150I

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    Avnet Silica GS88236CD-150I 27 Weeks 144
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    GSI Technology GS88236CD-250

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    GSI Technology GS88236CD-200

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    GSI Technology GS88236CD-333

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    GSI Technology GS88236CD-300I

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    GS88236CD Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Preliminary GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable


    Original
    gs88218/36c165-bumpx18/x3616are+2882vxxc119-bga PDF

    Contextual Info: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


    Original
    gs88218/36cb/d-333/300/250/200/150165-bumpx18/x3688218c+1119-bga PDF

    Contextual Info: GS88218/36CB/D-xxxI 119- and 165-Bump BGA Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable


    Original
    gs88218/36cb/d-xxxi165-bumpx18/x3688218c PDF

    Contextual Info: GS88218/36CB-300M GS88218/36CD-300M 119- and 165-Bump BGA Military Temp 300 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation


    Original
    gs88218/36cb-300mgs88218/36cd-300m165-bumpx18/x36+1882xxc-300m PDF

    GS88218CB-250

    Abstract: GS88236CD-200I GS88236CD
    Contextual Info: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


    Original
    gs88218/36cb/d-333/300/250/200/150165-bumpx18/x3688218c+5119-bga165-bgags88218cb-250gs88236cd-200igs88236cd PDF

    Contextual Info: GS88218/36CB/D-xxx 119- and 165-Bump BGA Commercial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable


    Original
    gs88218/36cb/d-xxx165-bumpx18/x3688218c PDF

    Contextual Info: Preliminary GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable


    Original
    gs88218/36c165-bumpx18/x36882vxxc PDF

    Contextual Info: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp Features • • • • • • • • • • • • • • • 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs


    Original
    gs88218/36cb/d-333/300/250/200/150165-bump88218c119-bga+1165-bga PDF

    Contextual Info: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original
    gs88218/36c165-bumpx18/x36power-3/34+3882vxxc119-bga165-bga PDF

    Contextual Info: Preliminary GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


    Original
    gs88218/36cb/d-333/300/250/200/150165-bumpx18/x3688218c PDF

    Contextual Info: GS88218/36C B/D -xxxIV 119- and 165-Bump BGA Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original
    gs88218/36c165-bumpx18/x36882vxxc+1882xxc PDF

    Contextual Info: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original
    gs88218/36c165-bumpx18/x36882vxxc+1882xxc PDF

    Contextual Info: Preliminary GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable


    Original
    gs88218/36c165-bumpx18/x36882vxxc+2119-bga165-bga PDF

    GS88218CB-300M

    Contextual Info: GS88218/36CB-300M GS88218/36CD-300M 119- and 165-Bump BGA Military Temp 300 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation


    Original
    gs88218/36cb-300mgs88218/36cd-300m165-bumpx18/x36+2882xxc-300mgs88218cb-300m PDF

    Contextual Info: Preliminary GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


    Original
    gs88218/36cb/d-333/300/250/200/150165-bumpx18/x3688218c+1119-bga PDF