GS864236B Search Results

Contextual Info: Preliminary GS864236B-250M 250 MHz 3.3 V and 2.5 V VDD 3.3 V and 2.5 V I/O 2M x 36 72Mb Sync Burst SRAM 119-Bump BGA Military Temp Base datasheet: GS864236B Product s covered in this document: GS864236B-250M Product specification(s) addressed by this document:

GS864218GB-167

Abstract: GS864218
Contextual Info: Preliminary GS864218 B /GS864236(B)/GS864272(C) 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs 119- & 209-Pin BGA Commercial Temp Industrial Temp Features 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O either linear or interleave order with the Linear Burst Order (LBO)

GS864236B

Abstract: GS864272C-167V GS864218B-167V GS864218B-200V GS864218B-250V GS864
Contextual Info: GS864218/36/72 B/C -xxxV 119- & 209-Pin BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: Product Preview GS864218 B /GS864236(B)/GS864272(C) 4M x 18, 2M x 36, 1M x 72 36Mb S/DCD Sync Burst SRAMs 119- & 209-Pin BGA Commercial Temp Industrial Temp Features 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O either linear or interleave order with the Linear Burst Order (LBO)

GS864218GB-167I

Contextual Info: GS864218 B /GS864236(B)/GS864272(C) 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs 119- & 209-Pin BGA Commercial Temp Industrial Temp Features 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O either linear or interleave order with the Linear Burst Order (LBO)

GS864218

Contextual Info: Product Preview GS864218 B/E /GS864236(B/E)/GS864272(C) 4M x 18, 2M x 36, 1M x 72 36Mb S/DCD Sync Burst SRAMs 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Flow Through/Pipeline Reads

Contextual Info: Preliminary GS864218/36/72 B/C -xxxV 119- & 209-Pin BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

Contextual Info: Product Preview GS864218 B/F /GS864236(B/F)/GS864272(C) 4M x 18, 2M x 36, 1M x 72 36Mb S/DCD Sync Burst SRAMs 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O either linear or interleave order with the Linear Burst Order (LBO)

GS864218B-167V

Abstract: GS864218B-200V GS864218B-250V
Contextual Info: Preliminary GS864218/36/72 B/C -xxxV 119- & 209-Pin BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

GS864236B-250M

Contextual Info: GS864218/36B-250M GS864272C-250M 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs 119- & 209-Pin BGA Military Temp Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

GS864218

Abstract: GS864218GB-167
Contextual Info: GS864218 B /GS864236(B)/GS864272(C) 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs 119- & 209-Pin BGA Commercial Temp Industrial Temp Features 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O either linear or interleave order with the Linear Burst Order (LBO)

mcl 31

Abstract: GS864218B-167V GS864218B-200V GS864218B-250V
Contextual Info: Preliminary GS864218/36/72 B/C -xxxV 119- & 209-Pin BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

Contextual Info: GS864218/36/72 B/C -xxxV 119- & 209-Pin BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: Product Preview GS864218 B /GS864236(B)/GS864272(C) 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs 119- & 209-Pin BGA Commercial Temp Industrial Temp Features 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O either linear or interleave order with the Linear Burst Order (LBO)

Contextual Info: GS864218/36B-250M GS864272C-250M 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs 119- & 209-Pin BGA Military Temp Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable