GS816032 Search Results

GS816036DGT-150I

Abstract: GS816036DGT GS816036d GS816018DGT-250
Contextual Info: GS816018/32/36DGT-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

Contextual Info: Preliminary GS816018/32/36DGT-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation

Contextual Info: Preliminary GS816018/32/36T-250/225/200/166/150/133 1M x 18, 512K x 32, 512K x 36 16Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation

Contextual Info: GS8160xxBT-xxxV 100-Pin TQFP Commercial Temp Industrial Temp 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation

1H08S

Abstract: PI6C2405A-1HW ASM706CUA SOIC-6 microchip ADM809RAR ADM705AN MAX809SEUR T ASM5P2309-1H-16-S K7N163601B MAX810JEUR
Contextual Info: Supervisors Cross Reference Guide Alliance Maxim/Dallas IMP ASM1232LP DS1232LPS-2 IMP1232LP ASM1232LPCMA DS1232LP IMP1232LPCMA ASM1232LPEMA DS1232LP IMP1232LPEMA ASM1232LPN DS1232LP IMP1232LPN Analog Devices Micrel Microchip MIC1232N TC1232CPA - - - - - -

gs816036bgt-150

Abstract: gs816036bgt250 GS816018B GS816018BT-150 GS816018BT-200 GS816018BT-250 GS816032B GS816036B gs816032bgt-150i GS816
Contextual Info: GS816018/32/36BT-250/200/150 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation • 2.5 V or 3.3 V +10%/–10% core power supply

GS82032A

Abstract: GS84018A MPC7410 MPC7450 MPC750 MPC755 RM5271 RM7065 intel L2 cache burst length 832KX8
Contextual Info: High Speed Memory Technology for Cache Applications Introduction Many processors today use a high speed cache to accelerate memory access. A level 2 or level 3 cache connected on a backside bus can take advantage of high SRAM bandwidth in providing low latency data access. Today’s performance-oriented applications require

GS816032AT-200I

Contextual Info: Preliminary GS816018/32/36AT-300/275/250/225/200 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • 1.8 V or 2.5 V +10%/–10% core power supply

GS816018AT-200

Abstract: GS816018AT-250 GS816018AT-300
Contextual Info: Preliminary GS816018/32/36AT-300/250/200/150 100-Pin TQFP Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation

K7A803609B-PC25

Abstract: K7A403600B-PC16 K7I161882B-EC16 K6R4016V1D-TC08 K7A403600M-QC16 K7I161882B-EC30 K6R4008V1C-JC12 K6R4016V1D-UC10 K6R1008V1C-JC10 K7R643682M-FC20
Contextual Info: SAMSUNG # - Connect pin 14 FT pin to Vss * - Tie down extra four I/Os with resistor K6R1016V1C-FC10 K6R1016V1C-FC12 K6R1016V1C-FC15 K6R1016V1C-FC20 K6R1016V1C-JC10 K6R1016V1C-JC12 K6R1016V1C-JC15 K6R1016V1C-JC20 K6R1016V1C-TC10 K6R1016V1C-TC12 K6R1016V1C-TC15

ADM809RAR

Abstract: AS7C256A hsbga 416 lcd cross reference IDT CYPRESS CROSS REFERENCE clocks DS1232* watch dog timer Product Selector Guide mbg* sot143 FS781 IDT74SSTV16857
Contextual Info: DISCLAIMER Alliance Semiconductor Corporation reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply the best possible product. Alliance Semiconductor does not assume any responsibility for use of any circuitry described other than the circuitry embodied

IS61LF51232-8

Abstract: IS61LV25616AL-8TL IS61LF51232 IS61LV5128L-10T GS71116AU-10E 167ML IS61NLP25636A-200TQL IS61QDB22M36 IS61LPS51236-150B IS61LV5128L-12T
Contextual Info: ISSI * - Tie down extra four I/Os with resistor + - Tie down extra two I/Os with resistor # - Connect pin 14 FT pin to Vss IS61DDB22M36-167M3 IS61DDB22M36-167M3L IS61DDB22M36-167ML IS61DDB22M36-200M IS61DDB22M36-200M3 IS61DDB22M36-200M3L IS61DDB22M36-200ML

GS816018AT-300

Contextual Info: Preliminary GS816018/32/36AT-300/275/250/225/200 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • 1.8 V or 2.5 V +10%/–10% core power supply

GS816018BT-150V

Abstract: GS816018BT-200V GS816018BT-250V
Contextual Info: Preliminary GS8160xxBT-xxxV 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation • 1.8 V or 2.5 V core power supply

GS816018

Abstract: GS816018T-250 GS816032 GS816036 DQB 213
Contextual Info: GS816018/32/36T-250/225/200/166/150/133 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation

Contextual Info: GS816018/32/36DGT-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

GS816018BGT-200

Abstract: GS816018BT-150V GS816018BT-200V GS816018BT-250V GS816018BGT-200V
Contextual Info: GS8160xxBT-xxxV 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation • 1.8 V or 2.5 V core power supply

GS816036BGT150I

Abstract: gs816036bt
Contextual Info: Preliminary GS816018/32/36BT-300/250/200/150 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation

Contextual Info: Preliminary GS816018/32/36DGT-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features cycles can be initiated with either ADSP or ADSC inputs. In

Contextual Info: GS816018/32/36T-250/225/200/166/150/133 100-Pin TQFP Commercial Temp Industrial Temp 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features Burst mode, subsequent burst addresses are generated internally and are controlled by ADV. The burst address

MT58L512L18PS-7.5

Abstract: MT58L256L18D1T-10 MT58L256L32PF-10 MT55V512V36PT-7.5 GS8162Z36BB-200 GS816032BT-150 MT55L512Y36PF-7.5 MT55L256L36FT-10 MT58L256L36FS-10 MT58L64L32PT-7.5
Contextual Info: MICRON * - Tie down extra four I/Os with resistor + - Tie down extra two I/Os with resistor # - Connect pin 14 FT pin to Vss MT55L128V32P1B-6 MT55L128V32P1B-7.5 MT55L128V32P1T-10 MT55L128V32P1T-6 MT55L128V32P1T-7.5 MT55L128V36F1B-10 MT55L128V36F1B-11 MT55L128V36F1B-12

AN1007

Abstract: DSP56652 GSI cross GS71024 GS73024 DSP56300 DSP56600 DSP56690 ADSP-2100 ADSP2106
Contextual Info: AN1007 APPLICATION NOTE Pushing Your DSP to the Limit with GSI Technology SRAMs A broad range of digital signal processor applications in the telecommunications infrastructure feature large signal-processing tasks and require the very highest computational performance. New server

GS816018BT-150V

Abstract: GS816018BT-200V GS816018BT-250V
Contextual Info: Preliminary GS8160xxBT-xxxV 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation • 1.8 V or 2.5 V core power supply

Contextual Info: GS816018/32/36DGT-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline