TIA-607-B
Abstract: split bolt copper bond wire HTWC250-2-1 SA-GRSP11 SA-GRSP04 TIA bonding HTAP RGCBNJ660PY GPL15
Contextual Info: StructuredGround Access Floor Grounding Clamps S P E C I F I C AT I O N S H E E T specifications Related Products The mesh common bonding network MCBN (a.k.a. Mesh-BN) shall be installed beneath the access floor. The MCBN shall be constructed of a minimum of #6 AWG bare copper class B
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grsp11sa-grsp11sa-grsp04tia-607-b+7split boltcopper bond wirehtwc250-2-1tia bondinghtaprgcbnj660pygpl15
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