GOLD METAL DETECTOR Search Results

photodiode demodulation

Abstract: gold metal detectors gold detectors circuit bond wire gold fiber optic detector fibre optic laser ceramic package PDB-C122
Contextual Info: PHOTONIC Silicon Photodiode, Blue Enhanced Photoconductive Monitor Photodiode Type PDB-C122 DETECTORS INC. PACKAGE DIMENSIONS INCH [mm] GOLD METAL THIS SIDE CL .040 [1.02] ACTIVE AREA CL .030 [0.76] .060 [1.52] ANODE METALIZATION TOP VIEW CATHODE METALIZATION

Contextual Info: PHOTONIC Silicon Photodiode, Blue Enhanced Photoconductive Monitor Photodiode Type PDB-C122 DETECTORS INC. PACKAGE DIMENSIONS INCH [mm] GOLD METAL THIS SIDE CL .040 [1.02] ACTIVE AREA C L .030 [0.76] .060 [1.52] ANODE METALIZATION TOP VIEW CATHODE METALIZATION

avr 102

Contextual Info: BEAM LEAD SCHOTTKY DIODES FOR MIXERS AND DETECTORS 1-26 GHZ HSCH-5300 SERIES Features PLATINUM TRI-METAL SYSTEM High Temperature Stability * CATHODE / 130(6) ICO (4) SILICON NITRIDE PASSIVATION Stable, Reliable Performance <jU1 _U LCAUil GOLD LEADS t Zir-piTO

Contextual Info: MADS-011010-1419 Schottky Zero Bias Detector Diode Chip Absolute Maximum Ratings 1,2 Features P-Type Schottky Diode Can be used Without External DC Bias Large Bondable Contact RoHs Compliant Available in Chip Form ODS-1419 Can be Mounted with Solder or Conductive Epoxy.

AD9686BH

Abstract: AD9686TQ AD9686 AD9686BQ AD9686TE AD9686TH Q-16
Contextual Info: High-Speed TTL Voltage Comparator ANALOG DEVICES □ AD9686 AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages + 5 .0 V APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors

AD9686

Abstract: AD9686BH AD9686BQ AD9686TE AD9686TH AD9686TQ Q-16
Contextual Info: High-Speed TTL Voltage Comparator ANALOG DEVICES □ AD9686 AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages + 5 .0 V APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors

LED810-PD010_40D52

Abstract: IR LED 810 nm
Contextual Info: LED810/PD010-40D52 metal can sealed PD monitoring high power LED LED810/PD010-40D52 consists of a GaAlAs LED 810 nm and a Si-PD mounted onTO-18 stem hermetically sealed with a glass flat can, and is designed to monitor reflected light through detector for controlling its

LED890-PD010_40D52

Contextual Info: LED890/PD010-40D52 metal can sealed PD monitoring high power LED LED890/PD010-40D52 consists of a GaAlAs LED 890nm and a Si-PD mounted onTO-18 stem hermetically sealed with a glass flat can, and is designed to monitor reflected light through detector for controlling its

cdb7619

Contextual Info: DATA SHEET Silicon Schottky Barrier Diodes: Packaged, Bondable Chips and Beam Leads Applications • Detectors  Mixers Features  Available in both P-type and N-type low barrier designs  Low 1/f noise  Large bond pad chip design  Planar passivated beam-lead and chip construction

diode RL 207

Abstract: gold metal detectors gold detector circuit free x band diode detector waveguide CDB7620-207 ka-band mixer DDB2503-250 DDB2504-000 DDB2504-230 DDB2265-000
Contextual Info: DATA SHEET Silicon Schottky Barrier Diodes: Packaged, Bondable Chips and Beam Leads Applications x Detectors Features x Available in both P-type and N-type low barrier silicon x Low 1/f noise x Bonded junctions for reliability x Planar passivated beam-lead and chip construction

Contextual Info: epitex Φ5 STEM LED/PD Opto-Device & Custom LED L830/PD010-40D52 metal can sealed PD monitering high power LED L830/PD010-40D52 consists of a GaAlAs LED 830nm and a Si-PD mounted onTO-18 stem hermeticaly sealed with a glass flat can, and is designed to moniter reflected light through detector for

Contextual Info: epitex Opto-Device & Custom LED L810/PD010-40D52 Φ5 STEM LED/PD metal can sealed PD monitering high power LED L810/PD010-40D52 consists of a GaAlAs LED 810nm and a Si-PD mounted onTO-18 stem hermeticaly sealed with a glass flat can, and is designed to moniter reflected light through detector for

TB478

Abstract: IPC-A610A
Contextual Info: PCB Assembly Guidelines for Shell-Op 3D Package Technical Brief Introduction The Shell-Op 3D package is a cavity package that utilizes a glass lid and is attached to the board via a solder ball array. The glass lid allows the detector on the die surface to sense blue

Scans-051

Abstract: AD9686TH
Contextual Info: High-Speed TTLVoltage Comparator AD9686 ANALOG DEVICES □ AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors

311 comparator pin diagram

Abstract: 9685BH AD9687BD AD9685
Contextual Info: ANALOG DEVICES □ High-Speed Comparators AD9685/AD9687 FEATURES AD9685/AD9687 FUNCTIONAL BLOCK DIAGRAMS 2.7ns Propagation Delay 0.5ns Latch Setup Time 90dB CMRR + 5V, -5 .2 V Supply Voltages APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors

gold metal detectors

Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

Alumina ceramic AI203

Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Contextual Info: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

solid solubility

Abstract: chemical control process block diagram
Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

Ultrasonic Cleaning Transducer

Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
Contextual Info: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family

gold metal detectors

Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Contextual Info: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of

CDB7619-000

Abstract: CDE7618-000 Silicon Detector Diodes
Contextual Info: EBA lpha Silicon Schottky Barrier Detector Diodes Features Both P-Type and N-Type Low Barrier Silicon Available Low 1/f Noise Bonded Junctions for Reliability Planar Passivated Beam-Lead and Chip Construction See Also Zero Bias Silicon Schottky Barrier Detector Diodes

LED780-PD010-40D52

Contextual Info: LED780-PD010-40D52 v 1.1 19.09.2014 LED780-PD010-40D52 consists of a GaAlAs LED 780 nm and a Si-PD mounted onTO-18 stem hermetically sealed with a glass flat can, and is designed to monitor reflected light through detector for controlling its own output power.

33e10

Contextual Info: I REVISIONS DESCRIPTION 0 INITIAL RELEASE 1 CHANGES PER DCN 4 0 3 2 2 1 DATE REV 10/10/02 11/1B/02 APPROVED WR/OFC HY/OFG 2X .156 1.002 DIA THRU ^ PIN NO. A DESIGNATION COLOR SLEEVE 1 THERMISTOR YELLOW 2 DETECTOR CATHODE - WHITE 3 DETECTDR ANDDE (+) GREEN

gold detector circuit free

Abstract: gold metal detectors metal detector schematic gold detectors circuit CDB7619-000 gold detector circuit drawing free circuits metal detector Surface Mount RF Schottky Barrier Diodes metal detector CDC7630-000
Contextual Info: Applications • Mixer and detector Features • Low capacitance for usage beyond 40 GHz • ZBD and low barrier designs • P-type and N-type junctions • Large bond pad chip design • Chip products are Skyworks Green Silicon Schottky Diodes Skyworks broad product portfolio includes Schottky diodes as packaged and bondable