GOLD BOOK Search Results

SZZA031

Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
Contextual Info: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)

ZPD 5.1 ITT

Abstract: ZPD ITT diode zener ZD 88 germanium BYY32 germanium transistor CJ 4148 ZENER BAW21 ITT ZPD 11 itt germanium diode
Contextual Info: General Information Germanium Gold Bonded Diodes Silicon Diodes Silicon Capacitance Diodes Silicon Diode Switches PIN Diodes Silicon Zener Diodes and Temperature Compensated Stabilizing Circuits Silicon Stabilizer Diodes Light Emitting Diodes Silicon Rectifiers

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

MC9S08QB8

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

MC9S08SH8, instructions set

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

98ASA00474D

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

MC9S08SH8/4

Abstract: MC9S08QB8
Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

mc9s08sh

Abstract: MC9S08SH8
Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

MC9S08SH8/4

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

MC9S08SH8/4

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

MC9S08SH8/4

Abstract: MC9S08JM60 c code example
Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

MC9S08SH8/4

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

p6103

Abstract: LT1201 regulator LT1190 arcing spice model LT1201 spark gap capacitors 1.5kv 262LYF-0092K Betatherm 15K capacitive pick up spark plug LT1028
Contextual Info: LINEAR TECHNOLOGY OCTOBER 1992 IN THIS ISSUE . . . COVER ARTICLE Design Techniques for Electrostatic Discharge Protection. 1 Sean Gold Editor's Page . 2 Richard Markell DESIGN FEATURES LT1190 Family Ultra-High-Speed Op Amps Eclipse Prior Art

KTY 10-5

Abstract: Q62705-K111 KTY 10-7 Q62705-K110 KTY 10-6 temperature DEPENDENT RESISTOR Q62705-K331 KTY 10 k132 Q62705-K71
Contextual Info: Silicon Spreading Resistance Temperature Sensor in Leaded Plastic Package KT 100 KTY 10 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Small plastic package • Fast response • High reliability due to multilayer gold contacts

KTY 10-6

Abstract: KTY10 KTY temperature sensor 10-62 Q62705-K110 temperature DEPENDENT RESISTOR Q62705-K331 KTY10 Siemens
Contextual Info: SIEMENS Silicon Spreading Resistance Temperature Leaded Plastic Package lorin K T 100 KTY10 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Small plastic package • Fast response • High reliability due to multilayer gold contacts

KTY 10-8

Abstract: KTY 10-6 KTY 10-62 KTY 10-7 KTY10 Q62705-K107 Siemens KTY K111 KTY temperature sensor KTY 5
Contextual Info: SIEMENS KTY10 Spreading Resistance Silicon Temperature Sensor • • • • • Small plastic package Fast response High reliability due to m ultilayer gold contacts n-conducting silicon crystal Polarity independent due to symmetrical construction Type Marking

Contextual Info: SIEMENS K TY16-6 Spreading Resistance Silicon Temperature Sensor • • • • • Small metal housing with leadwires Fast response High reliability due to multilayer gold contacts n-conducting silicon crystal Polarity independent due to symmetrical construction

KTY 20-5

Abstract: KTY 20-6 Q62705-K255 KTY temperature sensor KTY20 kty s
Contextual Info: SIEM ENS K TY20 Spreading Resistance Silicon Temperature Sensor • • • • • Small plastic package Fast response High reliability due to m ultilayer gold contacts n-conducting silicon crystal Polarity independent due to symmetrical construction Type

DICLAD522T

Abstract: NEL2001 NEL2004 NEL2012 NEL2035 NEL2035F03-24 V06C ZO 189 transistor
Contextual Info: DATA SHEET SILICON POWER TRANSISTOR NEL2035F03-24 NPN SILICON EPITAXIAL TRANSISTOR L Band Power Amplifier OUTLINE DIMENSIONS Unit: mm 2.8 ±0.2 NEL2035F03-24 of NPN epitaxial microwave power transistors 2 It incorporates emitter ballast resistors, gold metallizations and

temperature DEPENDENT RESISTOR

Abstract: Q62705-K128 KTY 16-6 KTY 10
Contextual Info: Silicon Spreading Resistance Temperature Sensor in Miniature Metal Housing KTY 16-6 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Small metal housing with insulated leadwires • Fast response • High reliability due to multilayer gold contacts