GES12 Search Results
GES12 Datasheets (3)
Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
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GES-12-083 | Humidity Sensors | Non-refresh type humidity sensor made of polymer with transmitter. | Original | 252.04KB | 2 | ||
GES-12-095 |
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Single and Multi-Port Modular Jack Assemblies | Original | 127.17KB | 21 | ||
GES-12-095 |
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1K 5.0V CMOS SERIAL EEPROM | Original | 134.8KB | 8 |
GES12 Price and Stock
Amphenol ProLabs SFP-GE-S120K-CZTE SFP-GE-S120K Compatible TAA |
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SFP-GE-S120K-C | 1 |
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ATGBICS SFP-GE-S120K-CCompatible SFP 1000Mb |
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SFP-GE-S120K-C | 1 |
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Amphenol Corporation SFP-GE-S120K-CFiber Optic Transmitters, Receivers, Transceivers ZTE SFP-GE-S120K Compatible TAA 1000Base-ZX SFP Transceiver (SMF, 1550nm, 120km, LC, DOM) |
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SFP-GE-S120K-C |
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Amphenol Positronic RD15M10GES-1023.5D-Sub Standard Connectors |
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RD15M10GES-1023.5 |
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Amphenol Positronic RD25M10GES-1023.5D-Sub Standard Connectors |
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RD25M10GES-1023.5 |
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GES12 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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71299-120CAContextual Info: CardBus I Eject Header Series Product Description FCI’s CardBus I Eject headers feature a “modular design” in either a single-deck or double-deck configuration. This unique CardBus series has an innovative design that utilizes a vertical transition board on the header that simply plugs into a surface |
Original |
32-bit) 125Vrms 100-position 71299-120CA | |
Inductor 3005
Abstract: e3005 IEC-603-7
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Original |
GES-12-090 E-3005 GES-01-001 V00465 Inductor 3005 e3005 IEC-603-7 | |
LR-735
Abstract: BGA Solder Ball collapse reflow soldering profile BGA of Ball grid array
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Original |
GES-12-100 LR-735 BGA Solder Ball collapse reflow soldering profile BGA of Ball grid array | |
Contextual Info: Minitek Unshrouded Straight Headers 2,00 mm • High temperature plastic ■ Selective plating Technical Data Mating Data Physical Operating Temperature ■ Minitek™ ctw contacts and housings Housing: High-temperature, black thermoplastic Flammability rating: UL 94 V-0 |
Original |
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74239
Abstract: USB RECEPTACLE TYPE B 8 PIN SMT 74032 74612 USB RECEPTACLE TYPE A 8 PIN SMT 74923 GES-12-095
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12Mbps. 74239 USB RECEPTACLE TYPE B 8 PIN SMT 74032 74612 USB RECEPTACLE TYPE A 8 PIN SMT 74923 GES-12-095 | |
Contextual Info: Minitek Shrouded Straight Headers 2,00 mm • New 4-wall design prevents mis-mating ■ Selective plating Technical Data Mating Data Physical Operating Temperature ■ Minitek™ ctw contacts and housings Housing: High temperature, cream-colored thermoplastic |
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Contextual Info: r PRODUCT SEE NO TABLE . ? r 2 .0 0 [0 .0 7 9 ] 2X t $ ; s . » t i. «i f a U I8 1* US IU i t s hi t 2.0[0.08] TYP * ¡i ill ? X IL ♦is* 2.6 2 [0 .1 0 3 ] 2X 6.56[0.258] 2X i i * fi $ i V IE W I I n Ii |? 5 I I >. g Z +» U t S3 M * I f f B = B A -A .4 0 [0 .0 1 6] |
OCR Scan |
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modular jack RJ45 8P8C
Abstract: FCI berg housing AMP modular plug RJ45 RJ45 berg fci berg
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RJ45-style GES-12-083 modular jack RJ45 8P8C FCI berg housing AMP modular plug RJ45 RJ45 berg fci berg | |
dvi-i connector
Abstract: DVI-D cable dvi-d connector 30 pins LCD FUJITSU flat cable connector 18 pos Receptacle DVI-D Single-Link FCI Framatome Group right angle 20 pin pcb connector Transition minimized differential signaling
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24-position, 29-position, 18-position 24-position dvi-i connector DVI-D cable dvi-d connector 30 pins LCD FUJITSU flat cable connector 18 pos Receptacle DVI-D Single-Link FCI Framatome Group right angle 20 pin pcb connector Transition minimized differential signaling | |
2mm pitch BERG connector
Abstract: LR46923 berg electronics
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OCR Scan |
93235-XYZ GES-12-002 0Q023Rb 2mm pitch BERG connector LR46923 berg electronics | |
2mm pitch BERG connector
Abstract: BERG Electronics TA-941 88947 20 pin berg PCB connector 88945-X02 2mm pitch BERG 88947-X02 MT-510 ta94
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OCR Scan |
88945-X02 GES-12-002 TA-941 00G23T4 2mm pitch BERG connector BERG Electronics TA-941 88947 20 pin berg PCB connector 2mm pitch BERG 88947-X02 MT-510 ta94 | |
Contextual Info: DDR DIMM Socket 210 Position Product Description FCI’s 210 position DDR Double Data Rate DIMM socket offers convenient add-on memory expansion for use with SDRAM (Synchronous DRAM) modules for DDR Applications. It is a vertical connector having 210 contacts on 1.0 mm (0.039 in.) centerlines. The |
Original |
GES-12-146 MO-215 | |
Contextual Info: S IM M C onnectors V e rtic a l and Low P ro file 1.27 mm 0.050 in. Features • Low insertion force for easy m odule engagement. ■ ■ High tem perature plastic. ■ Standoffs fo r PCB cleaning. 1.27mm (0.050 in.) centerline product, single row. ■ Vertical, 25° and 40° incline low -profile |
OCR Scan |
100SM11 | |
Contextual Info: PCB Mounted Receptacles 2.00 x 2.00 mm 0.079 x 0.079 in. Description Bottom-Entry, Surface-Mount Part Number 91596 Without Locating Post 0 .9 7 mm <0.038 in .) •DIM B 0 .9 6 mm _ <0.038 in .) ■DIM A - - D IM A 2 .2 5 m m T Y P (0 .0 8 9 in .) i n n n i |
OCR Scan |
GES-12-008 00023b4 | |
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Contextual Info: High Density Headers 1.00 mm .039" FCI basics u Various header heights + standard • ■ ■ ■ receptacle = Choice of 4.15 mm, 4.50 mm, 5.00 mm, 5.50 mm, 6.00 mm, or 7.00 mm mated heights Blade-on-beam contacts are not susceptible to “peeling” damage |
OCR Scan |
1-888-499-4FCI | |
BERG 1.27mm
Abstract: BERG CONNECTOR BERG STRIP BERG Electronics BERG strip connector MIL-F-55110 berg MIL-F-14256 GES-12-146 DDR socket Qualification Test Report
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210P/184P GES-12-146 E-3005 BERG 1.27mm BERG CONNECTOR BERG STRIP BERG Electronics BERG strip connector MIL-F-55110 berg MIL-F-14256 GES-12-146 DDR socket Qualification Test Report | |
Contextual Info: Minitek Unshrouded Right Angle Headers 2,00 mm • High temperature plastic ■ Selective plating Technical Data Mating Data Physical Operating Temperature ■ Minitek™ ctw contacts and housings Housing: High-temperature, black thermoplastic Flammability rating: UL 94 V-0 |
Original |
E66906 LR46923 DPS-12-01Processing | |
RJ45 Jack low profile with led
Abstract: 5566-4 RJ45 jack low profile RJ45 modular jack
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Original |
55664-X8YZ GES-12-083 RJ45 Jack low profile with led 5566-4 RJ45 jack low profile RJ45 modular jack | |
Contextual Info: PCB-Mounted Receptacle Assemblies 2.00 mm 0.079 in. Description 4 Row Versions Shown 12.44 mm 11.95 mm. 6.00 mm (0.236 in.) 1.3 mm _J (0.445 in.) NOTE: 5 Row height dimension is 13.30 mm (0.524 in.) 0.40 mm (0.016 in.) 4 X 2 POSITION 4.00 mm h (0.157 in.)"" |
OCR Scan |
GES-12-002 | |
Contextual Info: PCB-Mounted Receptacle Assemblies 2.00 mm 0.079 in. Description 4 Row Versions Shown 3.00 mm (0.118 in.) DIM A -D IM B~ 1.00 mm (0.039 in.) 4 X 6 POSITION d- c 33EEEEE 11.30 1 b aEEEEE { n A A S mm in . a (0-445 in.) I I NOTE: 5 Row height dim ension is |
OCR Scan |
33EEEEE GES-12-002 | |
Contextual Info: SIMM Connectors Plastic Latch Low Profile Description Plastic Latch, 40° Low Profile, Single Row 1.27mm 0.050 in. Centerline Refer to Page 7-20 for SIMM P.C. Board Layout Recommended P.C, f Hate Sizes for PeiP Left 2.44 mm 0.096 in. Center Right 2.03 mm |
OCR Scan |
GES-12-055 3005mi 0D22flâ | |
Contextual Info: PCB-Mounted Receptacle Assemblies 2.00 mm 0.079 in. Description 4 Row Versions Shown 3 .0 0 mm (0 .1 1 8 in.) SET BACK FOR P R E S S -B L O C K 4 .0 0 mm (0 .1 5 7 in.) RECOMMENDED PC BOARD HOLE PATTERN (COMPONENT SIDE) 9 .3 0 m m j (0 .3 6 6 in.) ; 3 .0 8 mm |
OCR Scan |
88949X02 89096-X02 GES-12-002 TA-941 T00S411 | |
Contextual Info: SIMM Connectors Plastic Latch Vertical Description Plastic Latch, Vertical, Single Row 1.27mm 0.050 in. Centerline Refer to Page 7-20 for SIMM P.C. Board Layout " X -J DIM "A" DIM "A ’ Recom m ended P.C. Board Hole S izes for Pegs DIM "B Left 2.03 mm 0.080 in. |
OCR Scan |
GES-12-055 3005mi 0D22flâ | |
Contextual Info: PCB-Mounted Receptacle Assemblies 2.00 mm 0.079 in. Description 4 Row Versions Shown 4 .0 0 m m (0 .1 5 7 in.)f , 1.00 m m (0 .0 3 9 in.) 4 .00 m m (0 .1 5 7 in.) SET BACK FOR ~ PRESS-BLOCK 4 .0 0 m m (0 .1 5 7 in.) RECOMMENDED PC BOARD HOLE PATTERN (COMPONENT SIDE) |
OCR Scan |
GES-12-002 TA-941 |