FREE ABSTRACT FOR ATM Search Results

ic shelf life

Abstract: J-STD-002 J-STD-002B B827 SZZA002 IPC EIA J-STD-001 J-STD-001 SZZA046 um43a
Contextual Info: Application Report SZZA046 - June 2004 Shelf-Life Evaluation of Lead-Free Component Finishes Douglas W. Romm, Donald C. Abbott, and Bernhard Lange ABSTRACT The integrated circuit IC industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

Signal Path Designer

Contextual Info: SN74GTLP1394 2-BIT LVTTL-TO-GTLP ADJUSTABLE-EDGE-RATE BUS TRANSCEIVER WITH SPLIT LVTTL PORT, FEEDBACK PATH, AND SELECTABLE POLARITY www.ti.com SCES286F – OCTOBER 1999 – REVISED APRIL 2005 FEATURES • • • • • • RGY PACKAGE TOP VIEW D, DGV, OR PW PACKAGE

Signal Path Designer

Contextual Info: SN74GTLP21395 TWO 1-BIT LVTTL-TO-GTLP ADJUSTABLE-EDGE-RATE BUS TRANSCEIVERS WITH SPLIT LVTTL PORT, FEEDBACK PATH, AND SELECTABLE POLARITY SCES350C – JUNE 2001 – REVISED NOVEMBER 2001 D D D D D D D D D D D D D TI-OPC Circuitry Limits Ringing on Unevenly Loaded Backplanes

Signal Path Designer

Abstract: 5V 5 point RELAY
Contextual Info: SN74GTLP1395 TWO 1-BIT LVTTL-TO-GTLP ADJUSTABLE-EDGE-RATE BUS TRANSCEIVERS WITH SPLIT LVTTL PORT, FEEDBACK PATH, AND SELECTABLE POLARITY SCES349C – JUNE 2001 – REVISED NOVEMBER 2001 D D D D D D D D D D D D TI-OPC Circuitry Limits Ringing on Unevenly Loaded Backplanes

ABSTRACT FOR "Local Interconnect Network"

Abstract: ATM25 BC6911 CRC-10 CRC-32 intel sram ATM management SYSTEM abstract network processor instruction set processor intel intel network controller
Contextual Info: Service-Specific Network Processor Product Bulletin APPLICATIONS • ■ ■ ■ Service-Specific Network Processor DSL or Cable Modem DSL Bridge/Router DSL Access Multiplexer Residential Gateway FEATURES Service-Specific Network Processor Stacks ■ Provisions PPP and ATM over DSL digital subscriber

TMS320C24xx

Abstract: TMS320C6XXX PC BIOS Source code Implementation on TMS320C54xx FIR filter data addressing modes of TMS320C54xx digital TMS320C6700 dsp algorithms using tms320c50 G729 TMS320 TMS320C30
Contextual Info: TMS320 DSP Algorithm Standard Rules and Guidelines Literature Number: SPRU352D January 2001 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest

DSP TMS320C64X

Abstract: TMS32C6414EGLZA6E3 C6416 teb "EZ-USB"
Contextual Info: TMS320C6414T, TMS320C6415T, TMS320C6416T FIXEDĆPOINT DIGITAL SIGNAL PROCESSORS SPRS226 − NOVEMBER 2003 D D D D D Signal Processors DSPs − 1.67-, 1.39-, 1-ns Instruction Cycle Time − 600-, 720-MHz, 1-GHz Clock Rate − Eight 32-Bit Instructions/Cycle

spru580c

Abstract: 5973 diode TMS32C6414EGLZA6E3 C6416 teb
Contextual Info: TMS320C6414, TMS320C6415, TMS320C6416 FIXEDĆPOINT DIGITAL SIGNAL PROCESSORS SPRS146J − FEBRUARY 2001 − REVISED NOVEMBER 2003 D D D D D Signal Processors DSPs − 2-, 1.67-, 1.39-ns Instruction Cycle Time − 500-, 600-, 720-MHz Clock Rate − Eight 32-Bit Instructions/Cycle

APP2696

Abstract: DS3150 DS3151 DS3152 DS3153 DS3154 "Power Splitter"
Contextual Info: Maxim > App Notes > TELECOM Keywords: redundancy protection, T3/E3/STS-1 network interface, line interface unit, LIU, T3, E3, STS-1, network interface Sep 16, 2003 APPLICATION NOTE 2696 Redundancy Protection for T3/E3/STS-1 Networks Abstract: Reliability yields itself to profitability. This is a strong theme that is considered when designing any

atmel basicUSB

Abstract: atm6124ser BasicUSB usb atmel hid demo ORG00001 6083B-12 atm6124
Contextual Info: Basic USB Application Scope The Universal Serial Bus USB has been successfully implemented in most PC systems and is replacing the older parallel and serial ports. For a standard serial port, communications are performed directly by the application running on the computer. In

Contextual Info: BONDING AND BRAZING TECHNOLOGIES FOR POWER ELECTRONIC COOLING – WHEN AND WHY Author: Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY ITALY Abstract: Bonding is a joint obtained with a special designed thermal epoxy resin: performance and characteristic. Brazing is a pure metallic joint obtained at high temperature: performance and characteristic.

AN-161

Contextual Info: FOUR-PORT ADAPTER CARD FOR SWITCH/SERVER APPLICATIONS APPLICATION NOTE AN-161 Integrated Device Technology, Inc. BY Dan Morris ABSTRACT: This paper describes a low cost switch / server PC adapter card design for a 25.6Mb/s/s ATM local work group. When used with the 77903 NIC card, a very low cost ATM network

eeprom programmer schematic easy design universal

Abstract: eeprom programmer schematic diagram spi flash programmer schematic infineon XE166 spi eeprom flash programmer schematic memtool 0x8408 memtool c166 family AP16095 M25P80
Contextual Info: Application Note, V1.0, October 2007 AP16128 XE166 Family Programming the on-chip Flash using the SSC Bootstrap Loader Microcontrollers Edition 2007-10 Published by Infineon Technologies AG 81726 Munich, Germany 2007 Infineon Technologies AG. All Rights Reserved.

telephone conversation broadcasting system

Abstract: AC97 AT75C AT75C310 G723 G729A slic voip 1999 ARM7TDMI Peripherals
Contextual Info: Integrated Circuit and Software Architecture for an Internet Appliance White Paper R is the registered trademark of Atmel Corporation, 2325 Orchard Parkway, San Jose, CA 95131 Rev. 1741A–03/01 Abstract A single-chip solution for Internet appliances requires a combination of performance and

dsl modem

Abstract: DSLAM setup ADSL2 DSLAM chipset DSLAM configuration dsl 101 2 DSLAM card
Contextual Info: White Paper Using FPGA-Based Channel Bonding for HDTV Over DSL Abstract This white paper examines the market opportunities for channel bonding technology and the threat from fiber-based networks and protocol details of the channel bonding process, as well as describing the architecture of a DSLAM

Cu6Sn5

Abstract: FeNi42 Infineon diffusion solder smema smema specifications transistor k81 leadframe materials olin 7025
Contextual Info: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics Abstract Electroplated tin layers as used as lead-free solderable finish on the terminations of semiconductor devices are

leadframe Cu C194

Abstract: ALLOY leadframe C7025 ALLOY leadframe C7025 material property SEM 2004 SEM 2006 leadframe C7025 SO044 electronics nasa study of alloy C194
Contextual Info: Matte Tin Sn Plating Of Semiconductor Devices – Whisker Growth Study Anocha Sriyarunya Spansion (Thailand) Limited Pakkerd, Nonthaburi, Thailand Dhiraj Bansal Spansion LLC (US) Sunnyvale, CA, USA Abstract In the industry’s drive towards becoming lead free (Pb-free) by July 1, 2006, as dictated by the WEEE Directive, several Pbfree terminal finishes have been proposed and evaluated. Some of them were rejected as soon as evaluations began. Others

FeNi42

Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
Contextual Info: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.

Contextual Info: Infrared Temperature Measurement Theory and Application ABSTRACT emission absorption Infrared thermometers for non-contact temperature measurement are highly developed sensors which have wide-spread application in industrial processing and research. This paper

et024006dhu

Abstract: AVR32709 et024006 EVK1105 8085 projects dac interfacing with 8085 microcontroller interfacing sram memory with 8085 playlist AT32UC3A0512 AT32UC3
Contextual Info: AVR32709: AVR32 UC3 Audio Decoder Over USB Features • • • • Software MP3 Decoder FAT File System Music played over USB USB Host mass storage class Standalone - Low Memory Footprint (Code & RAM) and no Operating System dependency • Audio output over I2S using SSC controller or internal Audio Bitstream DAC

MC9S12DG256

Abstract: burr brown SRC abstract of Colpitts oscillator COMPOD12 HC12 HCS12 LQFP112 BDM12 FT232BM cable mc9s12dg256 analog to digital
Contextual Info: S12compact HardwareVersion 1.10 User Manual May 23 2003 S12compact Copyright C 2002,2003 by MCT Elektronikladen GbR Hohe Str. 9-13, D-04107 Leipzig Phone: +49-(0)341-2118354 Fax: +49-(0)341-2118355 Email: mct@elektronikladen.de Web: http://www.elektronikladen.de/mct

CA2600

Abstract: 601B AN1027 CA2200 overlay transistor metallization
Contextual Info: Order this document by AN1027/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1027 RELIABILITY/PERFORMANCE ASPECTS OF CATV AMPLIFIER DESIGN Prepared by: Michael D. McCombs “Reliability is the probability of a device performing its purpose adequately for the period of time

Contextual Info: 1 N ICStAR O verview The IDT77201 NICStAR PCI ATM Controller is a member of IDT's family of products for Asynchronous Transfer Mode ATM networks. The NICStAR performs both the ATM Adaptation Layer (AAL) Segmentation and Reassem­ bly (SAR) function and the ATM layer protocol functions.