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    FR4 SUBSTRATE WITH 0.762MM THICKNESS Search Results

    FR4 SUBSTRATE WITH 0.762MM THICKNESS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    LBAA0QB1SJ-295
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    GRJ43QR7LV154KW01L
    Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors with Soft Termination for General Purpose PDF
    GRJ43QR7LV154KW01K
    Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors with Soft Termination for General Purpose PDF

    FR4 SUBSTRATE WITH 0.762MM THICKNESS Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SF-BGA316B-B-11

    Abstract: BGA316 FR4 substrate with 0.762mm thickness
    Contextual Info: D Package Code: BGA316B C 0.635mm See BGA pattern code to the right for actual pattern layout Y .0225" dia. tooling holes X2 non plated (optional) 0.762mm 0.025" dia. pad X Top View (reference only) 24.13mm 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


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    BGA316B 635mm 762mm FR4/G10 SF-BGA316B-B-11 BGA316 FR4 substrate with 0.762mm thickness PDF

    FR4 substrate with 0.762mm thickness

    Abstract: BGA400F SF-BGA400F-B-11
    Contextual Info: D Package Code: BGA400F C 0.635mm See BGA pattern code to the right for actual pattern layout Y 0.762mm 0.025" dia. pad X 24.13mm Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.635mm 5.33mm 3.74mm [0.147"] [0.210"] .0225" dia. tooling holes (X2)


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    BGA400F 635mm 762mm FR4/G10 SF-BGA400F-B-11 FR4 substrate with 0.762mm thickness BGA400F PDF

    SF-BGA300A-B-11

    Abstract: land pattern BGA 0,50
    Contextual Info: D Package Code: BGA300A C .0225" dia. tooling holes X2 non plated (optional) See BGA pattern code to the right for actual pattern layout Y 0.025" dia. pad X 24.13mm Top View (reference only) 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.635mm 5.33mm 3.74mm [0.147"]


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    BGA300A 635mm 762mm FR4/G10 20X20 SF-BGA300A-B-11 land pattern BGA 0,50 PDF

    bga244

    Abstract: 19X19 SF-BGA244A-B-11
    Contextual Info: D Package Code: BGA244A .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm 0.025" dia. pad Top View (reference only) 2 0.36mm [0.014"] dia. 0.762mm 5.33mm 3.74mm [0.147"]


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    BGA244A 914mm 533mm 762mm 508mm FR4/G10 SF-BGA244A-B-11 bga244 19X19 PDF

    19X19

    Abstract: SF-BGA240E-B-11 land pattern BGA 0,50
    Contextual Info: D Package Code: BGA240E .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm Top View (reference only) 0.025" dia. pad 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


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    BGA240E 914mm 533mm 762mm 508mm FR4/G10 SF-BGA240E-B-11 19X19 land pattern BGA 0,50 PDF