FR4 GLASS EPOXY Search Results

Contextual Info: AT-BUS Prototyping Board Stock No. RE 429 EP - Epoxy fibre-glass reinforced laminated FR4 1.50 mm double-sided 35 |jm CU - Plated through-holes HP = FR2 - Phenolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel duro a base de résina fenölica EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido

from TSOP Type II

Contextual Info: Multiadapter - SMD TSOP I/II RE900 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil); 0.50 mm (19.7 mil); 0.65 mm (26.5 mil); 0.80 mm (30 mil); 1.27 mm (50 mil)

Contextual Info: Multiadapters RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Adapter TSOP I RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

gerber

Contextual Info: Adapter TSOP II RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

160mm

Contextual Info: Prototyping Boards Dual Inline RE2011-LF - Epoxy fibre-glass FR4 1.5 mm, without CU - hole matrix 2.54 mm - 38 x 61 holes with hole dia 1.00 mm - size 100 x 160 mm

gerber

Contextual Info: Adapter TSOP I RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-06 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 1.27 mm (50 mil) - Pins: 20, 24, 26, 28, 32 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Adapter TSOP I RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Adapter TSOP I RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE931-05PI - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 28 - size 13.0 x 23.5 mm

TRANSISTOR C 608

Abstract: f AG19 610-AG22 FR4 GLASS EPOXY 608-AG21 AG10 TRANSISTOR CATALOGUE AG21 AG19
Contextual Info: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 Catalogue 1654741 Adapters Revised 1-04 Transistor Adapter Plugs 600-AG Series 608-AG22 FEATURES: PERFORMANCE SPECIFICATIONS: The 600-AG family of FR4 glass epoxy machined pin adaptors, converts

Contextual Info: Multiadapters RE932-01PI - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 1,27 mm (153 mil) - pins: 8 - size 20.50 x 8.00 mm

RE932-04PI

Contextual Info: Multiadapters RE932-04PI - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 1,27 mm (153 mil) - pins: 18 - size 20.50 x 13.50 mm

Contextual Info: Multiadapters RE932-03PI - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 1,27 mm (153 mil) - pins: 14 - size 20.50 x 13.50 mm

Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability

Contextual Info: Prototyping Board RE520-LF - EPOXY fibre-glass FR4 1.5 mm single-sided 35 µm CU - hot air leveling HAL-leadfree - 38 continuous strips with 61 borings - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm

Contextual Info: RE500-LF Prototyping Board - EPOXY fibre-glass FR4 1.5 mm single-sided 35 µm CU - hot air leveling HAL-leadfree - 39 continuous strips with 61 borings hole spacing 2.50 x 2.50 mm hole dia 1.0 mm size 100 x 160 mm

Contextual Info: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability

Contextual Info: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX152 BGA 1.27 mm grid, Interconnect pin solder tail SERIES 550 Interconnect pin, through hole solder tail TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life