RE900 Search Results
RE900 Price and Stock
TE Connectivity RE900007TE Connectivity |
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RE900007 |
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Roth Elecronik GmbH RE900Board: universal; double sided,multiadapter; W: 72.6mm; L: 76.2mm |
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RE900 | 43 | 1 |
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Roth Elecronik GmbH RE900-03Board: universal; double sided,multiadapter; W: 72.6mm; L: 76.2mm |
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RE900-03 | 3 | 1 |
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Roth Elecronik GmbH RE900-01Board: universal; multiadapter; W: 12mm; L: 18mm |
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RE900-01 | 1 |
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Roth Elecronik GmbH RE900-02Board: universal; multiadapter; W: 12mm; L: 20mm |
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RE900-02 | 1 |
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RE900 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Multiadapters RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-05 | |
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Contextual Info: Multiadapters RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-02 | |
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Contextual Info: Multiadapters RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-04 | |
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Contextual Info: 2002-05-13 PRODUKTINFORMATION Vi reserverar oss mot fel samt förbehåller oss rätten till ändringar utan föregående meddelande ELFA artikelnr 48-329-52 Labbkort RE900 EP |
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re900 | |
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Contextual Info: Adapter TSOP I RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-04 | |
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Contextual Info: Multiadapters RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-03 | |
bajoContextual Info: Multiadaptador SMD-TSOP I/II RE900 - epóxido FR4 1,50 mm, por dos lados 35 µm CU pth - Lado de soldadura y de componetes con una superficie quimica de níquel/oro (Ni/Au) y una mascára de inhibidora dela soldadura - distancia entre las zonas terminales: |
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re900re900-01re900-02re900-03+4 | |
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Contextual Info: Adapter TSOP II RE900-06 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 1.27 mm (50 mil) - Pins: 20, 24, 26, 28, 32 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-06 | |
gerberContextual Info: Adapter TSOP II RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-05gerber | |
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Contextual Info: SERIES 9000 EQUIPMENT Aeronautical and Maritime Radiocommunication Systems VHF DATA RADIO COMMUNICATION SYSTEMS EM9000 | RE9000 EM9000 TRANSMITTER Wide band 118-136.975 MHz Output power up to 50 W for AM and D8PSK Compliant New Mask for D8PSK, |
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em9000re9000bns9008pgm9000+4 | |
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Contextual Info: Multiadapters RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-01 | |
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Contextual Info: Adapter TSOP I RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-03 | |
RE900-02Contextual Info: Multiadaptateur pour CMS TSOP I/II RE900 - fibre de verre FR4 époxyde 1,50 mm, double face 35 µm CU entièrement metallisées - côte soudure et composants avec une surface de nickel/d´or chimique (Ni/Au) et pourvus d`un masque d´arrêt de soudure - distances entre les terminales: |
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re900re90019re900-01re900-02+4 | |
gerberContextual Info: Adapter TSOP I RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-02gerber | |
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from TSOP Type IIContextual Info: Multiadapter - SMD TSOP I/II RE900 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil); 0.50 mm (19.7 mil); 0.65 mm (26.5 mil); 0.80 mm (30 mil); 1.27 mm (50 mil) |
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re900re900-01re900-02re900-03+4 | |
RE900Contextual Info: SMD-TSOP I/II Multiadapter RE900 - Epoxyd FR4 1,50 mm, zweiseitig 35 µm CU durchkontaktiert - Löt- und Komponentenseite mit einer Oberfläche aus chem. Nickel/Gold (NI/AU) sowie Lötstopmaske - Pitch Abstände: 0,40 mm (15.7 mil); 0,50 mm (19.7 mil) 0,65 mm (26.5 mil); 0,80 mm (30 mil); 1,27 mm (50 mil) |
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re900re900-01re900-02re900-03+3 | |
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Contextual Info: Adapter TSOP I RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of |
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re900-01 | |
Sony RM-X4S service manual
Abstract: rm-x4s sony rm-x4s ic901 Sony RM X4S woofer amp circuit diagram schematic diagram RM-X4S 5.1 sub woofer amp BA3918 RM-X4S Service Manual
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xr-c8220xr-c9100mg-25d-136ba3918+12 | |
enamelled copper wire swg table
Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
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element-14127mm210x297mm420x297mm+11 | |