FR4 EPOXY DIELECTRIC Search Results

Contextual Info: Epoxy glass cloth base laminated FR4 5.10 RATING ,5 .9 0 ^ °10 DATE CODE EPOXY SEAL « mm CO a d a d co MM MM TT TT 0.76+.o.oo 0.76+gi1 - 0.00 5.08 10.16 14.35 P.C. MOUNTING 6 .0 5 _ ▲ ID csi SWITCH FUNCTION + 3 POS. 1 T2 Model No. 1 01.09 & POS. 2 4

Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability

Contextual Info: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability

Contextual Info: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX152 BGA 1.27 mm grid, Interconnect pin solder tail SERIES 550 Interconnect pin, through hole solder tail TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life

TRANSISTOR C 608

Abstract: f AG19 610-AG22 FR4 GLASS EPOXY 608-AG21 AG10 TRANSISTOR CATALOGUE AG21 AG19
Contextual Info: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 Catalogue 1654741 Adapters Revised 1-04 Transistor Adapter Plugs 600-AG Series 608-AG22 FEATURES: PERFORMANCE SPECIFICATIONS: The 600-AG family of FR4 glass epoxy machined pin adaptors, converts

Contextual Info: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX104 BGA 1.27 mm grid, Interconnect pin surface mount SERIES 558 Interconnect pin, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life

Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX105 PGA 1.27 mm grid socket, Solder tail SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, solder tail. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O

Contextual Info: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life

Contextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)

Preci-Dip

Contextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)

loss tangent of FR4

Contextual Info: Plain Copper Clad Boards 500 Series Product Description We offer 1/16", 1/32" and 1/64" FR4 laminate with 1 ounce copper per square foot. This flame retardant laminate is translucent in color and made of continuous woven glass cloth impregnated with epoxy resin. The copper on 1

FR4 epoxy dielectric constant 4.4

Abstract: loss tangent of FR4
Contextual Info: Copper Clad Boards 500 Series We offer 1/16", 1/32" and 1/64" FR4 laminate with 1 ounce copper per square foot. This flame retardant laminate is translucent in color and made of continuou woven glass cloth impregnated with epoxy resin. The copper on 1 ounce boards is 1.34mil thick 0.0341mm

Contextual Info: A I V I F * Catalog 1307612 Adapters Revised 7-01 T ran s isto r A d ap ter Plugs 600-AG Series 608-AG22 FEATURES: PERFORMANCE SPECIFICATIONS: The 600-AG family of FR4 glass epoxy machined pin adaptors, converts standard 6 thru 10 lead round style transistor packages to standard 14 and

FR4 epoxy dielectric constant 4.4

Abstract: FR4 substrate epoxy dielectric constant 4.4 Rogers 4350B Nelco 4000-13 FR4 epoxy dielectric constant 3.2 FR4 substrate with dielectric constant 4.4 Rogers 4350B substrate Nelco-4000 FR4 substrate fiberglass n6000-21-si
Contextual Info: PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing Application Note 528 May 2008, v1.0 Introduction As data rates increase, designers are increasingly moving away from wide parallel buses to serial buses with differential signaling. Differential

DOD-A-82720

Abstract: FR4 epoxy dielectric constant 4.2 DP-190 DP-100 Plus DP270 DP460 DP-420 3M DP100
Contextual Info: 0362220 Epoxy-Hotmelt 3/30/04 11:29 AM Page 1 High-performance adhesives for demanding electronics applications. With the ever-increasing sophistication of electronics, you need the most dependable and versatile methods for their fabrication and assembly. 3M Scotch-Weld epoxies and Jet-melt

Schaffner load dump generator

Abstract: Schaffner NSG uA 7805 FR4 substrate board aluminium profile data book electronique marking code E2 SMD diode LDP24M
Contextual Info: LDP24M  TRANSILTM LOAD DUMP PROTECTION FEATURES TRANSIENT VOLTAGE SUPPRESSOR DIODE ESPECIALLY DESIGNED FOR LOAD DUMP EFFECT PROTECTION HIGH SURGE CURRENT CAPABILITY : 30 A / 40 ms EXPONENTIAL WAVE COMPLIANT WITH MAIN STANDARDS SUCH AS: -ISO / DTR 7637 -SAEJ 1113A .

tip 35c circuit

Abstract: DA108S1 LCP1511D TLP140M TLP200M TLP270M schematic diagram "induction heating"
Contextual Info: TLPxxM Series  Application Specific Discretes A.S.D. TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE MAIN APPLICATIONS Any sensitive telecom equipment requiring protection against lightning : Analog and ISDN line cards Main Distribution Frames Set-top boxes

FR4 1.6mm substrate

Abstract: Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton
Contextual Info: Optimizing PCB Thermal Performance for Cree XLamp® LEDs Table of Contents 1. Introduction. 2 2. Thermal Management Principles. 2

schaffner heatsink

Contextual Info: RBO40-40M  REVERSEDBATTERYAND Application Specific Discretes A.S.D.TM OVERVOLTAGEPROTECTIONCIRCUIT RBO FEATURES PROTECTION AGAINST ”LOAD DUMP” PULSE 40A DIODE TO GUARD AGAINST BATTERY REVERSAL MONOLITHIC STRUCTURE FOR GREATER RELIABILITY BREAKDOWN VOLTAGE : 24 V min.

st microelectronics powerso-10 marking

Abstract: TLPxxG DA108S1 LCP1511D TLP140M VDE0433 VDE0878 B1000-5
Contextual Info: TLPxxM/G/G-1 TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE Application Specific Discretes A.S.D. MAIN APPLICATIONS Any sensitive telecom equipment requiring protection against lightning : Analog and ISDN line cards Main Distribution Frames GND TIP

RBO08-40G

Abstract: RBO08-40T RBO08-40M VF13 aluminium plane heatsink
Contextual Info: RBO08-40G/M/T  REVERSED BATTERY AND Application Specific Discretes A.S.D.TM OVERVOLTAGE PROTECTION CIRCUIT RBO FEATURES 8A DIODE TO GUARD AGAINST BATTERY REVERSAL. NEGATIVE OVERVOLTAGE PROTECTION BY CLAMPING. COMPLIANT WITH ISO/DTR 7637 STANDARD FOR PULSES 1, 2, 3a and 3b.

tip 149

Abstract: SO10 package st microelectronics powerso-10 st microelectronics powerso-10 marking tip 143 DA108S1 LCP1511D TLP140M VDE0433 VDE0878
Contextual Info: TLPxxM/G/G-1  TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE Application Specific Discretes A.S.D. MAIN APPLICATIONS Any sensitive telecom equipment requiring protection against lightning : Analog and ISDN line cards Main Distribution Frames GND TIP

diode ir31

Abstract: TRANSIL RBO08-40G transil diode equivalent transistor marking code SGs IR31 RBO08-40M RBO08-40T VF13
Contextual Info: RBO08-40G/M/T  REVERSEDBATTERYAND Application Specific Discretes A.S.D.TM OVERVOLTAGEPROTECTIONCIRCUIT RBO FEATURES 8A DIODE TO GUARD AGAINST BATTERY REVERSAL. NEGATIVE OVERVOLTAGE PROTECTION BY CLAMPING. COMPLIANT WITH ISO/DTR 7637 STANDARD FOR PULSES 1, 2, 3a and 3b.

Contextual Info: 3 Bonding Film AF111 for Electronics Applications Technical Data Product Description March, 2004 3M Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials epoxy and phenolic .