FR4 EPOXY Search Results

Contextual Info: AT-BUS Prototyping Board Stock No. RE 429 EP - Epoxy fibre-glass reinforced laminated FR4 1.50 mm double-sided 35 |jm CU - Plated through-holes HP = FR2 - Phenolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel duro a base de résina fenölica EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido

from TSOP Type II

Contextual Info: Multiadapter - SMD TSOP I/II RE900 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil); 0.50 mm (19.7 mil); 0.65 mm (26.5 mil); 0.80 mm (30 mil); 1.27 mm (50 mil)

Contextual Info: Adapter TSOP I RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

gerber

Contextual Info: Adapter TSOP II RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

gerber

Contextual Info: Adapter TSOP I RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-06 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 1.27 mm (50 mil) - Pins: 20, 24, 26, 28, 32 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Adapter TSOP I RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Adapter TSOP I RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Adapter TSOP II RE900-06 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 1.27 mm (50 mil) - Pins: 20, 24, 26, 28, 32 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Laborkarte RE520-LF - Epoxyd FR4 1,5 mm, einseitig 35 µm CU - heißverzinnt HAL-leadfree - 38 Leiterbahnen mit 61 Bohrungen - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm

Contextual Info: Multiadapter RE1040 - Epoxydglashartgewebe FR4 0,80 mm einseitig 35 µm CU<br><br>- 12 selbstklebende Kontaktleisten im pitch 0,80 mm<br>- vorgeritzte Sollbruchstellen<br>- Oberfläche aus chem. Au<br><br> - Größe 90 x 100 mm

Contextual Info: Multiadapter RE1030 - Epoxydglashartgewebe FR4 0,80 mm einseitig 35 µm CU<br><br>- 12 selbstklebende Kontaktleisten im pitch 1,00 mm<br>- vorgeritzte Sollbruchstellen<br>- Oberfläche aus chem. Au<br><br> - Größe 90 x 100 mm

Contextual Info: Multiadapter RE1070 - Epoxydglashartgewebe FR4 0,80 mm einseitig 35 µm CU<br><br>- 12 selbstklebende Kontaktleisten im pitch 0,50 mm<br>- vorgeritzte Sollbruchstellen<br>- Oberfläche aus chem. Au<br><br> - Größe 90 x 100 mm

Contextual Info: Multiadapters RE460-08 - Epoxy FR4 1.50 mm, two-sided 35 µm CU through plated - Chem. AU and solder resist mask - Hole diameter 1.00 mm - Adaption circuit board for QFP 20 (1.27 mm) - Size 23,00 x 23,00 mm

Contextual Info: Multiadapters RE460-07 - Epoxy FR4 1.50 mm, two-sided 35 µm CU through plated - Chem. AU and solder resist mask - Hole diameter 1.00 mm - Adaption circuit board for QFP 18 (1.27 mm) - Size 23,00 x 23,00 mm

Contextual Info: Multiadapter RE1050 - Epoxydglashartgewebe FR4 0,80 mm einseitig 35 µm CU<br><br>- 12 selbstklebende Kontaktleisten im pitch 0,65 mm<br>- vorgeritzte Sollbruchstellen<br>- Oberfläche aus chem. Au<br><br> - Größe 90 x 100 mm

Contextual Info: Multiadapter RE1080 - Epoxydglashartgewebe FR4 0,80 mm einseitig 35 µm CU<br><br>- 12 selbstklebende Kontaktleisten im pitch 0,40 mm<br>- vorgeritzte Sollbruchstellen<br>- Oberfläche aus chem. Au<br><br> - Größe 90 x 100 mm

Contextual Info: Multiadapter RE1010 - Epoxydglashartgewebe FR4 0,80 mm einseitig 35 µm CU<br><br>- 12 selbstklebende Kontaktleisten im pitch 2,54 mm<br>- vorgeritzte Sollbruchstellen<br>- Oberfläche aus chem. Au<br><br> - Größe 90 x 100 mm

Contextual Info: DS = doppelseitig / double-sided / double face / de dos lados EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epôxido a base de résina fenolica HP = FR2 - Phenolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel dura