FR 4 SUBSTRATE Search Results

Contextual Info: Integrated Device Technology, Inc. IDT7MP4060 IDT7MP4095 128K x 32 CMOS STATIC RAM MODULES FEATURES: DESCRIPTION: • High density 4 megabit static RAM modules The IDT7M P4095/7M P4060 are 128K x 32 static RAM modules constructed on an epoxy laminate FR-4 substrate

3M DP100

Abstract: Oakite E61941
Contextual Info: 3 Scotch-Weld TM Epoxy Adhesive DP100 FR Technical Data July, 2011 Product Description 3M Scotch-Weld™ Epoxy Adhesive DP100 FR is a two-part flame retardant self-extinguishing version of Scotch-Weld DP100. It meets the UL94 V-O Burn Test requirements and has a work life of 4-8 minutes after mixing. It is ideal for

DP100

Abstract: 1876-61T Oakite 3M DP100 oils bulk modulus DP100FR ASTM D 2240 800-362
Contextual Info: 3 Scotch-Weld TM Epoxy Adhesive DP100 FR Technical Data July, 2011 Product Description 3M Scotch-Weld™ Epoxy Adhesive DP100 FR is a two-part flame retardant self-extinguishing version of Scotch-Weld DP100. It meets the UL94 V-O Burn Test requirements and has a work life of 4-8 minutes after mixing. It is ideal for

Contextual Info: 1M x 32 CMOS STATIC RAM MODULE PRELIMINARY IDT7MP4104 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High density 4 megabyte static RAM module The IDT7MP4104 is a 1M x 32 static RAM module con­ structed on an epoxy laminate FR-4 substrate using 8 1M x

IDT7MB4048

Abstract: 7MB4048
Contextual Info:  IDT7MB4048 512K x 8 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 4-megabit 512K x 8 Static RAM module • Fast access time: 25ns (max.) Surface mounted plastic packages on a 32-pin, 600 mil FR-4 DIP substrate

V2658

Abstract: p4008
Contextual Info: 512K x 8 CMOS STATIC RAM MODULE IDT7MP4008S Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 4 megabit C M O S static RAM module • Fast access times — 30ns max. • Cost effective plastic surface mount RAM packages on a epoxy laminate (FR-4) substrate

Contextual Info: DPS64X16P □ Dense-Pac Microsystems, Inc. 0_ 64K X 16 CMOS CM SRAM MODULE PRELIMINARY DESCRIPTION: The DPS64X16P is a 64K X 16 high-speed, low-power static RAM module comprised of four 64K X 4 monolithic SRAM's, and decoupling capacitors surface mounted on a FR-4 substrate.

Contextual Info: 4 Megabit CMOS SRAM DENSE-PAC DPS128X32XP/XHP MICROSYSTEMS DESCRIPTION: The DPS128X32XP/XHP is a 68-pin surface mount module consisting of four 128K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with either "J"-Leads or

Contextual Info: IDT7MB4048 512K x 8 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 4-megabit 512K x 8 Static RAM module The IDT7MB4048 Is a 4-megabit (512K x 8) Static RAM module constructed on a multilayer epoxy laminate (FR-4)

2mb 72-pin simm

Abstract: fr 3709 27A3
Contextual Info:  IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 512K x 8 Static RAMs in plastic packages. The availability of

Contextual Info: 2M x 32 CMOS STATIC RAM MODULE PRELIMINARY IDT7MP4130 Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4130 is a 2M x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 16 1M x 4 Static RAMs in plastic packages. Availability of four chip

fr 3709 z

Contextual Info: IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 512K x 8 Static RAMs in plastic packages. The availability of

JESD22-A113-A

Abstract: JESD22A113-A RM05-6A JESD22-A113A MEDER rm05 6AS4 bga reflow
Contextual Info: RM Series MEDER electronic RF Reed Relay Module 4 input / 2 output DESCRIPTION The RM05-4A-S-4/2 and RM05-2A2B-S-4/2 are low-profile 4 input / 2 output Relay Modules with an FR-4 substrate and rugged thermoset epoxy overmold. Capable of switching beyond 3 GHz with <40ps rise times, this Relay Module switches into the billions of operations. High temperature solder terminations

JESD22A113-A

Abstract: MEDER rm05 JEDEC wave 166 relay JESD22-A113-A
Contextual Info: RM Series MEDER electronic RF Reed Relay Module 4 input / 2 output DESCRIPTION The RM05-4A-S-4/2 and RM05-2A2B-S-4/2 are low-profile 4 input / 2 output Relay Modules with an FR-4 substrate and rugged thermoset epoxy overmold. Capable of switching beyond 3 GHz with <40ps rise times, this Relay Module switches into the billions of operations. High temperature solder terminations

fr 3709

Abstract: fr 3709 z 3709
Contextual Info: IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE FEATURES DESCRIPTION • • • • The IDT7MP4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 512K x 8 Static RAMs in plastic packages. The availability of four chip select lines provides byte access.

ma 2830

Contextual Info: IDT7MB4067 256K x 32 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High density 8 megabit static RAM module The IDT7MB4067 is a 256K x 32 static RAM module constructed on an epoxy laminate FR-4 substrate using 8 256K x 4 static RAMs in plastic SOJ packages. Availability

CHN 709

Abstract: fr 3709 z
Contextual Info: IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The ID T7M P4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 5 1 2 K x 8 Static RAMs in plastic packages. The availability of

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32MXP MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPS512X32MXP is a 68-pin surface mount module consisting of four 512K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with "J"-Leads.

pin 10 4273

Abstract: 7MPV4130
Contextual Info: PRELIMINARY IDT7MPV4130 2M x 32 CMOS STATIC RAM MODULE FEATURES DESCRIPTION • • • • The IDT7MPV4130 is a 2M x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 16 1M x 4 Static RAMs in plastic packages as well as on board buffering and decoding. Availability of four

Contextual Info: 256K X 32 BiCMOS/CMOS STATIC RAM MODULE dt) IDT7MP4045 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High density 8 megabit static RAM module The IDT7MP4045 is a 256K x 32 static RAM module constructed on an epoxy laminate FR-4) substrate using 8

ZD D59

Abstract: IDT7MB6039
Contextual Info: Integrated Device Technology* Inc. 2 x 16K x 60 DATA/INSTRUCTION CACHE MODULE FOR IDT79R3000 CPU IDT7MB6039 The IDT7MB6039 is a 240K-byte high-speed CMOS static RAM cache module constructed on a multilayer epoxy sub­ strate FR-4 , using30 (16K X 4) SRAM sand8 IDT74FCT373

fr 3709 z

Abstract: MP-41
Contextual Info: IDT7MP41 35 PRELIMINARY 5 1 2K x 32 CM OS STATIC RAM M OD UL E FEATURES DESCRIPTION • • • • The IDT7M P4135 is a 512K x 32 Static RAM module constructed on an epoxy lam inate FR-4 substrate using 4 512K x 8 Static RAM s in plastic packages. The availability of

Contextual Info: DENSE-PAC MICROSYSTEMS 9 Megabit CMOS SRAM DPS256X36L PRELIM INARY DESCRIPTION: The DPS256X36L is a 256K X 36 high-density, low-power static RAM module comprised of eight 256K X 4 and four 256K x 1 monolithic SRAM's and decoupling capacitors surface mounted on a FR-4

fr 3709 z

Abstract: fr 3709
Contextual Info: IDT7MP41 35 PRELIMINARY 5 1 2K x 32 CM OS STATIC RAM M OD UL E FEATURES DESCRIPTION • • • • The IDT7M P4135 is a 512K x 32 Static RAM module constructed on an epoxy lam inate FR-4 substrate using 4 512K x 8 Static RAM s in plastic packages. The availability of