FQFN46 Search Results

Contextual Info: Reportable Substances in Components Package Type : FQFN46 Component Weight : Document No : FQFN46-32LD-GRN-RS-3 Process Type : Flip Chip & NiPdAu Lead Finish 0.0625 grams 4.0mmx6.0mm Lead #: No 1 2 3 4 5 6 32LD Material Molding Compound Copper (A194) Content in %

LQFP-128L

Abstract: LQFP128L
Contextual Info: SPECIFICATION NO. REV. 2000-0026 M DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVITY TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER SR. PRODUCT ENGINEERING MANAGER PLANNING AND LOGISTICS DIRECTOR WW TEST OPERATIONS MANAGER