FPBGA 26 Search Results

W3J128M72G-XPBX

Abstract: w3j128m72
Contextual Info: W3H32M72E-XSB2X 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  54% I/O reduction vs FPBGA

Contextual Info: White Electronic Designs W3E32M64S-XSBX PRELIMINARY* 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% SPACE SAVINGS vs. TSOP Package: • 43% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: FPBGA 10 x 10 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

Contextual Info: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266MHz 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply

Contextual Info: White Electronic Designs W3E32M72S-XSBX PRELIMINARY* 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266MHz 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply

Contextual Info: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% Space Savings vs. FPBGA Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count 2.5V ±0.2V core power supply

Contextual Info: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266MHz 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply

FPBGA

Abstract: ga 25 diode M918 package diode
Contextual Info: Tape and Reel Specification M918 Tape and Reel Option Fine Pitch Ball Grid Array Package GA 25 / 26 Ball W P Direction of Feed Package Suffix Package Type GA fpBGA 050708 Ball Count Tape Width (W) 25 12 26 16 (mm) Pocket Pitch (P) Reel Diameter Units per Reel

Contextual Info: W3E32M64S-XB3X 256 – 32Mx64 DDR SDRAM FEATURES BENEFITS  DDR SDRAM rate = 200, 250, 266, 333*  73% Space Savings vs. FPBGA  Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm  Reduced part count

Contextual Info: White Electronic Designs W3E32M72S-XSBX ADVANCED* 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266MHz 73% SPACE SAVINGS vs. TSOP Package: • • 208 Plastic Ball Grid Array PBGA , 16 x 22mm 44% Space Savings vs FPBGA Reduced part count 2.5V ±0.2V core power supply

LQFP 48

Abstract: HV220 HV2201 HV2221 HV230 HV2301 HV2321 HV2601 HV2631 HV2701
Contextual Info: Selector Guide High Voltage Analog Multiplexer/Switch ICs Device Interface Configuration Supply Voltage Analog Signal Voltage Switch Current V (V) (A) VPP-VNN Switch Resistance typ5 Output Bleed Resistors Package Options Notes 48-Lead LQFP (FG) - 48-Ball fpBGA (GA)

W3E32M72S-XSBX

Abstract: Theta JC of FBGA
Contextual Info: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES „ Data rate = 200, 250, 266, 333Mbs „ Package: BENEFITS „ • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible)

100-Pin Package Pin-Out Diagram

Abstract: GS71024
Contextual Info: GS71024T/U 64K x 24 1.5Mb Asynchronous SRAM TQFP, FPBGA Commercial Temp Industrial Temp Features 8, 10, 12, 15 ns 3.3 V VDD Fine Pitch BGA Bump Configuration • Fast access time: 8, 10, 12, 15 ns • CMOS low power operation: 190/160/130/110 mA at minimum cycle time.

Contextual Info: W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS  DDR SDRAM rate = 200, 250, 266, 333*  73% Space Savings vs. FPBGA  Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm  Reduced part count  2.5V ±0.2V core power supply

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

PCI 9656 schematic

Abstract: plx 9054 pci arbiter schematics 9656 PCI Motorola modem schematic diagram MPC8260 MPC860 RC32364
Contextual Info: PCI 9056 Connectivity • 32-bit, 66MHz PCI r2.2 compliant ■ Motorola PowerQUICC and generic 32-bit, 66MHz local bus modes ■ 3.3V I/O, 5V tolerant bus interfaces ■ PICMG 2.1 r2.0 Hot Swap Silicon ■ 256-ball, 17 x 17 mm, 1.00 mm fine pitch PBGA FPBGA

Contextual Info: GS8161Z18/32/36D-250/225/200/166/150/133 165-Bump FPBGA Commercial Temp Industrial Temp 18Mb Pipelined and Flow Through Synchronous NBT SRAM 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Datasheet Supplement Base datasheet: GS8161Z18/36T, Rev. 2.11, 3/2002

Contextual Info: Package Outline 26-Ball fpBGA Package Outline GA 6.00x5.35mm body, 1.20mm height (max), 0.65mm pitch D 9 8 7 6 5 4 3 2 1 Note 2 A B Terminal A1 Corner Index Area (D/4 x E/4) Note 1 C E E1 D SE E e F G H e Top View SD D1 Bottom View A2 View B Seating Plane

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch

DS1006

Abstract: LFE2-50E-7FN484C LFE2-6E-5TN144I lfe2-6se-6fn256c LFE2-6E-6TN144C LFE2-6SE-6FN256 LFE2-50E-5FN672C LFE2-20E-6FN672C LFE2-6E-6FN256C LFE2-12E-5FN484C
Contextual Info: LatticeECP2/M Family Data Sheet Introduction Data Sheet DS1006 • Pre-Engineered Source Synchronous I/O Features • DDR registers in I/O cells • Dedicated gearing logic • Source synchronous standards support – SPI4.2, SFI4 DDR Mode , XGMII – High Speed ADC/DAC devices

Contextual Info: LatticeXP Family Data Sheet Version 01.2, May 2005 LatticeXP Family Data Sheet Introduction May 2005 Advance Data Sheet Features • Programmable sysIO buffer supports wide range of interfaces: − LVCMOS 3.3/2.5/1.8/1.5/1.2 − LVTTL – SSTL 18 Class I

Part Number Decoder

Contextual Info: Part Number Decoder GSI /QQ GS P DDD O FF WWW R KK - BBB T C S P = Product Line Code 1 digit FF = Function Code (Up to 2 alpha) R = Revision Level (Up to 1 alpha) BBB = Speed Bin (Up to 3 digits) 4 = LLDRAM 8 = Sync SRAM 7 = Async SRAM Blank = Original Mask Set

FN516

Abstract: lfx1200c-03f900c LFX1200E LFX500EB-04FH516
Contextual Info: ispXPGA Family Includes High, Performance Low-Cost “E-Series” July 2005 • Non-volatile, Infinitely Reconfigurable • Microprocessor configuration interface • Program E2CMOS while operating from SRAM • Instant-on - Powers up in microseconds via