FOOTPRINT SO 14 Search Results

NTLMS4502N

Contextual Info: NTLMS4502N Advance Information Power MOSFET 17 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic

4392 mosfet

Contextual Info: NTLMS4501N Advance Information Power MOSFET 17 A, 30 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic

ntlms4504n

Contextual Info: NTLMS4504N Advance Information Power MOSFET 28 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic

PA40SO1-OT

Abstract: XXSO1-OT test socket 32 pin Enplas Enplas OTS 36 32 pin test socket footprint dip 40 Enplas 14 pin footprint dip 16 Enplas 28 pin
Contextual Info: PAxxSO1-OT Data Sheet xx pin SO Socket/xx pin DIP 0.6" plug Supported Device/Footprints Adapter Dimensions Using this adapter, the 32 and 40 pin SO EPROM packages can be programmed on DIP programmers. Device Device 32 pin 40 pin Mfgr Many " Package SO " Footprint

wave footprint so14

Abstract: MLC745 SOT163-1 SO-16 SOT109-1 footprint so 14 SOT136-1 sot109 SOJ40 SOT109-2
Contextual Info: SO & SOJ FOOTPRINT WAFE SOLDERING Philips Semiconductors enlarged solder land handbook, full pagewidth solder lands C 0.3 1.20 B solder resist A occupied area F board direction 0.60 1.27(N−2)x) MLC745 G Wave soldering PACKAGE NAME FOOTPRINT DIMENSIONS (mm)

4108N

Abstract: NTMFS4108N NTMFS4108NT1G NTMFS4108NT3G
Contextual Info: NTMFS4108N Power MOSFET 30 V, 35 A, Single N-Channel, SO-8 Flat Lead Package http://onsemi.com Features •ăThermally and Electrically Enhanced Packaging Compatible with Standard SO-8 Package Footprint •ăNew Package Provides Capability of Inspection and Probe After

Contextual Info: PA14-08-1-1603-6 Data Sheet 14 pin SO socket/8 pin DIP 0.6" plug Supported Device/Footprints Adapter Parts & Part Numbers This adapter allows programming of several SO devices in their DIP footprint. A partial list is: The following chart shows the various socket and board part

BAV301

Abstract: BAV302 BAV303 sot23 footprint
Contextual Info: BAV301 - BAV303 SURFACE MOUNT SWITCHING DIODE L IT E M Z I y POWER SEMICONDUCTOR Features Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications High Conductance Fits on SO D -323 / SO T-23 Footprint

Contextual Info: IRF7521D1 Description TM The new Micro8 package, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8TM an ideal device for applications where printed circuit board space is at a premium.

4108N

Abstract: NTMFS4108N NTMFS4108NT1G NTMFS4108NT3G
Contextual Info: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After

488AA

Abstract: 4108N
Contextual Info: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After

4108N

Contextual Info: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After

Contextual Info: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After

SO8F

Abstract: 4108N SO8FL
Contextual Info: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After

4108N

Contextual Info: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After

Contextual Info: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After

Contextual Info: PA20-08-5-2808-3 6 Data Sheet 20 Pin SO socket/8 Pin DIP 0.3” or 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, several Xilinx EEPROM's in their 20 pin SO package can be programmed in their 8 pin DIP footprint. This adapter is general purpose, and is known to work for the

Contextual Info: PA20-08-2-2808-3 6 Data Sheet 20 Pin SO socket/8 Pin DIP 0.3” or 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, several Atmel EEPROM's in their 20 pin SO package can be programmed in their 8 pin DIP footprint. This adapter is general purpose, and is known to work for the

MMSZ4688

Contextual Info: MMSZ4688 F A IR C H IL D S E M IC O N D U C T O R 5% TOLERANCE tm G eneral Description: Features: H alf watt, General purpose, Medium Current Surface Mount Zener in the SO D -123 package. The SO D-123 package has the same footprint as the glass m ini-melf LL-34 package &

4C03N

Contextual Info: NVMFS4C03N Power MOSFET 30 V, 2.1 mW, 143 A, Single N−Channel Logic Level, SO−8FL Features • • • • • • http://onsemi.com Small Footprint 5x6 mm for Compact Design Low RDS(on) to Minimize Conduction Losses Low QG and Capacitance to Minimize Driver Losses

858P

Abstract: F63TNR FDR858P SOIC-16
Contextual Info: February 1999 FDR858P Single P-Channel, Logic Level, PowerTrenchTM MOSFET General Description Features The SuperSOT-8 family of P-Channel Logic Level MOSFETs have been designed to provide a low profile, small footprint alternative to industry standard SO-8 little

858P

Abstract: P-Channel Logic Level PowerTrenchTM MOSFET FDR858P SOIC-16 Single P-Channel, Logic Level, PowerTrench MOSFET
Contextual Info: February 1999 FDR858P Single P-Channel, Logic Level, PowerTrenchTM MOSFET General Description Features The SuperSOT-8 family of P-Channel Logic Level MOSFETs have been designed to provide a low profile, small footprint alternative to industry standard SO-8 little

leadframe Cu C194

Contextual Info: PD - 9.1412G International IGR Rectifier IRF7422D2 FETKY MOSFET and Schottky Diode • • • • Co-packaged HEXFET Power MOSFET and Schottky Diode Ideal For Buck Regulator Applications Generation 5 Technology SO-8 Footprint VDSS = -20V Rds oh = 0.09Q

Contextual Info: February 1999 FDR858P Single P-Channel, Logic Level, PowerTrenchTM MOSFET General Description Features The SuperSOT-8 family of P-Channel Logic Level MOSFETs have been designed to provide a low profile, small footprint alternative to industry standard SO-8 little