FOAM DISK FOR WAFER BOX Search Results
FOAM DISK FOR WAFER BOX Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| MD80C187-12/B |
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80C187 - Math Coprocessor for 80C186 |
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| MD80C187-10/B |
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80C187 - Math Coprocessor for 80C186 |
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| MD8284A/B |
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8284A - Clock Generator and Driver for 8066, 8088 Processors |
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| AM79C961AVI |
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Full Duplex 10/100 MBPS ETHERNET Controller for PCI Local Bus, PCNET- ISA II jumperless |
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| AM79C961AVC\\W |
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Full Duplex 10/100 MBPS ETHERNET Controller for PCI Local Bus, PCNET- ISA II jumperless |
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FOAM DISK FOR WAFER BOX Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: Bulletin I0405J rev. A 05/01 SC021.5. Series SCHOTTKY DIE 21 x 45 mils a 0.35 ± 0.01 c 14 ± 0.4 NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). 3. DIMENSIONS AND TOLERANCES: a = 0.53 + 0, - 0.01 (21 + 0, - 0.4) |
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I0405J SC021. S1025 | |
S1025
Abstract: foam disk for wafer box
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I0405J SC021. S1025 I04051J foam disk for wafer box | |
S1025
Abstract: SC1255
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I0507J SC125. S1025 SC1255 | |
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Contextual Info: Bulletin I0511J rev.A 05/01 SC175.5. Series SCHOTTKY DIE 175 x 175 mils a 0.35 ± 0.01 14 ± 0.4 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C 3. DIMENSIONS AND TOLERANCES: d b NOTES: D A a = 4.445 + 0, - 0.01 |
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I0511J SC175. S1025 005Characteristics I0511J | |
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Contextual Info: Bulletin I0507J rev. C 05/01 SC125.5. Series SCHOTTKY DIE 125 x 125 mils a 0.35 ± 0.01 14 ± 0.4 c NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). 3. DIMENSIONS AND TOLERANCES: d b C A a = 3.175 + 0, - 0.01 |
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I0507J SC125. S1025 | |
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Contextual Info: Bulletin I0405J rev. B 10/03 SC021.5. Series SCHOTTKY DIE 21 x 45 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) A d b C D NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) |
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I0405J SC021. S1025 SC021R015x5x SC021S020x5x | |
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Contextual Info: Bulletin I0500J rev. C 10/03 SC095.5. Series SCHOTTKY DIE 95 x 95 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: Ø 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) |
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I0500J SC095. S1025 SC095R015x5x SC095S020x5x | |
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Contextual Info: Bulletin I0405J rev. C 03/07 SC021.5. Series SCHOTTKY DIE 21 x 45 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) A d b C D NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) |
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I0405J SC021. S1025 SC021R015x5x SC021S020x5x | |
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Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION: |
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I0118J SC275. S1025 SC275R015x5x SC275S020x5x SC275S030x5x | |
irf 44 n
Abstract: S1025
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I0500J SC095. S1025 irf 44 n | |
SC100
Abstract: KA 1400 transistor sc100 S1025 SC-100
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I0499J SC100. S1025 SC100 KA 1400 transistor sc100 SC-100 | |
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Contextual Info: Bulletin I0118J rev. D 03/07 SC275.5. Series SCHOTTKY DIE 275 x 275 mils 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) |
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I0118J SC275. S1025 SC275R015x5x SC275S020x5x | |
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Contextual Info: Bulletin I0500J rev. D 03/07 SC095.5. Series SCHOTTKY DIE 95 x 95 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: Ø 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) |
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I0500J SC095. S1025 SC095R015x5x SC095S020x5x | |
sc202aContextual Info: Bulletin I0508J rev. B 05/01 SC202.5. Series SCHOTTKY DIE 200 x 200 mils Monolithic Dual 0.25 ± 0.01 (10 ± 0.4) a NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). d Anode b 2. CONTROLLING DIMENSION: (MILS). D Anode c Ø 40 (157) Wafer flat alligned with |
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I0508J SC202. S1025 sc202a | |
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S3060
Abstract: SC2021
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I0508J SC202. S1025 S3060 SC2021 | |
IRF 830 equivalent
Abstract: S1025
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I0501J SC036. S1025 IRF 830 equivalent | |
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Contextual Info: Bulletin I0511J rev. C 03/07 SC175.5. Series SCHOTTKY DIE 175 x 175 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 2. CONTROLLING DIMENSION: (MILS) |
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I0511J SC175. S1025 SC175R015x5x SC175S020x5x | |
S1025
Abstract: SC105
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I0503J SC105. S1025 SC105 | |
SC175
Abstract: SC-175
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I0511J SC175. S1025 SC175R015x5x SC175S020x5x I0511J SC175 SC-175 | |
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Contextual Info: Bulletin I0503J rev. B 07/00 SC105.5. Series SCHOTTKY DIE 105 x 125 mils a 0.35 ± 0.01 0.14 ± 0.0004 c NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION: (INCH). 3. DIMENSIONS AND TOLERANCES: a = 3.18 + 0, - 0.05 |
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I0503J SC105. S1025 | |
B1000
Abstract: S1025 SC060 SC060H100
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I0502J SC060. S1025 B1000 SC060 SC060H100 | |
B1000
Abstract: S1025 SC180
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I0504J SC180. S1025 B1000 SC180 | |
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Contextual Info: Bulletin I0506J rev. C 05/01 SC170.5. Series SCHOTTKY DIE 115 x 170 mils a 0.35 ± 0.01 c 14 ± 0.4 NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). A d b C D Ø 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 4.32 + 0, - 0.01 |
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I0506J SC170. S1025 | |
S1025
Abstract: SC036H100x5x SC036.5. Series
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I0501J SC036. S1025 SC036H100x5x SC036.5. Series | |