|
L77HDAG26SOL2C309
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock |
PDF
|
|
|
L177HDAG26SOL2RM5
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
PDF
|
|
|
L77HDAG26SOL2RM5C309
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
PDF
|
|
|
L77HDAG26SOL2
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock |
PDF
|
|
|
L177HDAG26S
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock |
PDF
|
|
