FLIP CHIP Search Results

capture and electronic packaging

Abstract: Flip Chip Substrate tolerance thermal conductivity of substrate chip pads layout dram layout structure Pb210
Contextual Info: Designing for Cost Effective Flip Chip Technology Jack Bogdanski White Electronic Designs Corp. Designing for Cost Effective Flip Chip Technology Designing For Cost Effective Flip Chip Technology Bump and flip approaches to semiconductor packaging have gained acceptance

radioactivity detector

Abstract: 25-micron Alpha Industries alpha particle Delco
Contextual Info: Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology 1 What are alpha particles? High energy particles are emitted during radioactive decay of heavier elements

AN2348

Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
Contextual Info: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.

motorola darlington power transistor

Abstract: LIN 2.0 alternator motorola automotive power transistor Alternator regulator MCCF33095 MCCF33096 20PS20
Contextual Info: Order this data sheet by MCCF33096/D MOTOROLA SEMICONDUCTOR~ MCCF33096 TECHNICAL OATA Advance Information Darlington Drive Flip-Chip The MCCF33096 is a Darlington Flip-Chip designed for use with the MCCF33095 Flip-Chip as a lamp driver in automotive charging

EIA standards 783

Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
Contextual Info: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.

T74LS74

Abstract: T54LS74AD2
Contextual Info: DUAL D-TYPE POSITIVE EDGETRIGGERED FLIP-FLOP DESCRIPTION The T54LS/T74LS74A dual edge-triggered flip-flop utilizes Schottky TTL circuitry to produce high speed D-type flip-flops. Each flip-flop has individual clear_and set inputs, and also complementary Q

T74LS74AB1

Abstract: T74LS74a T54LS74AD2 T74LS74
Contextual Info: DUAL D-TYPE POSITIVE EDGETRIGGERED FLIP-FLOP DESCRIPTION The T54LS/T74LS74A dual edge-triggered flip-flop utilizes Schottky TTL circuitry to produce high speed D-type flip-flops. Each flip-flop has individual clear_and set inputs, and also complementary Q

BGA 64 PACKAGE thermal resistance

Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect

Pb210

Abstract: flip chip substrate tolerance
Contextual Info: Designing for Cost Effective Flip Chip Technology Application Note DESIGNING FOR COST EFFECTIVE FLIP CHIP TECHNOLOGY Bump and flip approaches to semiconductor packaging have gained acceptance in the industry. For the designer to take full advantage of this technology, attention to bump

E700G

Contextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

Alternator regulator

Abstract: transistor marking ld3 Alternator Voltage Regulator Darlington motorola darlington power transistor
Contextual Info: MOTOROLA MCCF33096 SEMICONDUCTOR TECHNICAL DATA Advance Information Darlington Drive Flip-Chip The MCCF33096 is a Darlington Flip-Chip designed for use with the MCCF33095 Flip-Chip as a lamp driver in automotive charging systems. The MCCF33095 and MCCF33096, when used with an appropriate Motorola Power

Contextual Info: SFC05-5 TVS PENTA FLIP CHIP ARRAY DESCRIPTION The SFCO5-5 flip chip is designed to protect sensitive components at the board level. The size makes this flip chip unique and well suited for applications which have limited board real estate yet requires ESD protection.

HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

cu pillar

Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

Contextual Info: R Flip-Chip Packages Flip-Chip Packages As silicon devices become more integrated with smaller feature sizes as well as increased functionality and performance, packaging technology is also evolving to take advantage of these silicon advancements. Flip-chip packaging is the latest packaging option introduced

Contextual Info: SFC05-4 TVS QUAD FLIP CHIP ARRAY DESCRIPTION The SFCO5-4 quad flip chip is designed to protect sensitive components at the board level. The size makes this flip chip unique and well suited for applications which have limited board real estate yet requires ESD protection.

APP3599

Abstract: DS2760 DS2761 AN3599
Contextual Info: Maxim > App Notes > 1-Wire DEVICES GENERAL ENGINEERING TOPICS Keywords: DS2760, flip chip, DS2761, DS2761 flip-chip, RoHS, lead, Pb, lead free, Pb free, battery management, fuel gauge Sep 16, 2005 APPLICATION NOTE 3599 Assembling High-Lead Pb DS2761 Flip-Chips in a Pb-Free Assembly

Contextual Info: 54ACT534 54ACT534 Octal D Flip-Flop with TRI-STATE Outputs Literature Number: SNOS108 54ACT534 Octal D Flip-Flop with TRI-STATE Outputs General Description The ’ACT534 is a high-speed, low-power octal D-type flip-flop featuring separate D-type inputs for each flip-flop

54LS174

Abstract: 54LS174DMQB 54LS174FMQB 54LS174LMQB 54LS175 LS174 LS175 DM74LS174
Contextual Info: DM74LS174/DM74LS175 Hex/Quad D Flip-Flops with Clear General Description Features These positive-edge-triggered flip-flops utilize TTL circuitry to implement D-type flip-flop logic. All have a direct clear input, and the quad 175 versions feature complementary outputs from each flip-flop.

54AC175

Contextual Info: 54AC175,54ACT175 54AC175, 54ACT175 Quad D Flip-Flop Literature Number: SNOS094A July 29, 2011 54AC175 • 54ACT175 Quad D Flip-Flop General Description Features The 'AC/'ACT175 is a high-speed quad D flip-flop. The device is useful for general flip-flop requirements where clock and

RCA-CD4027A

Contextual Info: C04027A Types oy l CMOS Dual J-K Master-Slave Flip-Flop The RCA-CD4027A is a single monolithic chip Integrated circuit containing tw o Iden­ tical complementary-symmetry J-K masterslave flip-flops. Each flip-flop has provisions for individual J, K, Set, Reset, and Clock in­

JT40W

Abstract: CD4027B
Contextual Info: Z 537T CD4027B Types CMOS Dual J-K Master-Slave Flip-Flop High-Voltage Types {20-V o lt Rating The RCA-CD4027B is a single m onolithic chip integrated circuit containing tw o iden­ tical complementary-symmetry J-K masterslave flip-flops. Each flip-flop has provi­

D2PAK1

Contextual Info: Cherry Semiconductor offers a wide variety of traditional packages in addition to more advanced package technology. Flip Chip is an example of the advanced packaging technologies offered by Cherry Semiconductor. An application note included in this section explains the Flip Chip manufacturing process and the methods available for Flip Chip assembly.

Contextual Info: 54FCT374 54FCT374 Octal D-Type Flip-Flop with -TRISTATE Outputs Literature Number: SNOS428 54FCT374 Octal D-Type Flip-Flop with TRI-STATE Outputs General Description Features The ’FCT374 is an octal D-type flip-flop featuring separate D-type inputs for each flip-flop and TRI-STATE outputs for