FCBGA PACKAGE THERMAL RESISTANCE JC Search Results
FCBGA PACKAGE THERMAL RESISTANCE JC Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
---|---|---|---|---|---|
PQU650M-F-COVER | Murata Manufacturing Co Ltd | PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical | |||
TPH1R306PL |
![]() |
N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
TPH9R00CQH |
![]() |
MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) | Datasheet | ||
TPH9R00CQ5 |
![]() |
N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) | Datasheet | ||
TPHR8504PL |
![]() |
N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet |
FCBGA PACKAGE THERMAL RESISTANCE JC Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
TR6878
Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
|
Original |
1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576 | |
diagrams hitachi ecu
Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
|
Original |
D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog" | |
ipx2800
Abstract: IXP2400 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance
|
Original |
IXP2400 ipx2800 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance | |
1000-pin bga 0,8 mm
Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
|
Original |
Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog" | |
PES16NT16G2
Abstract: 89H16NT16G2
|
Original |
16-Lane 16-Port 89HPES16NT16G2 PES16NT16G2 16-lane, 89H16NT16G2 | |
19x19mm
Abstract: PES24T6G2 89HPES24T6G2 FCBGA676
|
Original |
24-Lane 89HPES24T6G2 PES24T6G2 24-lane, 324-ball 676-ball 19x19mm FCBGA676 | |
Contextual Info: 32-Lane 8-Port PCIe Gen2 System Interconnect Switch 89HPES32NT8BG2 Datasheet ® Device Overview • All BARs support 32/64-bit base and limit address translation • Two BARs BAR2 and BAR4 support look-up table based address translation – 32 inbound and outbound doorbell registers |
Original |
32-Lane 89HPES32NT8BG2 32/64-bit | |
89H32NT8
Abstract: 89H32NT8BG2
|
Original |
32-Lane 89HPES32NT8BG2 PES32NT8BG2 32-lane, 89H32NT8 89H32NT8BG2 | |
Contextual Info: 16-Lane 16-Port PCIe Gen2 System Interconnect Switch 89HPES16NT16G2 Datasheet ® Device Overview • Dynamic port reconfiguration — downstream, upstream, non-transparent bridge • Dynamic migration of ports between partitions • Movable upstream port within and between switch partitions |
Original |
16-Lane 16-Port 89HPES16NT16G2 32/64-bit | |
Contextual Info: 12-Lane 12-Port PCIe Gen2 System Interconnect Switch 89HPES12NT12G2 Datasheet ® Device Overview Non-Transparent Bridging NTB Support – Supports up to 3 NT endpoints per switch, each endpoint can communicate with other switch partitions or external PCIe |
Original |
12-Lane 12-Port 89HPES12NT12G2 32/64-bit | |
89HPES32NT24BG2
Abstract: 89H32NT 89H32NT24 PES32NT24BG2 89H32NT24BG2
|
Original |
32-Lane 24-Port 89HPES32NT24BG2 PES32NT24BG2 32-lane, 24port 89H32NT 89H32NT24 89H32NT24BG2 | |
Contextual Info: 32-Lane 8-Port PCIe Gen3 System Interconnect Switch 89HPES32H8G3 Data Sheet ® Device Overview – Per lane SerDes configuration • Full back channel equalization support • Rx, 5 tap DFE • Rx, single tap has pulse shaping • Rx CTLE compensates for up to 25db @ 4G/s |
Original |
32-Lane 89HPES32H8G3 89HPES32H8G3 32-lane, | |
89HPES24NT6AG2
Abstract: 89H24NT6AG2 Single Root I/89HPES24NT6AG2
|
Original |
24-Lane 89HPES24NT6AG2 PES24NT6AG2 24-lane, 89H24NT6AG2 Single Root I/89HPES24NT6AG2 | |
Contextual Info: 24-Lane 6-Port PCIe Gen2 System Interconnect Switch 89HPES24NT6AG2 Datasheet ® Device Overview • Two BARs BAR2 and BAR4 support look-up table based address translation – 32 inbound and outbound doorbell registers – 4 inbound and outbound message registers |
Original |
24-Lane 89HPES24NT6AG2 32-bit 64-bit | |
|
|||
PES24NT24G2
Abstract: 89H24NT24 pci non-transparent bridge 89H24NT24G2 89HPES24NT24G2
|
Original |
24-Lane 24-Port 89HPES24NT24G2 PES24NT24G2 24-lane, 89H24NT24 pci non-transparent bridge 89H24NT24G2 | |
Contextual Info: 24-Lane 24-Port PCIe Gen2 System Interconnect Switch 89HPES24NT24G2 Datasheet ® Device Overview • Movable upstream port within and between switch partitions Non-Transparent Bridging NTB Support – Supports up to 8 NT endpoints per switch, each endpoint can |
Original |
24-Lane 24-Port 89HPES24NT24G2 32/64-bit | |
Contextual Info: 32-Lane 8-Port PCIe Gen2 System Interconnect Switch 89HPES32NT8AG2 Datasheet ® Device Overview • All BARs support 32/64-bit base and limit address translation • Two BARs BAR2 and BAR4 support look-up table based address translation – 32 inbound and outbound doorbell registers |
Original |
32-Lane 89HPES32NT8AG2 32/64-bit | |
Contextual Info: 32-Lane 24-Port PCIe Gen2 System Interconnect Switch 89HPES32NT24BG2 Datasheet ® Device Overview • Dynamic port reconfiguration — downstream, upstream, non-transparent bridge • Dynamic migration of ports between partitions • Movable upstream port within and between switch partitions |
Original |
32-Lane 24-Port 89HPES32NT24BG2 32/64-bit | |
MO-235 FOOTPRINT
Abstract: die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc
|
Original |
SC-100 MO-235 MO-235 FOOTPRINT die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc | |
Contextual Info: 48-Lane 12-Port PCIe Gen3 System Interconnect Switch 89HPES48H12G3 Data Sheet ® Device Overview – Autonomous and software managed link width and speed control – Per lane SerDes configuration • Full back channel equalization support • Rx, 5 tap DFE |
Original |
48-Lane 12-Port 89HPES48H12G3 89HPES48H12G3 48-lane, | |
89H48H12
Abstract: 89H48H12G3
|
Original |
48-Lane 12-Port 89HPES48H12G3 48-lane, 89H48H12 89H48H12G3 | |
Contextual Info: 48-Lane 12-Port PCIe Gen3 System Interconnect Switch 89HPES48H12G3 Data Sheet ® Device Overview – Autonomous and software managed link width and speed control – Per lane SerDes configuration • Full back channel equalization support • Rx, 5 tap DFE |
Original |
48-Lane 12-Port 89HPES48H12G3 89HPES48H12G3 48-lane, | |
Contextual Info: 32-Lane 24-Port PCIe Gen2 System Interconnect Switch 89HPES32NT24AG2 Datasheet ® Device Overview • Dynamic port reconfiguration — downstream, upstream, non-transparent bridge • Dynamic migration of ports between partitions • Movable upstream port within and between switch partitions |
Original |
32-Lane 24-Port 89HPES32NT24AG2 32/64-bit | |
89HPES16T4AG2Contextual Info: 16-Lane 4-Port Gen2 PCI Express Switch 89HPES16T4AG2 Data Sheet ® Device Overview The 89HPES16T4AG2 is a member of IDT’s PRECISE family of PCI Express® switching solutions. The PES16T4AG2 is a 16-lane, 4port Gen2 peripheral chip that performs PCI Express Base switching |
Original |
16-Lane 89HPES16T4AG2 PES16T4AG2 16-lane, 324-ball 16T4A 89HPES16T4AG2ZCAL |