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    FBGA400 Price and Stock

    Infineon Technologies AG

    Infineon Technologies AG AS5911-FBGA400-01

    - Tape and Reel (Alt: AS5911-FBGA400-01)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas AS5911-FBGA400-01 Tape & Reel 840
    • 1 -
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    • 1000 $64.60
    • 10000 $59.89
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    FBGA400 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    P-FBGA400-1717-0

    Contextual Info: P—FBGA400—1717—0.80AZ Uniti m Feb.2004


    OCR Scan     		p-fbga400-1717-0 PDF

    PCN0515

    Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
    Contextual Info: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently


    Original     		pcn0515hc-100ul-941x1011+9sumitomo g770g770* sumitomog770 mold compoundg770 sumitomounbiased hast 130, 85 rh, 100 hrsg770g770* g770 mold compound sumitomo 1000thermal conductivity of sumitomo g770g770 hc PDF