EVER OHMS CHIP RESISTOR Search Results

XDMCHLNDDF

Contextual Info: PT9258 Single Chip GPS Receiver FEATURES DESCRIPTION PT9258 is a single chip GPS receiver SoC that integrates RF and Baseband in an 8 x 8 x 0.9 mm QFN package. The SoC together with few external components builds stand-alone GPS receivers that track GPS satellite signals, and stream out NMEA

ericsson telecom catalog

Abstract: nokia 7500 crunch
Contextual Info: 02/2000 70 Maxess Road i Melville, New York 11747 516 396-7500 i Fax (516) 396-7575 COMPANY PRESS NOTICE (PASSIVE COMP: October 18, 1999) By Kelly Barrett The Incredible Shrinking Passives Strong demand, tight spaces spur integration They may be shrinking in size, but passive devices are multiplying as designers

hyperlynx

Abstract: Ever Ohms chip resistor AN-375 AN-433 RC32355 tcomp Signal Path Designer
Contextual Info: Board Timing Adjustment Using Hyperlynx Software Application Note AN-433 By Harold Gomard Notes Background Because of ever higher clock frequencies, general board timings, such as setup and hold times, must be calculated more accurately than ever. When designing systems, this basic issue now requires more attention and more resources because timing margins have been significantly reduced.

Ever Ohms chip resistor

Abstract: TCD-13-4 mini circuit welding power transformer welding transformer 75 ohm coupler TCD-13-4 DB714 TCD-10-1W TCD-10-1W-75 TCD-13-4-75
Contextual Info: DO-IT-YOURSELF DIRECTIONAL COUPLERS CASE STYLE DRAWINGS & DIMENSIONS INCH Typical Performance Data - TCD-13-4-75 CASE STYLE DB714 Frequency (MHz) Insertion Loss (dB) CPL (dB) DIRECTIVITY (dB) RL-IN (dB) RL-OUT (dB) RL-CPL (dB) 5 100 200 300 400 500 600

Contextual Info: DO-IT-YOURSELF DIRECTIONAL COUPLERS CASE STYLE DRAWINGS & DIMENSIONS INCH Typical Performance Data - TCD-13-4-75 CASE STYLE DB714 Frequency (MHz) Insertion Loss (dB) CPL (dB) DIRECTIVITY (dB) RL-IN (dB) RL-OUT (dB) RL-CPL (dB) 5 100 200 300 400 500 600

size 0204 capacitor

Abstract: LICC low inductance chip capacitor HIGH VOLTAGE MLCC (SURFACE MOUNT)
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

mlcc AVX

Abstract: HIGH VOLTAGE MLCC (SURFACE MOUNT)
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

HIGH VOLTAGE MLCC (SURFACE MOUNT)

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

800DM

Contextual Info: B40C / B80C / B125C / B250C / B380C 800 DM SERIES MINIATURE GLASS PASSIVATED SINGLE Voltage - 65 to 600 Volts - PHASE BRIDGE RECTIFIER Current - 0.9 Amperes FEATURES j2l ♦ Plastic package has Underwriters Lab­ oratory Fiammability Classification 94V-0 ♦ Glass passivated chip junctions

Contextual Info: Standard Products ACT5028B 16-Bit Monolithic Tracking Rad Tolerant Resolver-To-Digital Converter www.aeroflex.com/RDC September 30, 2008 FEATURES ❑ Radiation performance - Total Dose: 1Mrad Si - SEL Immune: >100MeV-cm2/mg ❑ ❑ +5VDC power only Programmable: By using a few non critical external resistors and capacitors

LD18

Abstract: Capacitor 16v LD17
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

LD18

Abstract: LD17
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

CRN028R

Abstract: CR1218 55N25 resistance r200 1 1w smd R004 MCR0603 SCRN028R CR0805 CR1206 CR2010
Contextual Info: SMD THICK FILM CHIP RESISTORS 01 C O M P A N Y P R O FILE 02 SMD T H IC K FILM C H IP R E S IS T O R S 05 T H IC K FILM LO W OHM C H IP R E S IS T O R S 06 T H IC K FILM HIG H OHM C H IP R E S IS T O R S 07 T H IC K FILM C H IP A R R A Y S C O N V E X 08

53c895

Abstract: VHDCI Connector for pcb LT1086 SYM53C895 UCC5630 scsi vhdci 68 pin cable
Contextual Info: System Engineering Notes No. 893 PCB Layout For SYM53C895 Rev 1.0, March 1997 Printed Circuit Board Layout Guidelines For SYM53C895 Higher data transfer rates, such as Ultra2 SCSI, make good printed circuit board PCB layout practices more critical than ever. Some of the layout design criteria that need to be considered are

imo inverter cd 750

Abstract: Capacitor 226 25k 412 024C 064R CR0805 CR1206 CR1210 tv sony ic 1213 Ever Ohms chip resistor 226 20K 340
Contextual Info: ' T A & L E . ' & F ' G Q M V E K V S • Thick Film Chip Resistor - C R Series. 2 ■ Low Ohm Chip Resistor. 5

bl 0306

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

lga components

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

sj 2025

Abstract: ic sj 2025 L6025
Contextual Info: June 1996 % M i c r o L in e a r ML6026 36 Mbps Read Channel Filter/Equalizer GENERAL DESCRIPTION FEATURES The M L6026 is a m onolithic analog filter/equalizer intended for hard disk drive read channel applications, capable of handling disk data rates upto 36M bits/s, with

L68A

Abstract: bl 0306
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

VK200 INDUCTOR

Abstract: inductor vk200 VK200 inductor of high frequencies
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA The RF MOSFET Line RF Pow er F ield -E ffect Transistors MRF175LU MRF175LV N-Channel Enhancement-Mode Designed for broadband com m ercial and military applications using single ended circuits at frequencies to 400 MHz. The high power, high gain and

bl 0306

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

LICA3T104P1FC1AA

Abstract: LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA LICA3T333M1FC4AA MIL-PRF-123 S55S 97Pb cap 0306 package
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking