|
10131319-2211100LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
|
|
|
10131319-22111G0LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 22 Positions, GW Compatible Nylon66, Tray Packing. |
PDF
|
|
|
83808-22111S
|
|
Amphenol Communications Solutions
|
Shield (Type II ) 2xI/O, with shield insulator and label recess |
PDF
|
|
|
54122-111142200LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
54122-111342100LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch |
PDF
|
|
