ENPLAS DRAWINGS Search Results

FPQ-256(352)-0.5-04

Abstract: ic149-208-161-s5 FPQ-256 Enplas drawings IC51-1004-809 Enplas fpq 352 Yamaichi TQFP Enplas fpq IC51-1764-1505-5 IC51-1444-1354
Contextual Info: v2.0 Socket Recommendation for Actel FPGA Packages So c ke t s f or Pr o t o t yp i n g w i t h Ac t e l F P G A s Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of

Yamaichi IC51-1444-1354-7 footprint

Abstract: IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 SY-PQ240 enplas FPQ-256
Contextual Info: v3.1 Socket Recommendation for Actel FPGA Packages Sockets for Prototyping with Actel FPGAs Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of

wells cti

Contextual Info: Socket Recommendation for Actel FPGA Packages S o c k e t s for Prototyping with A c t e l F P G A s Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of

HT 1200-4

Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

PT740 AB

Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages

PT740 AB

Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

Enplas drawings

Abstract: TSOP 54 PIN Enplas OTS 0,047 63 DIP 32 DIMENSION enplas TSOP 40 socket F28F010 F28F020
Contextual Info: CIC-32TS-32D-A6-ENP-R 32-Lead TSOP to a 32-Pin DIP 3/98 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: F28F010 F28F020 SOCKET: BASE 32-Pin DIP PIN NAMES SOCKET 32-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

msp430g2553

Abstract: ASX-531 JTAG msp430 MSP-TS430PW24 SLAU278F PZ100USB TSSOP YAMAICHI SOCKET asx 531 MSP-FET430F5137RF900 MSP430F5529 schematic
Contextual Info: MSP430 Hardware Tools User's Guide Literature Number: SLAU278F May 2009 – Revised December 2010 2 SLAU278F – May 2009 – Revised December 2010 Submit Documentation Feedback 2009–2010, Texas Instruments Incorporated Contents . 9

CRYSTAL 4MHz smd 2pin

Abstract: MSP430F2618IPM MSP-FET430F5137RF900 SLAU278H YAMAICHI ic357 MSP-TS430PZ100C ic357 MSP430G2452 MSP-TS430PN80USB 32,768 SMD Quarz
Contextual Info: MSP430 Hardware Tools User's Guide Literature Number: SLAU278H May 2009 – Revised December 2011 2 SLAU278H – May 2009 – Revised December 2011 Submit Documentation Feedback Copyright 2009–2011, Texas Instruments Incorporated Contents . 9

MSP430V

Abstract: ASX-531 SLAU278J EM430F6147RF900 ASX-531CS MSP-EXP430G2 B42 diode smd SLAU371 MSP430F5438 user guide MSP430G2XXX
Contextual Info: MSP430 Hardware Tools User's Guide Literature Number: SLAU278J May 2009 – Revised June 2012 Contents . 7 Get Started Now! . 11

pj 69 SMD diode

Abstract: MSP430F2618IPM 47/pj 69 SMD diode TMS 3621 14 pin JTAG CONNECTOR SLAU367 smd diode code pj 43 pinhead SMD PJ 77 smd diode code pj 65
Contextual Info: MSP430 Hardware Tools User's Guide Literature Number: SLAU278R May 2009 – Revised May 2014 Contents Preface . 8 1 Get Started Now! . 11

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

M9627

Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
Contextual Info: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in

marking code SMD Transistor 2ak

Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

MSP430U

Abstract: MSP-FET430UIF windows 7 drivers slau144 IBM thinkpad r51 MSP430F5x MSP430F2274/cc2500 ibm thinkpad r52 MSP430 USB-DEBUG MSP430F2013 Manual MSP430 F2370
Contextual Info: MSP-FET430 Flash Emulation Tool FET (for Use With Code Composer Essentials for MSP430 Version 3.1) User's Guide Literature Number: SLAU157H May 2005 – Revised November 2008 2 SLAU157H – May 2005 – Revised November 2008 Submit Documentation Feedback

SLAU157G

Abstract: MSP430F2013 Manual MSP430x5xx Family Users Guide F2370 MSP-FET430UIF MSP-FET430X110 P120 P140 P410 P440
Contextual Info: MSP-FET430 Flash Emulation Tool FET (for Use With Code Composer Essentials for MSP430 Version 3) User's Guide Literature Number: SLAU157G May 2005 – Revised May 2008 2 SLAU157G – May 2005 – Revised May 2008 Submit Documentation Feedback Contents Preface . 7

solder paste alpha WS609

Abstract: WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000 MO-193
Contextual Info: TVSOP Application Brief August 1996 draft 1.2 SCBA009A List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete

Alpha WS609

Abstract: Yamaichi TQFP 244 MO-194AA MO-193 MO-194 tssop 16 exposed pad stencil Alpha WS609 solder TSSOP YAMAICHI SOCKET MO-194AC SN74LVC16xxx
Contextual Info: TVSOP Application Brief December 1996 SCBA009B List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Draft 1.3 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete

Contextual Info: User's Guide SBOU057 – February 2008 BUF16821EVM Evaluation Board and Software Tutorial This user's guide describes the characteristics, operation, and use of the BUF16821EVM evaluation board. It discusses how to set up and configure the software and hardware, and reviews various aspects

OTS-38

Contextual Info: User's Guide SBOU053 – September 2007 BUF22821EVM Evaluation Board and Software Tutorial This user's guide describes the characteristics, operation, and use of the BUF22821EVM evaluation board. It discusses how to set up and configure the software and hardware, and reviews various aspects