emp8 Package
Abstract: emp8 Package dimension EMP8
Contextual Info: PACKAGE DIMENSIONS EMP8 0 ~ 10º 5.0±0.3 0.8±0.2 3.9±0.2 6.0±0.4 5 8 4 1 1.27 +0.1 0.20 -0.05 0.15±0.1 1.5±0.15 0.74MAX 0.1 0.4±0.1 0.12 M UNIT : mm
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74maxemp8 packageemp8 package dimensionemp8 |
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4558D
Abstract: 4556 op-amp IC 4558 surround sound circuit REGULATOR IC l7812cv TDA2822M SMD TYPE circuit inter CV 203 NE555N IC AUDIO FILTER NJM2060 "cross reference" IC L7912CV MC34063P1
Contextual Info: NJR CORPORATION Product Reference Overview SEMICONDUCTORS LINEAR RF & WIRELESS PACKAGING 27 PART NUMBER SYSTEMS 33 CROSS REFERENCE 35 AUDIO ICs 8 COMMUNICATION ICs 9 VIDEO ICs 10 CMOS SWITCH 11 MCU & PERIPHERAL 13 LCD DRIVER 15 LSI/OTHER 16 SPECIAL FUNCTIONS
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o-220fo-220o-2524558d+94556 op-ampic 4558 surround sound circuitregulator ic l7812cvtda2822m smd typecircuit inter cv 203ne555n ic audio filternjm2060 "cross referenceic l7912cvmc34063p1
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SS0P24
Abstract: SS0P-24 QFP64-E1 SS0P14 144/QFP64-E1
Contextual Info: csa RECOMMENDED MOUNTING METHOD A • RECONENDED MOUNTING METHOD 1.Solderins Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92
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t0-220fdip14dip16dip18+11dip20dip22dip28dip40sdip22sdip24ss0p24ss0p-24qfp64-e1ss0p14144/qfp64-e1
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AUDIO DELAY CIRCUIT DIAGRAM
Abstract: 21ms audio delay AUDIO interface CIRCUIT DIAGRAM
Contextual Info: NJU26901 Digital Audio Delay Package General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 NJU26901M FEATURES • 2-Channel Audio Delay 24 bits data width .
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nju26901nju26901e2nju26901m85msec+848khz128msec32khz43msecaudio delay circuit diagram21msaudio delayaudio interface circuit diagram
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AUDIO DELAY CIRCUIT DIAGRAM
Contextual Info: NJU26901 Digital Audio Delay n Package n General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 n FEATURES • 2-Channel Audio Delay 24 bits data width . Delay Time 85msec at fs = 48kHz ( 128msec at fs = 32kHz , 43msec at fs = 96kHz)
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nju26901nju26901e285msec48khz+5128msec32khz43msec96khzaudio delay circuit diagram
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AUDIO DELAY CIRCUIT DIAGRAM
Abstract: analog audio delay delaytime 69mS NJU26901 NJU26901E2 audio delay AUDIO interface CIRCUIT DIAGRAM
Contextual Info: NJU26901 Digital Audio Delay ! Package ! General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 ! FEATURES • 2-Channel Audio Delay 24 bits data width . Delay Time 85msec at fs = 48kHz ( 128msec at fs = 32kHz , 43msec at fs = 96kHz)
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nju26901nju26901e285msec48khz+10128msec32khz43msec96khzaudio delay circuit diagramanalog audio delaydelaytime69msaudio delayaudio interface circuit diagram
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AUDIO DELAY CIRCUIT DIAGRAM
Contextual Info: NJU26901 Digital Audio Delay Package General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 NJU26901M FEATURES • 2-Channel Audio Delay 24 bits data width .
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nju26901nju26901e2nju26901m85msec+548khz128msec32khz43msecaudio delay circuit diagram
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AUDIO DELAY CIRCUIT DIAGRAM
Contextual Info: NJU26901 Digital Audio Delay ! Package ! General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 ! FEATURES • 2-Channel Audio Delay 24 bits data width . Delay Time 85msec at fs = 48kHz ( 128msec at fs = 32kHz , 43msec at fs = 96kHz)
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nju26901nju26901e285msec48khz+5128msec32khz43msec96khzaudio delay circuit diagram
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DIP24B
Contextual Info: •c > " m 'v ° !W 'ndB6 í*N c h o i co c > c c c > 0.51MIN c f i s PACKAGE DIMENSIONS DIP16 B 0 .7 6 M A X 7.62 t t A A A A A A Í 0 -1 5 “ U n itrm m DIP18 18 10 2 .4 9 M A X 5 2-4 Ñ W = ¿ s Nw^apa*RadioCoJM. Il ioI Oí s PACKAGE DIMENSIONS DIP24
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51mindip16dip18dip24+7nju9702dip40sdip22sdip24qfp80-ckdqfp80-ck2dip24b
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QFP80
Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18
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dip14dip14-d1dip16dip16-d2/d3+16dip18dip20dip22dip22-d2dip24dip24-d2qfp80sop40vqfn20jedec qfp100qfn28qfp44-a1qfp48sop20 packagesop28sop32
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Contextual Info: PACKAGE CODE • PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE EIAJ CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24
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dip14dip16dip18dip20+6dip22dip24dip40sdip22sdip24sdip28
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DIP18 package
Abstract: SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225
Contextual Info: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20
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dip14dip16dip16-d2/d3dip18+13dip20dip22dip22-d2dip24dip24-d2dip40dip18 packagesop20 packagessop10sdip22jedec ms-013eiajssop020-p-0225
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SOP18 EIAJ
Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18
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dip14dip14-d1dip16dip16-d2/d3+16dip18dip20dip22dip22-d2dip24dip24-d2sop18 eiajqfp64 packagejedec ms-013emp8 package dimensionjedec qfp80qfp80jedec qfp100qfp44-a1sop20 packagesop24 eiaj
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QFP80
Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
Contextual Info: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18
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dip14dip14-d1dip16dip16-d2/d3+12dip18dip20dip22dip22-d2dip24dip24-d2qfp80qfp44-a1sop20 packagesop28ssop10jedec ms-013
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1P040
Abstract: 0FP100
Contextual Info: PACKAGE CODE • PACKAGE GODE TABLE NJRC vs. EIAJ GODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. EIAJ CODE NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24
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dip14dip16dip18dip20+8dip22dip24dip40sdip22sdip24sdip281p0400fp100
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DIP18
Abstract: DIP20 DIP40
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18
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dip14dip14-d1dip16dip16-d2/d3+7dip18dip20dip22dip22-d2dip24dip24-d2dip40
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DIP18
Abstract: EIAJ SC67 EIAJ
Contextual Info: PACKAGE CODE TABLE » PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE EIAJ CODE NJRC CODE EIAJ CODE <DIP> <S0P> DIP8
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p008-p-0300s0p008-p-0225dip14dip014-p+8s0p18s0p018-p-0300dip16dip016-pop020-p-0300dip18eiaj sc67eiaj
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emp8 Package dimension
Abstract: TO252 thermal character SOT23-5 VH PAT-1 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 SSOP16
Contextual Info: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by
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ot23-5ot23-6sc88asc82ab+8emp8 package dimensionto252 thermal charactersot23-5 vhpat-1qfp80-c2ssop10ssop14ssop16
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SSOP14 pcb
Abstract: dmp 30 package DMP8 pcb pattern QFP80 SOP32 data sheet SSOP10 Package QFP-100C EMP20-E2 QFP64 package QFP80-C3
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when
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bcc32ssop14 pcbdmp 30 packagedmp8 pcb pattern+7qfp80sop32 data sheetssop10 packageqfp-100cemp20-e2qfp64 packageqfp80-c3
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EMP20-E2
Abstract: QFP80 QFP64 package QFP80-C3 SSOP20
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when
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o-252emp20-e2qfp80qfp64 package+2qfp80-c3ssop20
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EMP24-E3
Abstract: EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when
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DMP14
Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when
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bcc24bcc32bcc36dmp14+8dmp16emp14emp16-e2emp20-e2emp24-e3sdmp30dmp8 pcb patternqfp100-c2
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DMP8 pcb pattern
Abstract: BCC32 QFP80 QFP64-B3 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when
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Contextual Info: RECOMMENDED MOUNTING METHOD • RECONENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG REFLOW
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t0-220fdip14dip16dip18+6dip20dip22dip28dip40sdip22sdip24
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