THGBM4G4D1HBAIR
Abstract: TH58TVG5S2FBA49 thgbm4g5d1hbair TC58NVG3S0FTA00 TH58TAG7S2FBA89 TC58DVG3S0ETAI0 TH58TAG6S2FBA89 TH58NVG4S0FTA20 TH58NVG6S2FTA20 THGBM4G6D2HBAIR
Contextual Info: SEMICONDUCTOR GENERAL CATALOG Memories and Storage Devices NAND Flash Memory 1 2011/9 SCE0004L NAND Flash Memory SLC Small Block Capacity 512 Mbits 512 Mbits 512 Mbits 512 Mbits 512 Mbits 512 Mbits 1 Gbits 1 Gbits 1 Gbits 1 Gbits 1 Gbits 1 Gbits Part Number
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sce0004ltc58dvm92a5ta00tc58dvm92a5tai0tc58dvm92a5baj3+16tc58dym92a5ta00tc58dym92a5tai0tc58dym92a5baj3tc58dvg02a5ta00tc58dvg02a5tai0tc58dvg02a5baj4thgbm4g4d1hbairth58tvg5s2fba49thgbm4g5d1hbairtc58nvg3s0fta00th58tag7s2fba89tc58dvg3s0etai0th58tag6s2fba89th58nvg4s0fta20th58nvg6s2fta20thgbm4g6d2hbair
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toshiba emmc 4.4
Abstract: THGBM2G6D2FBAI9 THGBM2G7D4FBAI9 TC58DVG3S0ETA00 TOSHIBA eMMC CATALOG toshiba emmc THGBM THGBM3G TH58DVG4S0ETA20 TC58NVG0S3EBAI4
Contextual Info: SEMICONDUCTOR GENERAL CATALOG Memories and Storage Devices NAND Flash Memory 1 2010/9 SCE0004K NAND Flash Memory SLC Small Block Capacity Part Number 512 Mbits TC58DVM92A5TA00 * TC58DVM92A5BAJ3 * TC58DVG02A5TA00 * TC58DVG02A5BAJ4 * 512 Mbits 1 Gbits 1 Gbits
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2010/9sce0004k48-p-1220-0p-tfbga63-0813-0tc58dvm92a5ta00+13tc58dvm92a5baj3tc58dvg02a5ta00tc58dvg02a5baj4toshiba emmc 4.4thgbm2g6d2fbai9thgbm2g7d4fbai9tc58dvg3s0eta00toshiba emmc catalogtoshiba emmcthgbmthgbm3gth58dvg4s0eta20tc58nvg0s3ebai4
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Toshiba NAND BGA 224
Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
Contextual Info: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.
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p-tfbga169-1216-0toshiba nand bga 224toshiba emmctoshiba bga 224+7toshiba emmc 4.414gb emmc toshibathgbmthgbm3gemmc jedecthgbm3g5thgb
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Toshiba emmc
Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
Contextual Info: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.
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p-tfbga153-1113-0toshiba emmcthgbmemmc data retention+6toshiba nand bga 224thgbm3g4d1fbaigbga 221 emmctoshibatoshiba emmc performancethgbm3g
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SEM32G
Abstract: sandisk eMMC 4.41 emmc 4.41 spec JESD84-A441 eMMC 4.41 SEM04G emmc pcb layout SEM08G 153 ball eMMC memory sandisk 32GB Nand flash
Contextual Info: e.MMC 4.41 I/F Preliminary Data Sheet 80-36-03433 February 2010 SanDisk Corporation Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035 Phone 408 801-1000 • Fax (408) 801-8657 www.sandisk.com 80-36-03433 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet
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25-feb-10sem32gsandisk emmc 4.41emmc 4.41 spec+7jesd84-a441emmc 4.41sem04gemmc pcb layoutsem08g153 ball emmc memorysandisk 32gb nand flash
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Contextual Info: CYUSB303X EZ-USB FX3S SuperSpeed USB Controller EZ-USB® FX3S SuperSpeed USB Controller Features • ■ ■ ❐ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0
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Manufacturer ID list eMMC
Abstract: emmc 4.41 spec finder type 81.11
Contextual Info: Intel Atom Processor Z2760 Datasheet October 2012 Revision 1.0 Document Number: 328104-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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z2760manufacturer id list emmcemmc 4.41 specfinder type 81.11 |
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emmc 4.41 spec
Abstract: eMMC 4.41 emmc spec SD-DDR50 emmc 4.5 spec SDXC protocol emmc 4.41 firmware operation eMMC 4.41 application note MMC-DDR52 emmc v 4.41 operation mode
Contextual Info: CYUSB3035 EZ-USB FX3S SuperSpeed USB Controller Features • ■ ■ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
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cyusb3035100-mhzemmc 4.41 specemmc 4.41+8emmc specsd-ddr50emmc 4.5 specsdxc protocolemmc 4.41 firmware operationemmc 4.41 application notemmc-ddr52emmc v 4.41 operation mode
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eMMC 4.41
Abstract: emmc 4.41 spec emmc spec emmc 5.0 emmc cmd18 EMMC HOST CONTROLLER emmc 4.5 spec DAT70 TO-39, UVC eMMC 4.41 application note
Contextual Info: CYUSB3035 EZ-USB FX3S SuperSpeed USB Controller Features • ■ ■ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
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cyusb3035100-mhz16-bitemmc 4.41+9emmc 4.41 specemmc specemmc 5.0emmc cmd18emmc host controlleremmc 4.5 specdat70to-39, uvcemmc 4.41 application note
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CYUSB202X
Contextual Info: CYUSB202X SD2 USB and Mass Storage Peripheral Controller Features • ■ ■ ❐ ❐ Latest-generation storage support ❐ SD2.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master Ultra low-power in core power-down mode ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off
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CLKIN32
Contextual Info: CYUSB302x SD3 USB and Mass Storage Peripheral Controller Features • ■ ■ ■ ■ Latest-generation storage support ❐ SD3.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master ■ Independent power domains for core and I/O ■
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KLM8G2FEJA-A001
Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Contextual Info: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.
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8/16/32gbklmxgxfeja-x001klm8g2feja-a001klmag4feja-a001+7klm8g2fejaklmbg8feja-a001klmag4feja-b001klm8gsamsung emmc 4.5samsung emmc 4.41klmcgafeja-b001
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sony cmos sensor imx 179
Abstract: sony cmos sensor imx 174 sony cmos sensor imx 117 sony cmos sensor imx 175 IMX* Sony sony IMX 117 sony IMX 136 sony IMX 179 emmc 4.41 spec sony IMX cmos
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.1, 05/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information
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mcimx6lxdvn10xxmcimx6lxevn10xxsony cmos sensor imx 179sony cmos sensor imx 174+8sony cmos sensor imx 117sony cmos sensor imx 175imx* sonysony imx 117sony imx 136sony imx 179emmc 4.41 specsony imx cmos
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sony cmos sensor imx 174
Abstract: Sony imx 174 Sony IMX 145 CMOS
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 3, 04/2014 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information
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Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.1, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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sony IMX 136
Abstract: IMX6DQ6SDLSRM sony sensor imx 136 sony CMOS sensor imx 136 Sony imx 134 cmos sensor sony IMX 138 sony cmos sensor imx 123 sony cmos sensor imx 174 sony CMOS sensor imx 135 sony IMX 260
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.2, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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1080p64-bitddr3/lvddr3/lpddr2-1066sony imx 136+9imx6dq6sdlsrmsony sensor imx 136sony cmos sensor imx 136sony imx 134 cmos sensorsony imx 138sony cmos sensor imx 123sony cmos sensor imx 174sony cmos sensor imx 135sony imx 260
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IMX6DQ6SDLSRM
Abstract: Samsung eMMC 4.41 sony cmos sensor imx 174 sony cmos sensor imx 179 sony cmos sensor imx 175 sony IMX 136 sony CMOS sensor imx 136 sony IMX 138 LVDS to MIPI CSI Sony imx 134
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIxEC Rev. 2, 04/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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Sony imx 134
Abstract: IMX6DQ6SDLSRM Sony imx 134 cmos sensor Samsung eMMC 4.41 emmc 4.41 spec MIPI CSI-2 Parallel bridge LVDS to MIPI CSI MCIMX6Q5EYM10AC sony IMX 135 sony IMX 136
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCxEC Rev. 2, 04/2013 MCIMX6QxDxxxxC MCIMX6QxExxxxC MCIMX6DxDxxxxC MCIMX6DxExxxxC i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch
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sony imx 134imx6dq6sdlsrmsony imx 134 cmos sensorsamsung emmc 4.41+6emmc 4.41 specmipi csi-2 parallel bridgelvds to mipi csimcimx6q5eym10acsony imx 135sony imx 136
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Sony imx 147
Abstract: sony cmos sensor imx 174
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 2.2, 07/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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sony IMX 159 camera
Abstract: IMX6DQ6SDLSRM arm cortex a9 mpcore sony CMOS sensor imx 135 sony IMX 135 LVDS to MIPI CSI Samsung eMMC 4.41 MIPI CSI-2 Parallel bridge sony cmos sensor imx 174 sony IMX 132
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAxEC Rev. 2, 04/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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sony imx 159 cameraimx6dq6sdlsrmarm cortex a9 mpcoresony cmos sensor imx 135+6sony imx 135lvds to mipi csisamsung emmc 4.41mipi csi-2 parallel bridgesony cmos sensor imx 174sony imx 132
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SCIMX
Abstract: sony cmos sensor imx 174
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCEC Rev. 2.3, 07/2013 MCIMX6QxDxxxxC MCIMX6QxExxxxC MCIMX6DxDxxxxC MCIMX6DxExxxxC i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch
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samsung lcd tv circuits diagrams
Abstract: SCIMX IMX6DQ6SDLSRM
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCEC Rev. 2.2, 07/2013 MCIMX6QxDxxxxC MCIMX6QxExxxxC MCIMX6DxDxxxxC MCIMX6DxExxxxC i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch
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SCIMX
Abstract: IMX6DQ6SDLSRM IMX6DQCEC
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCEC Rev. 3, 02/2014 MCIMX6QxExxxxC MCIMX6QxExxxxD MCIMX6DxExxxxC MCIMX6DxExxxxD i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch
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sony IMX 117
Abstract: sony cmos sensor imx 117 IMX6DQ6SDLSRM IMX 206 SCIMX sony cmos sensor imx 174 MIPI 1 lane
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCEC Rev. 2.1, 07/2013 MCIMX6QxDxxxxC MCIMX6QxExxxxC MCIMX6DxDxxxxC MCIMX6DxExxxxC i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch
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