ELECTRONIC INDUSTRIES ALLIANCE Search Results

Contextual Info: A Tutorial on RS-485 Transceivers Introduction TIA/EIA-485 and TIA/EIA-422 also known as RS-485 and RS-422 are wired communication standards published by the Telecommunications Industry Association/Electronic Industries Alliance (TIA/EIA). They use differential signaling to enable data transmission over long distances and in noisy industrial and factory

6670a

Contextual Info: Application Guide IBIS Model ／ IBIS モデルについて • What is IBIS? ／ IBISとは？ IBIS is an abbreviation for "Input/Output Buffer Information Specification," a standard being developed by the IBIS Open Forum teamed by the EIA Electronic Industries Alliance in the US and allied associations. IBIS uses an ASCII format to describe the I/O buffer

POWER TRANSFORMER E154515

Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Contextual Info: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD

elmwood sensors ltd

Abstract: elmwood thermal switch saft rectifier ABB sensycon SICK OPTEX elmwood sensors Oscillatek abb entrelec relays Litton Electron Devices microwave tubes Anzac Electronics
Contextual Info: S OURCE ESB’ S Last Two Years of M ANUFACTURER N AME C HANGES Specifying and buying parts is hard enough without constant name changes due to manufacturing mergers, acquisitions and company spin-offs. Historically, each regional Electronics Source Book has diligently tracked these changes to save you time and headaches. We're happy to provide this

BGA and QFP Altera Package mounting profile

Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Contextual Info: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine

Contextual Info: For Immediate Release Cypress Opens Broadband Design Center In Alliance With Yamacraw, Georgia's State-Funded Broadband Initiative New Cypress Center Will Design Telecommunications and Optical-Networking Components, Georgia Gov. Roy Barnes Lauds Cypress's Participation

Contextual Info: Agilent Technologies U7245A GDDR5 Compliance Test Application for Infiniium 90000 Series Oscilloscope Data Sheet Test, debug and characterize your GDDR5 designs quickly and easily The Agilent Technologies U7245A GDDR5 compliance test application provides a fast and easy way to test, debug

s69 lf

Abstract: 4141II DEX ELECTRONICS LTD CAPACITOR 876-1421 bh 27 601 si419
Contextual Info: MC33164-3/MC34164M T I h e I C: n f i n i t e K P F L o w e r h (' 1 K I o f () \ I (. S 3V U ndervoltage P R O D U C T I O N n n o v a t i o n time after pow er returns. The MC33164-3 & MC34164-3 consist of a tem perature stable reference com parator with hysteresis, high-current clamping

JEDEC Jc-11 free

Abstract: Pub-95 TRANSISTOR Outlines JC11 JEP95 JEDEC diode Outlines IEC47D BGA OUTLINE DRAWING JEDEC bga case outline diode outlines
Contextual Info: JEDEC Publication 95 Microelectronic Package Standard Application Report 1999 Printed in U.S.A. 0199 SZZA006 JEDEC Publication 95 Microelectronic Package Standard SZZA006 January 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products

agriculture based electronics projects

Abstract: AUTOMATIC PLANT IRRIGATION SYSTEM mechanical engineering projects free microcontroller AUTOMATIC PLANT IRRIGATION SYSTEM 8051 microcontroller for pick and place robot 8086 microprocessor based project on alarm system Free Projects with assembly language 8086 Rf based remote control robot using 8051 electronic component tester project using 8051 mi automatic plant watering circuit
Contextual Info: 8 Training Tools 8 Training Tools Section 9 Design Consultants 9 Design Consultants 8 Training Tools  2001 Microchip Technology Inc. DS00104F-page 9-1 Design Consultants / Houses The Microchip Technology Consultant Program About the Microchip Technology Program and its members

JIG-101

Abstract: selenium EN5395 Beryllium Compounds Information Enpirion en5395qi Information Enpirion en5396qi
Contextual Info: Material Declaration Data Sheet ENPIRION Date Company Name Company Address Aug 12 2008 Enpirion, Inc 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 908-575-7550 www.enpirion.com EN5395QI, EN5396QI Voltage Mode Synchronous Buck PWM DC-DC Converter Module

Beryllium Compounds

Abstract: JIG-101 asbestos Enpirion EN5365QI EN5366QI SURVEY selenium material composition Information Enpirion en5366qi
Contextual Info: Material Declaration Data Sheet ENPIRION Date Company Name Company Address May 15 2008 Enpirion, Inc 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 908-575-7550 www.enpirion.com EN5365QI, EN5366QI Voltage Mode Synchronous Buck PWM DC-DC Converter Module

Material Composition Declaration

Contextual Info: Material Declaration Data Sheet ENPIRION Date Company Name Company Address May 15 2008 Enpirion, Inc 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 908-575-7550 www.enpirion.com EN5360D Voltage Mode Synchronous Buck PWM DC-DC Converter Module Integrated Circuit Module, 8.1x17 mm, 48-pin DFN, BT Substrate

Panasonic PBX 824

Abstract: YAZAKI 1012 thyristor bosch organizational structure samsung thyristor bosch 1012 I Q 500 cutler-hammer overload connector yazaki organizational structure of samsung company bosch 0 670 345 026 yazaki diode
Contextual Info: LITTELFUSE TODAY Littelfuse is a global company offering the broadest line of circuit protection products in the industry. Littelfuse products are vital components in literally every product that uses electrical energy. Computers, Internet servers, modems, cell phones, telecommunications equipment,

TRIPATH TECHNOLOGY

Abstract: TRIPATH Application of dsp in military science tripath for car audio amplifiers philips home theatre tripath for car audio Tripath Amplifier weitek
Contextual Info: CORPORATE INFORMATION Tripath Technology, Inc. Corporate Backgrounder Tripath Technology Inc. provides state-of-the-art Digital Power Processing solutions for a variety of applications in the computer, consumer audio and communications markets. The Santa Clara-based company’s first application of its

sharp cp 7700 speaker

Abstract: dimmer LED ford eec V 61H01
Contextual Info: Lighting Systems Catalog Grote: A Worldwide Leader in Vehicle Lighting and Safety Systems Echoing our growing proportion of international business, Grote has transitioned from a North American-based international to a true multi-national organization. Grote’s Madison, Indiana facility is our international

MA58AF14

Abstract: UP 5035 LCD METER MEV-50D-R PKGS-45TAV-R1 MEV-50C-R PKGS-00TAV-R PKGS-25TA-R MEV-50C DLW43SH MEV50DR
Contextual Info: K35E.pdf Oct.3,2012 Murata Products for Automotive K35E.pdf Oct.3,2012 Introduction Murata’s ceramic electronic components – leading the next generation of automotive electronics. Automobiles and automotive devices are becoming more intelligent and optimized

ADV0901

Abstract: EIA-556 Shipping label
Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0901 IMPLEMENTING NEW SHIPPING CARTON LABEL Change Description Altera is implementing a new shipping label for all product shipments, effective immediately. Recommended Action No action is required as a result of this change.

IPC-6012

Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel

IPC-6011

Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications

EIA-481-B

Abstract: EPAD-TQFP-32 EIA-481-B SOIC MSOP-10 SOIC-14 SOIC-16 SOIC-18 SOIC-20 SOIC-24 SOIC-28
Contextual Info: Packaging for Automatic Handling Tape & Reel, Tape Strip and Ammo Pack General Description Tape & Reel Surface mount and TO-92 devices are available in tape and reel packaging. Surface mount components are retained in an embossed carrier tape by a cover tape. TO-92 device leads are

56mm carrier tape

Abstract: EIA 481 TSSOP EIA-481-B MLF22D-06L SOIC-18 SY100EP140LZI MSOP-10 SOIC-14 SOIC-16 SOIC-20
Contextual Info: Packaging for Automatic Handling Tape & Reel, Tape Strip and Ammo Pack General Description Tape & Reel Surface mount and TO-92 devices are available in tape and reel packaging. Surface mount components are retained in an embossed carrier tape by a cover tape. TO-92 device leads are

AMP MT CONNECTOR

Abstract: simel Tyco amp connectors Tyco automotive connectors Tyco amp automotive connectors simel CONNECTORS tyco 1382345-1 agastat Manufacturer Logos
Contextual Info: For Immediate Release Contact: Robert L. Williams, Jr. Tyco Electronics Corporation bob.williams@tycoelectronics.com www.amp.com/fiberoptics Tyco Electronics Releases AMP ESCON Multimode MT-RJ Transceiver. Harrisburg, PA, September 25, 2000 - Tyco Electronics Corporation, a unit of Tyco

IEEE Standard 803.2

Abstract: RJ45 connector IEEE 802.3 amp sca-2 IEEE ethernet 803.2
Contextual Info: Catalog 1307515 Issued 9-99 Industry Standards Reference Chart Standard Description Typical AM P Connectors Section IEEE 802.3 10BASE-T http://standards.ieee.org IEEE 802.3 standards for 10Mb/s Ethernet over unshielded twisted pair or 150 Ohm cables 8 position Modular Jacks and Plugs that