EL68B
Contextual Info: 68 Lead Ceramic Quad J-Bend Dual Cavity NS Package Number EL68B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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transistor BC 458
Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and
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ms011795transistor bc 458transistor bc 945ac 1084+7transistor bc 577transistor bc 585ms-015-abtransistor a42bd 743 transistorua109ca 358 ae
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ceramic package
Abstract: EL28A EL44A EL44B EL44C EL52A EL68A EL68B EL68C EL84A
Contextual Info: Ceramic Quad J-Bend CQJB 28 Lead Ceramic Quad J-Bend NS Package Number EL28A 2000 National Semiconductor Corporation MS101106 www.national.com Ceramic Quad J-Bend (CQJB) August 1999 Ceramic Quad J-Bend (CQJB) 44 Lead Ceramic Quad J-Bend NS Package Number EL44A
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el28ams101106el44ael44b+7el44cel52ael68aceramic packageel68bel68cel84a
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iso 1043-1
Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120iso 1043-1 polypropylenej1344sae j1344w28bd1972din6120d24jta11a
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iso 1043-1
Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120sae j1344j1344w28ciso 1043-1 polypropylenebga shipping traysmec34bga outline drawingtsop package tray
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transistor BC 458
Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and
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transistor bc 458transistor a42mo-003transistor bc 540+6ua109aceramic pin grid array cpga lead frametransistor bc 577w144aua65aceramic quad flatpack cqfp
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