EHP14 Search Results
EHP14 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: RECOMMENDED MOUNTING METHOD • RECOMMENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92 |
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T0-220F DIP14 DIP16 DIP18 DIP20 DIP22 DIP28 DIP40 SDIP22 SDIP24 | |
Contextual Info: RECOMMENDED MOUNTING METHOD • RECONENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG REFLOW |
OCR Scan |
T0-220F DIP14 DIP16 DIP18 DIP20 DIP22 DIP28 DIP40 SDIP22 SDIP24 | |
EHP14Contextual Info: NJG1304E G a A s POWER A M P L I F I E R 1C • GENERAL DESCRIPTION NJG1304E is a GaAs MM IC designed mainly for driver ■ PACKAGE OUTLINE amplifier of PHS base station in Japan. This is a variable gain type with 20dB dynamic range. It features very low distortion and P « = d is |
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NJG1304E NJG1304E -70dBc 17dBm 17dBm) 180mA EHP14 300kH | |
DIP18
Abstract: EIAJ SC67 EIAJ
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OCR Scan |
P008-P-0300 S0P008-P-0225 DIP14 DIP014-Pâ S0P18 S0P018-P-0300 DIP16 DIP016-Pâ OP020-P-0300 DIP18 DIP18 EIAJ SC67 EIAJ |