EFTEC 64 Search Results

MLX90222

Abstract: eme 6300h Temperature controller schematic
Contextual Info: MLX90222 Low Power Switch with Sleep Controller Features and Benefits Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption On Chip Duty Cycle Controller Applications

eftec

Abstract: Eftec 64t MLX90222 6300H eme 6300h
Contextual Info:

         • ■ ■ ■ ■      Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption

Contextual Info: 0/;<3555# /RZ#3RZHU#6ZLWFK#ZLWK#6OHHS#&RQWUROOHU# HDWXUHV#DQG#%HQHILWV# # \ U D LQ LO P H U 3 Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption On Chip Duty Cycle Controller

7320CR

Abstract: Eftec 64t
Contextual Info: 03/06/2003 RELIABILITY REPORT FOR DS21552, Rev B1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

MLX90222

Contextual Info: 0/;<3555# /RZ#3RZHU#6ZLWFK#ZLWK#6OHHS#&RQWUROOHU# HDWXUHV#DQG#%HQHILWV# # \ U D LQ LO P H U 3 Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption On Chip Duty Cycle Controller

Eftec

Abstract: Eftec ra 310 SUMITOMO EME G
Contextual Info: MLX90223 Two Wire Switch# Features and Benefits • ■ ■ ■ # \ U D LQ LO P H U 3 Two wire operation CMOS for optimum stability, quality and cost New miniature package / thin, high reliability package Operation down to 3.5V Applications ■ ■ ■ Automotive reed switch replacement

u28 sensor hall

Abstract: u28 hall UGN3132 UGN3132/33
Contextual Info: US2881/2882 CMOS High Sensitivity Latch Features and Benefits n n n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality, and cost

u28 sensor hall

Abstract: u28 hall UGN3132 hall u28 u28 127 hall US2881UA 22323 US2881SO u28 hall SENSOR sot transistor pinout
Contextual Info: US2881/2882 CMOS High Sensitivity Latch Features and Benefits • ■ ■ ■ ■ ■ ■ Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality, and cost

marking 23ab

Abstract: eftec 6300H marking Z1 sot mlx 220 eme sot23
Contextual Info: 0/;<3556# 7ZR#:LUH#6ZLWFK# HDWXUHV#DQG#%HQHILWV# • ■ ■ ■ # \ U D LQ LO P H U 3 Two Wire operation CMOS for Optimum Stability, Quality and Cost New Miniature Package/Thin, High Reliability Package# Operation Down to 3.5V # $SSOLFDWLRQV# ■ ■ ■

3 PIN hall effect sensor u58

Abstract: A3121 8 pin U58 Hall Effect US5881 equivalent SOT MARKING 213 6300H hall effect sensor u58 ic last digit of year Eftec 64t us5881ua
Contextual Info: US5881 CMOS Multi-Purpose Switch Features and Benefits n n n n Chopper stabilized amplifier stage New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost Applications n n n n n Solid state switch

UGN3075

Abstract: HAL125 u18 hall US1881UA US1881 ss41 hall Transistor sS41 melexis replace HAL105 Cross Reference sot23
Contextual Info: US1881 CMOS Multi-Purpose Latch Features and Benefits Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost Applications

US1881

Abstract: UGN-3075
Contextual Info: US1881 CMOS Multi-Purpose Latch Features and Benefits## n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost

ic 9022

Abstract: MLX90223ESO
Contextual Info: MLX90223 Two Wire Switch# Features and Benefits # \ U D LQ LO P H U 3 Two wire operation CMOS for optimum stability, quality and cost New miniature package / thin, high reliability package Operation down to 3.5V Applications Automotive reed switch replacement

Transistor D 1881

Abstract: u18 sensor hall Transistor sS41 ugn3075 hall sensor u18 HAL125 DD 127 D transistor HAL105 HAL115 Transistor hall ss41
Contextual Info: 864;4# &026#0XOWL03XUSRVH#/DWFK#### HDWXUHV#DQG#%HQHILWV## • ■ ■ ■ ■ Chopper Stabilized Amplifier Stage Optimized for BDC Motor Applications New Miniature Package/Thin, High Reliability Package# Operation Down to 3.5V CMOS for Optimum Stability, Quality and Cost####

U58 Hall Effect

Abstract: 3 PIN hall effect sensor u58 A3121 8 pin U58 hall sensor sensor u58 SUMITOMO EME G us5881ua hall effect sensor u58 ic last digit of year eftec
Contextual Info: US5881 CMOS Multi-Purpose Switch Features and Benefits • ■ ■ ■ Chopper stabilized amplifier stage New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost Applications ■ ■ ■ ■

CMV300

Abstract: ss41 hall effect sensor ugn3075 U38 HALL UGN-3075 HALL EFFECT CHIP
Contextual Info: US3881 CMOS Low Voltage Hall Effect Latch Features and Benefits n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 2.2V CMOS for optimum stability, quality, and cost

ss41 hall effect sensor

Abstract: UGN3075 U38 HALL SOT23 hall ss41 hall hall effect sensor ugn3175 Bipolar Hall Hall Sensor 4-lead Transistor hall ss41 3 PIN hall effect sensor
Contextual Info: US3881 CMOS Low Voltage Hall Effect Latch Features and Benefits n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 2.2V CMOS for optimum stability, quality, and cost

UGN3075

Abstract: ss41 hall effect sensor US3881 HALL SOT-23 U38 HALL HAL105 HAL115 HAL125 US3881UA marking 866
Contextual Info: 866;4# &026#/RZ#9ROWDJH#+DOO# IIHFW#/DWFK#### HDWXUHV#DQG#%HQHILWV## • ■ ■ ■ ■ Chopper Stabilized Amplifier Stage Optimized for BDC Motor Applications New Miniature Package/Thin, High Reliability Package# Operation Down to 2.2V CMOS for Optimum Stability, Quality and Cost

UGN3075

Abstract: US1881 Transistor D 1881 Melexis cross reference
Contextual Info: US1881 CMOS Multi-Purpose Latch Features and Benefits## Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost Applications

texas instruments packing label

Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
Contextual Info: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make

u28 sensor hall

Abstract: MLX2882 u28 hall marking 865 amplifier TLE4905 equivalent ss41 hall effect sensor melexis hall current sensor HAL105 UGN3132/33/34UA US2881
Contextual Info: 865;425;5# &026#+LJK#6HQVLWLYLW\#/DWFK#### HDWXUHV#DQG#%HQHILWV## • ■ ■ ■ ■ ■ Chopper Stabilized Amplifier Stage Optimized for BDC Motor Applications New Miniature Package/Thin, High Reliability Package# Operation Down to 3.5V CMOS for Optimum Stability, Quality and Cost

olin 7025

Abstract: eftec MPA 68 Eftec 64t sn 8400 7025 alloy lead frame resistivity table eftec-64t tamac X10-4
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina

OC-106 94V0 C

Abstract: olin 7025 CDA 194 Tamac4 eftec 7025 alloy lead frame sn 8400 Au Sn eutectic thermal conductivity Eftec 64t
Contextual Info: 2 5 Physical Constants of IC Package Materials 1/16/97 3:41 PM CH05WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 5 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS The Table 5-1 through Table 5-5 list typical values for selected properties of materials used in

olin 7025

Abstract: Tamac4 TAMAC-4 7025 alloy lead frame CDA 194 sn 8400 eftec eftec-64t C10B4 tamac
Contextual Info: CHAPTER 5 SELECTED PROPERTIES OF IC PACKAGE MATERIALS The following tables list typical values for selected properties of materials used in IC packages Table 5-1 Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units