|
59112-F32-18-076LF
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 36 Positions. |
PDF
|
|
|
54122-807601150LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 60 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
59112-F34-18-076LF
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 36 Positions. |
PDF
|
|
|
TMS320F28076PTPS
|
|
Texas Instruments
|
Piccolo™ 32-bit MCU with 120 MHz, FPU, TMU, 512 KB Flash, CLA, SDFM 176-HLQFP -45 to 125 |
|
|
|
TMS320F28076PZPS
|
|
Texas Instruments
|
Piccolo™ 32-bit MCU with 120 MHz, FPU, TMU, 512 KB Flash, CLA, SDFM 100-HTQFP -40 to 125 |
|
|
