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95278-802-18LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating |
PDF
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10131318-02111G0LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 2 Positions, GW Compatible Nylon66, Tray Packing. |
PDF
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10131318-0211100LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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68021-304HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 04 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68021-216HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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