E174545 Search Results

ARB MARKING

Abstract: E174545 those were the days MARKING CODE ARB M5200
Contextual Info: 1flS$ Scott aoutovarri 3anaC ta *.C *«om l» 9S35JM16J (408} 905- 2*00 FAX No. (406 ¿» -3 2 5 6 Underwriters Laboratories Inc.« E174545, 98SC428X6 c* uunc s*m cura. & November 3, 1990 Bourns Multifuse Riverside, CA Fax No; 1-909’781-5555 Attention:

INSPECTION procedure

Abstract: l454s MARKING CODE WU multifuse 00SC03434 TNILF MF-R01
Contextual Info: 1655 Scott Boulevard S â ir.a C lara, CaJiform a 95C5C-4169 United States Country Code 1 (408) 985-2400 F A X No. (408) 29S-325É http://www.ul com Underwriters Laboratories Inc.« E174545, 00SC09434 September 2 5, 2 000 Bourns Multifuse c/o Bourns Multifuse (Taiwan) Ltd,

MF-SM030

Abstract: MF-SM050 MF-SM075 MF-SM100 MF-SM125 MF-SM150
Contextual Info: *R & oHS AE C C OM AP P PR LI OV AN ED T Features • Compliant with AEC-Q200 Rev-C- Stress ■ RoHS compliant* and halogen free* Test Qualification for Passive Components in Automotive Applications ■ Surface Mount Devices ■ Fully compatible with current

Contextual Info: NT Features S CO M PL IA • *R oH ■ ■ ■ ■ Applications 100 % electrically compatible with all previous generations of 1812 SMT devices Compatible with Pb and Pb-free solder reflow profiles Surface mount packaging for automated assembly RoHS compliant*

Contextual Info: NT Features S CO M PL IA • *R oH ■ ■ ■ ■ Applications 100 % electrically compatible with all previous generations of 1812 SMT devices Compatible with Pb and Pb-free solder reflow profiles Surface mount packaging for automated assembly RoHS compliant*

Contextual Info: IA NT Features • Surface Mount Devices Fully compatible with current industry standards Packaged per EIA 481-2 standard RoHS compliant* ■ Agency recognition: CO M PL ■ ■ *R oH S Applications ■ Almost anywhere there is a low voltage power supply and a load to be protected,

MF-NSMF020X

Abstract: MF-NSMF035X MF-NSMF
Contextual Info: PL IA NT CO M *R oH S Features Applications • Compact design to save board space - ■ USB port protection - USB 2.0, 3.0 & OTG ■ ■ ■ ■ ■ 1206 footprint Small size results in very fast time to react to fault events Symmetrical design Low profile

Contextual Info: *R & oHS AE C C OM AP P PR LI OV AN ED T Features • Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications ■ 100 % electrically compatible with all previous generations of 1812 SMT devices ■ Compatible with Pb and Pb-free solder

Contextual Info: PL IA NT Applications • Compact design to save board space - ■ USB port protection - USB 2.0, 3.0 & OTG *R oH S CO M Features ■ ■ ■ ■ ■ 1206 footprint Small size results in very fast time to react to fault events Symmetrical design Low profile

Contextual Info: Features • ■ ■ ■ The MF-USMD Series is currently available, although not recommended for new designs. The MF-USMF Series is preferred. Very small size 1210 footprint - 44 % smaller design than MF-MSMD Series Fast tripping resettable circuit protection

CA110338

Abstract: 01B6 E174545
Contextual Info: IA NT Features CO M PL • *R oH S ■ ■ ■ ■ Applications Fast tripping resettable circuit protection Surface mount packaging for automated assembly Small footprint size 1210 RoHS compliant* Agency recognition: Game consoles PC motherboards USB current-limiting compliance

Contextual Info: NT Features S CO M PL IA • *R oH ■ ■ ■ ■ Applications 100 % electrically compatible with all previous generations of 1812 SMT devices Compatible with Pb and Pb-free solder reflow profiles Surface mount packaging for automated assembly RoHS compliant*

Contextual Info: PL IA NT CO M *R oH S Features Applications • Compact design to save board space - ■ USB port protection ■ ■ ■ ■ 0603 footprint Small size results in very fast time to react to fault events Low profile RoHS compliant* and halogen free* Agency recognition:

MF-SM030-2-99

Abstract: MF-SM030 MF-SM050 MF-SM075 MF-SM100 MF-SM125 MF-SM150 MF-SM200
Contextual Info: *R & oHS AE C C OM AP P PR LI OV AN ED T Features • ■ ■ ■ Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications Surface Mount Devices Fully compatible with current industry standards Packaged per EIA 481-2 standard

MF-MSMF020

Abstract: C20times MF-MSMF010 MF-MSMF014 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF110 MF-MSMF125
Contextual Info: NT Features S CO M PL IA • *R oH ■ ■ ■ ■ Applications 100 % electrically compatible with all previous generations of 1812 SMT devices Compatible with Pb and Pb-free solder reflow profiles Surface mount packaging for automated assembly RoHS compliant*

E174545

Abstract: CA110338
Contextual Info: Features Applications • Fast tripping resettable circuit protection Surface mount packaging for automated assembly Very low internal resistance Patents pending 100 °C trip temperature ■ Agency recognition: ■ ■ ■ ■ ■ Battery cell protection MF-ESMD Series - PTC Resettable Fuses

J-STD-002

Abstract: CA110338 E174545 C0804
Contextual Info: Features • ■ ■ ■ ■ ■ ■ Applications Very low profile Very fast tripping time High voltage Lead-free construction Symmetrical 2018 footprint Agency recognition: ■ ■ ■ Power Over Ethernet IEEE 802.3 af port protection Automotive electronic control module

CA110338

Contextual Info: PL IA NT Features CO M • *R oH S ■ ■ ■ ■ ■ ■ Applications Very low profile Very fast tripping time High voltage RoHS compliant* Symmetrical 2018 footprint Agency recognition: Power Over Ethernet IEEE 802.3 af port protection Automotive electronic control module

Contextual Info: NT Features S CO M PL IA • *R oH ■ ■ ■ ■ ■ Applications Compact design to save board space 1206 footprint Small size results in very fast time to react to fault events Symmetrical design Low profile RoHS compliant* Agency recognition: USB port protection - On the Go and 2.0

276 208F

Contextual Info: Features • ■ ■ ■ Applications Very small size 1210 footprint - 44 % smaller design than MF-MSMD Series Fast tripping resettable circuit protection Surface mount packaging for automated assembly ■ Agency recognition: ■ ■ ■ ■ ■ PC motherboards

MF-SM030

Abstract: MF-SM050 MF-SM075 MF-SM100 MF-SM125 MF-SM150 MF-SM030-2-99
Contextual Info: *R & oHS AE C C OM AP P PR LI OV AN ED T Features • ■ ■ ■ Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications Surface Mount Devices Fully compatible with current industry standards Packaged per EIA 481-2 standard

Contextual Info: PL IA NT CO M *R oH S Features Applications • Compact design to save board space - ■ USB port protection - USB 2.0, 3.0 & OTG ■ ■ ■ ■ ■ 1206 footprint Small size results in very fast time to react to fault events Symmetrical design Low profile

MF-MSMF030

Abstract: MF-MSMF Series PART MARKING MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF050 MF-MSMF075 MF-MSMF110 MF-MSMF125 MF-MSMF150
Contextual Info: IA NT Features oH S CO M PL • *R ■ ■ ■ ■ Applications 100 % compatible with all previous generations of 1812 SMT devices Compatible with Pb and Pb-free solder reflow profiles Surface mount packaging for automated assembly RoHS compliant* Agency recognition:

Contextual Info: CO LO & MP LI GE AN N T FR EE Features Applications • Surface mount packaging for automated ■ Thermal protection for Li-ion and polymer * HA *R oH S ■ ■ ■ ■ assembly Small footprint size 1210 and low profile for space-constrained mobile applications