E128K Search Results

Contextual Info: T I I I I I I I I I I I I I I I I r ACT-E128K32 High Speed 4 Megabit EEPROM Multichip Module J I I I I I I I I I I Q I I I I I I I I I I I L er o flex CIRCUIT TECHNOLOGY Features www.aeroflex.com • 4 Low Power 128K x 8 EEPROM Die in One MCM Package ■ Packaging - Hermetic Ceramic

AS27C256-20JM

Abstract: WF1M32B-100G2UM3 qp7c199 ACT-S512K32N-017P7Q QP7C1009B-20DMB WF1M32B-120G2UM3 IDT71256L25TCB AS5C2008 AS8S512K32Q 57C256F-55
Contextual Info: Part Number 1 of 66 Config Device Type Volt Packages Micross Part Number SMD 5962- 57C256F-55 32Kx8 UVEPROM 5V 57C256F-55 32Kx8 UVEPROM 5V 57C256F-70 32Kx8 UVEPROM 5V 57C256F-70 32Kx8 UVEPROM 5V ACT-E128K32C120P7Q 128Kx32 EEPROM 5V ACT-E128K32C140P7Q 128Kx32 EEPROM 5V

Contextual Info: I/M-IITE /M IC R O ELEC T R O N IC S WE512K8, WE256K8, E128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES FIG. 1 P IN C O N F IG U R A T IO N T O P V IE W L 1 A16 r 2 A15 [7 3 32 A12 4 29 A7C 5 A6 [T 6 A5 E 7

Contextual Info: E128K8-XXX WHITE /MICROELECTRONICS 128Kx8 CMOS MONOLITHIC EEPROM, SMD 5962-96796 FEATURES FIG. 1 • Read Access Tim es of 140,150, 200, 250, 300nS PIN CONFIGURATION ■ JEDEC Approved Packages 32 DIP 32 C S O J • 32 pin, Hermetic Ceramic, 0.600" DIP Package 300

Contextual Info: TT WHITE /M ICRO ELECTRO N ICS WE512K8, WE256K8, E128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, S M D 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES FIG. 1 PIN C O N FIG U R A T IO N T O P VIEW A18Ü 1 32 □ v cc A16 C 2 31 □ W E A15 C 3 30 □ A 17 A12Ü 4

Contextual Info: E128K8-XXXE W h it e E l e c t r o n ic D e sig n s C o r p o r a t io n 128Kx8 CMOS MONOLITHIC EEPROM ADVANCED* FEATURES FIG. 1 • Access Tim es of 150, 200, 250, 300ns PIN CONFIGURATION ■ JEDEC Approved Packages 32 DIP 32 CSOJ • 32 pin, Hermetic Ceramic, 0.600" DIP Package 300

AT91BOOTSTRAP

Abstract: uboot SD buildroot arm Getting Started with the AT91SAM9261 320x240 TFT Touchscreen AT73C213 AT91SAM9261 Atmel touchscreen at45db AT91SAM9261EK
Contextual Info: SAM9-L9261 User Manual All boards produced by Olimex are ROHS compliant Rev.C, September 2009 Copyright c 2009, OLIMEX Ltd, All rights reserved INTRODUCTION: SAM9-L9261 is a development platform with ARM9 microcontroller, TFT LCD 3.5" 320x240 pixels with TOUCHSCREEN, 64MB SDRAM and 512MB

Contextual Info: a E128K16-XXX WHITE /MICROELECTRONICS 128Kx16 SRAM /EEPR O M MODULE PRELIM INARY * FEATURES • C om m ercial, Industrial and M i lita r y Te m p e ra tu re Ranges ■ A cce ss Tim es of 35ns SRAM and 150ns (EEPROM) ■ TTL C om p a tib le Inputs and O utputs

Contextual Info: E128K8-XXX W hite El e c t r o n ic D esigns C o r p o r a t i o n 128Kx8 CMOS MONOLITHIC EEPROM. SMD 5962-96796 FEATURES FIG. 1 • Read Access Tim es of 1 2 0 ,1 4 0 ,1 5 0 , 200, 250, 300ns PIN CONFIGURATION ■ JEDEC Approved Packages 32 DIP 32 CSOJ

Contextual Info: W h it e E l e c t r o n ic D e s ig n s C o r p o r a t io n E128K8-XXX 128Kx8 CMOS MONOLITHIC EEPROM, SMD 5962-96796 FEATURES FIG. 1 • Read Access Tim es of 120,140, 150, 200, 250, 300ns PIN CONFIGURATION ■ JEDEC Approved Packages 32 DIP 32 C S O J

Contextual Info: VZÀ M/HITE /M ICRO ELECTRO N ICS 128Kx32 EEPROM MODULE E128K32-XXX • Automatic Page W rite Operation ■ Page W rite Cycle Tim e: lO m SM ax FEATU RES ■ Data Polling for End of W rite Detection ■ A ccess Tim es of 150nS, 200nS, 250nS and 300nS ■ Hardware and Software Data Protection

ACT-E128K32N-150F2Q

Contextual Info: ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module CIRCUIT TECHNOLOGY Features www.aeroflex.com • 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Package ■ Organized as 128K x 32 ● User 66 Pin, 1.08" x 1.08" x .160" PGA Type, No Shoulder,

WE128K32NP-XH1X

Contextual Info: E128K32-XXX W hite El e c t r o n ic D esigns C o r p o r a t i o n 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • Access Tim es of 1 2 0 ,1 4 0 ,1 5 0 , 200, 250, 300ns ■ Low Power CMOS ■ Packaging: ■ Autom atic Page W rite Operation ■ Page W rite Cycle Time: 10ms M ax

Contextual Info: a E128K32-XXX WHITE /M ICRO ELECTRO N ICS 128Kx32 EEPROM MODULE, S M D 5962-94585 FEATURES • A c c ess T im e s of 140, 150, 200, 250, 3 00ns ■ ■ Packaging: ■ A u to m a tic Page W r it e O p e ra tio n • 66-pin, PGA Typ e, 1.075 inch sq uare, H e rm e tic C eram ic

Contextual Info: WHITE M I C R O E L E C T R O N I C S WE512K8, WE256K8, E128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CM OS EEPROM MODULE FEATURES FIG. 1 PIN C O N F IG U R A T IO N T O P V IE W 32 □ V . 31 □ WE 30 □ A17 A18C 1 A16C 2 A15C 3

Contextual Info: E128K32-XXX W HITE M I C R O E L E C T R O N I C S m 128Kx32 EEPROM MODULE, SM D 5962-94585 FEATURES A cc e ss Tim es of 140, 150, 200, 250, 300ns • Page W r it e C ycle Tim e: ■ Packaging: ■ D ata Po llin g for End of W r it e D etection • 66-pin, P G A Type, 1.075 inch square, H erm etic Ceram ic

Contextual Info: E128K32-XXX M/HITE /MICROELECTRONICS g 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • A c c e s s T im e s o f 1 4 0 ,1 5 0 , 20 0 , 2 50, 3 0 0 n s ■ Lo w P o w e r C M O S ■ P a c k a g in g : ■ A u to m a tic P a g e W rite O p e ra tio n • 6 6 -p in , P G A T y p e , 1 .0 7 5 inch s q u a re , H e rm e tic C e ra m ic

Contextual Info: E128K32-XXX M/HITE /M ICROELECTRONICS G 2 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • Access Tim es of 140,150, 200, 250, 300ns ■ Low Power CMOS ■ Packaging: ■ A utom atic Page W rite Operation ■ Page W rite Cycle Time: 10ms M ax • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic

Contextual Info: ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module CIRCUIT TECHNOLOGY Features www.aeroflex.com 4 Low Power 128K x 8 EEPROM Die in One MCM • Packaging – Hermetic Ceramic Package ● 66 Pin, 1.08" x 1.08" x .160" PGA Type, No Shoulder, Aeroflex code# "P3"

se micro-electronics da

Contextual Info: E128K8-XDEX WHITE /M IC R O E L E C T R O N IC S 128 Kx 8 CMOS MONOLITHIC EEPROM PRELIMINARY* FEATURES FIG. 1 • Read A ccess Times of 150, 200, 250 and 300nS PIN CO N F IG U R A T IO N TOP VIEW 1 32 □ V cc A16C 2 31 □ w l NCC A15 C 3 30 □ n c A 12 C 4

05HMX

Contextual Info: E128K32-XXX M/HITE /MICROELECTRONICS 128Kx32 EEPROM MODULE, SMD NUMBER 5962-94585 pending FEATURES • Access Times o f 140,150, 200, 250, 300ns ■ Low Power CMOS ■ Packaging: ■ Autom atic Page W rite Operation • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic

Contextual Info: E128K8-XXXE W hite El e c t r o n ic D esigns C o r p o r a t i o n 128Kx8 CMOS MONOLITHIC EEPROM ADVANCED* FEATURES FIG. 1 • Access Tim es of 150, 200, 250, 300ns PIN C O N FIG U R A TIO N ■ JEDEC Approved Packages 3 2 D IP • 32 pin, Hermetic Ceramic, 0.600" DIP Package 300

Contextual Info: G2 E128K8-XXX M/HITE /MICROELECTRONICS 128Kx8 CMOS MONOLITHIC EEPROM, SMD 5962-96796 FEATURES FIG. 1 • Read Access Tim es of 140,150, 200, 250, 300ns PIN C O N FIG U R A T IO N ■ JEDEC Approved Packages 32 DIP 32 CSOJ • 32 pin, Herm etic Ceramic, 0.600" DIP Package 300

E128K32

Abstract: military mcm 1553 ACT-E128K32N-150F2Q E128
Contextual Info: ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module CIRCUIT TECHNOLOGY Features www.aeroflex.com • 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Package ■ Organized as 128K x 32 ● User 66 Pin, 1.08" x 1.08" x .160" PGA Type, No Shoulder,