E1269 Search Results

SED1330

Contextual Info: These drawings and specifications are the property of Densitron Corporation and may not be reproduced, copied or used without written permission 1. 2. 3. 4. REVISIONS REV. DESCRIPTION A RELEASED ON ECN #E1269 DATE APPROVED 02/12/02 MA Specification subject to change without notice.

RJ45 speed tech

Abstract: HALO HFJ11-S101E-s1 HFJ11-S101E-s1 HFJ11-S101E hfj11 speed tech rj45 S101E
Contextual Info: APPROVED MANUFACTURERS LIST FOR WEB PARTS 498-0070 -WEB ITEM NUMBER PART DESCRIPTION CONNECTOR/TRANSFORMER RJ45 10 BASE-T REVISION HISTORY Rev B C D ECO # Description of Change E12399 Release part to web store. E12694 Add Speed Tech part. E12784 REMOVE SPEED TECH/PRIDE TECH.

Toshiba TLX-1741-C3M LCD display

Abstract: kcb104vg2ca-a43 LQ088H9DR01 TOSHIBA TLX-1741-C3M KCS077VG2EA-A43 LM32P073 tlx-1741-c3m M170EN04 LP104S06-A1 DMF50081N
Contextual Info: LCD Module to ERG Inverter Part Number Cross-Reference Guide LCD Manufacturer Acer Acer AND AND AND AND AND AND AND AND AND AND AND AND AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics

bergquist

Abstract: 2500S2
Contextual Info: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at

Contextual Info: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier

a3000

Contextual Info: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating

Contextual Info: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at

Contextual Info: Gap Pad VO Ultimate Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits • Thermal conductivity: 1.3 W/m-K • Ultra conformability • Gel-like modulus TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE PROPERTY

Contextual Info: Gap Pad VO Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: 0.8 W/m-K • Enhanced puncture, shear and tear resistance • Conformable gap filling material • Electrically isolating

Contextual Info: Gap Pad HC1000 “Gel-Like” Modulus Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC1000 PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Fiberglass reinforced for puncture,

bergquist

Abstract: BERGQUIST GP1500 E1269 D149 D150 D2240 D257 D374 D575 D792
Contextual Info: Gap Pad 1500 Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Un-reinforced construction for additional compliancy • Conformable, low hardness

Contextual Info: Gap Filler 1100SF Two-Part Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction

Contextual Info: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits • High thermal conductivity: 5 W/m-K • Highly conformable,“S-Class” softness TYPICAL PROPERTIES OF GAP PAD 5000S35 PROPERTY Color IMPERIAL VALUE

gf3500s35

Abstract: GF-3500 D2196 3500S35 GF35 D149 D150 D2240 D257 D792
Contextual Info: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 • Thermal conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage

Contextual Info: Gap Pad 1000SF Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1000SF PROPERTY Color • Thermal conductivity: 0.9 W/m-K • No silicone outgassing • No silicone extraction • Reduced tack on one side to aid in

Contextual Info: Gap Pad VO Soft Highly Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO SOFT • Thermal conductivity: 0.8 W/m-K • Conformable, low hardness • Enhanced puncture, shear and tear resistance

Contextual Info: Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus

bergquist

Contextual Info: Sil-Pad A2000 Higher Performance, High Reliability Insulator Features and Benefits • Thermal impedance: 0.32°C-in2/W @50 psi • Optimal heat transfer • High thermal conductivity: 3.0 W/m-K TYPICAL PROPERTIES OF SIL-PAD A2000 PROPERTY Color IMPERIAL VALUE

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

bergquist

Abstract: D575 E1269 5000S35 D149 D150 D2240 D257 D374 D792
Contextual Info: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits TYPICAL PROPERTIES OF GAP PAD 5000S35 • High thermal conductivity: 5 W/m-K PROPERTY • Highly conformable,“S-Class” softness Color • Natural inherent tack reduces interfacial

Contextual Info: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction

Contextual Info: Gap Filler 1000 Two-Part Thermally Conductive,Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 1000 PROPERTY Color / Part A • Thermal conductivity: 1.0 W/m-K • Ultra-conforming,designed for fragile and low-stress applications

Contextual Info: Gap Pad A2000 High Performance,Thermally Conductive Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD A2000 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Electrically isolating

Contextual Info: Gap Pad 2200SF Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2200SF PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Silicone-free formulation • Medium compliance with easy handling