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    E113X Datasheets (2)

    Infineon Technologies
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    E113xA
    		Infineon Technologies Datasheet E113xA Original PDF 48.93KB 3
    E113xR
    		Infineon Technologies Datasheet E113xR Original PDF 48.82KB 3
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    E113X Price and Stock

    SiTime Corporation

    SiTime Corporation SiT9001AC-13-33E1-13.00000X

    SSXO Oscillators 13MHz 3.3Volts 50ppm +-1% fr Ctr
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    Mouser Electronics SiT9001AC-13-33E1-13.00000X
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    SiTime Corporation SiT9001AC-13-25E1-13.00000X

    SSXO Oscillators 13MHz 2.5Volts 50ppm +-1% fr Ctr
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    Mouser Electronics SiT9001AC-13-25E1-13.00000X
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    SiTime Corporation SiT9001AC-43-33E1-13.00000X

    SSXO Oscillators 13MHz 3.3Volts 50ppm +-1% fr Ctr
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics SiT9001AC-43-33E1-13.00000X
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    SiTime Corporation SiT9001AC-43-25E1-13.00000X

    SSXO Oscillators 13MHz 2.5Volts 50ppm +-1% fr Ctr
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics SiT9001AC-43-25E1-13.00000X
    • 1 -
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    SiTime Corporation SiT9001AC-44-33E1-13.00000X

    SSXO Oscillators 13MHz +-100ppm 3.3V +-1% From Ctr
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics SiT9001AC-44-33E1-13.00000X
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    Find more E113X price and stock on Findchips.com

    E113X Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    E1135A

    Abstract: E1139A E1132A E1133A E1134A E1136A E1137A E1138A
    Contextual Info: CHIPDATEN / DIE DATA Mechanisch-technische Kenndaten / mechanical-technical characteristic data E113x A Chips for absolute 3x3mm Pressure Sensors Diameter of Wafer Die Size Metallization Frontside Passivation Chip Backside Die Thickness Dicing Pad Size in Diameter


    Original     		e113xe1132e1137e1135a+7e1139ae1132ae1133ae1134ae1136ae1137ae1138a PDF

    KP202R

    Abstract: E1132R DSOF Pressure sensor pressure sensor die
    Contextual Info: Monitoring Pressure Sensor Die Pressure Sensor The E113x A/R Die are monitored by the reference type E1132R mounted in the P-DSOF-8 package KP202R Type: Chip: Package: KP202 R E1132-Q DSOF 8 Duration Sample Size per year Remark Test Conditions Electrical test


    Original     		e113xe1132rkp202rkp202+5e1132-q30mindsofpressure sensorpressure sensor die PDF

    E1137

    Abstract: E1132R E1133R E1134R E1135R E1136R
    Contextual Info: CHIPDATEN / DIE DATA Mechanisch-technische Kenndaten / mechanical-technical characteristic data E113x R Chips for relative 3x3mm Pressure Sensor Diameter of Wafer Die Size Metallization Frontside Passivation Chip Backside Die Thickness Dicing Pad Size in Diameter


    Original     		e113x150mme1132e1137+5e1132re1133re1134re1135re1136r PDF