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    A102

    Abstract: A104 A110 AN-617
    Contextual Info: AN-617 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel T : 781/329-4700 • Fax: 781/326-8703 • www.analog.com MicroCSP Wafer Level Chip Scale Package By John Jackson DESCRIPTION OF THE PACKAGE TECHNOLOGY MicroCSP is a wafer level chip scale package, the only


    Original     		an-617e03272a102a104+1a110 PDF

    A102

    Abstract: A104 A110 AN-617 SHEAR MODULUS TESTING PATTERNS AN617
    Contextual Info: AN-617 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/326-8703 • www.analog.com MicroCSP Wafer Level Chip Scale Package by John Jackson and Alan O'Donnell DESCRIPTION OF THE PACKAGE TECHNOLOGY


    Original     		an-617e03272a102a104+3a110shear modulus testing patternsan617 PDF