DUAL FLATPACK 8 Search Results

ordering information

Contextual Info: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack

M932

Abstract: DSASW0037930
Contextual Info: Tape and Reel Specification M932 Tape and Reel Option Dual Flatpack No Lead DFN , Quad Flatpack No Lead (QFN) Packages - (K6/K7) DFN Taping Orientation W P Direction of Feed QFN Taping Orientation W P Direction of Feed Package Suffix Package Type Lead Count

AS2111

Abstract: m38510-10305BEA M38510
Contextual Info: Dual Voltage Comparator AS2111 Dual Voltage Comparator PIN ASSIGNMENT AVAILABLE AS MILITARY SPECIFICATIONS Top View • M38510/10305B • MIL-STD-883, 1.2.1 16 Pin Ceramic DIP (C016) 16 Pin Flatpack (F016) FEATURES • Wide operating supply range: ±15V to a single +5V

as2111c

Abstract: AS-211 M38510
Contextual Info: Dual Volta ge oltag Comparator Austin Semiconductor, Inc. AS2111 Dual Voltage Comparator PIN ASSIGNMENT AVAILABLE AS MILITARY SPECIFICATIONS Top View • M38510/10305B • MIL-STD-883, 1.2.1 16 Pin Ceramic DIP (C) 16 Pin Flatpack (F) FEATURES • Wide operating supply range: ±15V to a single +5V

Contextual Info: NATIONAL HYBRID, INC. m; 2200 Smithtown Avenue, Ronkonkoma, NY 11779 516 981-2400 FAX 516-981-8888 Mil-Std-1553 Products NHI-1523 Series +12V Dual Transceivers Features/Applications: Description: The NHI +12V dual transceivers are available in 1.900" x .780", 36 pin plug-in and flatpack packages.

RH6105

Abstract: 6000RH
Contextual Info: MIL-PRF-38534 AND 38535 CERTIFIED FACILITY M.S.KENNEDY CORP. RAD HARD DUAL HIGH SIDE DRIVER WITH CURRENT SENSE 6000RH 315 701-6751 4707 Dey Road Liverpool, N.Y. 13088 FEATURES: Manufactured using RH6105 Dice 100V RAD HARD MOSFETs Dual Configuration Surface Mount Flatpack

TB466

Abstract: qfn 32 land pattern moisture sensitivity ISL29001
Contextual Info: Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead ODFN Package Technical Brief March 14, 2008 TB466.1 Introduction Part I - ODFN Board Mounting Guidelines Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical

BCRT-30

Abstract: 12MHZ 1553B UT1553B MIL-STD-1553B D1398
Contextual Info: UT1553B BCRT ❐ DMA or pseudo-dual-port memory interface with FEATURES ❐ Comprehensive MIL-STD-1553B dual-redundant ❐ ❐ ❐ ❐ 64K addressability ❐ Internal wraparound self-test ❐ Time tagging and message logging in RT mode ❐ Packaged in 84-pin pingrid array, 84-lead flatpack, or

UT1553BCRTM

Abstract: 265u 11TA31 UT1553 UT1553B rta2
Contextual Info: UT1553 BCRTM ❐ DMA or pseudo-dual-port memory interface with FEATURES ❐ Comprehensive MIL-STD-1553 dual-redundant Bus ❐ ❐ ❐ ❐ 64K addressability ❐ Internal wraparound self-test ❐ Time tagging and message logging in RT and M modes ❐ Packaged in 84-pin pingrid array, 84-lead flatpack, or

Contextual Info: MECHANICAL DATA MCDF001 – JANUARY 1997 HBK R-CDFP-F32 CERAMIC DUAL FLATPACK 0.006 (0,15) 0.004 (0,10) 0.117 (2,97) 0.097 (2,46) 0.033 (0,84) 0.027 (0,69) 0.336 (8,53) 0.324 (8,23) 0.310 (7,87) 0.290 (7,37) 0.415 (10,54) 0.405 (10,29) 16 17 0.755 (19,18)

BUS6512

Abstract: BUS-25679 XO25
Contextual Info: DDC BUS-65110 AND BUS-65120 ILC DATA DEVICE CORPORATION_ LOW POWER MIL-STD-1553 DUAL REDUNDANT RTU HYBRID FEATURES • PIN-FOR-PIN AND FUNCTIONAL BUS-65112 REPLACEMENT • • DDIP OR FLATPACK • COMPLETE RTU PROTOCOL DESCRIPTION DDC’s BUS-65110 is a complete dual

BUS65112

Contextual Info: 0Q Q ILC DATA D E V IC I CORPORATION _ BUS-65112 AND BUS-65117 MIL-STD-1553 DUAL REDUNDANT REMOTE TERMINAL HYBRID FEATURES • SMALL SIZE & LOW POWER • COMPLETE RTU PROTOCOL BUS-65112 DDIP BUS-65117 FLATPACK DESCRIPTION The BUS-65112 is a com plete dual

abdc

Contextual Info: Q0Q ILC DATA DEVICE CORPORATION*— BUS-65112 AND BUS-65117 MIL-STD-1553 DUAL REDUNDANT REMOTE TERMINAL HYBRID FEATURES • SMALL SIZE & LOW POWER • COMPLETE RTU PROTOCOL BUS-65112 DDIP BUS-65117 FLATPACK DESCRIPTION The BUS-65112 is a com plete dual redundant MIL-STD-1553 Remote

Contextual Info: □ 0 3 ILC DATA DEVICE CORPORATION _ BUS-65112 AND BUS-65117 MIL-STD-1553 DUAL REDUNDANT REMOTE TERMINAL HYBRID FEATURES • SMALL SIZE & LOW POWER • COMPLETE RTU PROTOCOL B U S -65112 DDIP BUS-65117 FLATPACK DESCRIPTION The BUS-65112 is a com plete dual

CDFP

Contextual Info: MECHANICAL DATA MCFP009B– JANUARY 1995 – REVISED JUNE 1999 HKB R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.350 (8,89) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places

Contextual Info: MECHANICAL DATA MCFP006– JANUARY 1995 W R-GDFP-F20 CERAMIC DUAL FLATPACK Base and Seating Plane 0.300 (7,62) 0.245 (6,22) 0.045 (1,14) 0.026 (0,66) 0.008 (0,20) 0.004 (0,10) 0.100 (2,54) 0.045 (1,14) 0.320 (8,13) MAX 1 0.019 (0,48) 0.015 (0,38) 20 0.050 (1,27)

PI011

Contextual Info: . VAC068A mmàà^SSSSSSSSrnfi * .ài*' /*? / c VMEbus Address Controller • Dual UART channels on board — Double-buffered on transmit, quint-buffered on receive — Baud rate programmable • Miscellaneous features — Pin grid array or quad flatpack

78 hkc

Contextual Info: MECHANICAL DATA MCFP011A – JANUARY 1995 – REVISED JANUARY 1997 HKC R-CDFP-F64 CERAMIC DUAL FLATPACK WITH NCTB 41,14 SQ 40,13 25,91 24,89 19,43 18,54 0,66 MIN 3,81 2,54 1,78 1,40 33 64 11,30 10,67 1 32 8,13 7,49 4,70 3,68 0,25 0,15 0,20 0,11 1,02 0,76

54F74

Abstract: F1024 SS02
Contextual Info: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20

Memory

Abstract: FT61024
Contextual Info: FT61024 HIGH SPEED 128K x 8 DUAL CHIP ENABLE CMOS STATIC RAM FEATURES Advanced CMOS Technology Fast tOE Automatic Power Down Packages —32-Pin 300 mil DIP and SOJ —32-Pin 400 mil SOJ —32-Pin 600 mil Ceramic DIP —32-Pin 400 mil Ceramic DIP —32-Pin Solder Seal Flatpack

R-CDFP-F20

Contextual Info: MECHANICAL DATA MCFP005A – OCTOBER 1995 HK R-CDFP-F20 CERAMIC DUAL FLATPACK 0.035 (0,89) 0.025 (0,64) 0.095 (2,41) 0.075 (1,91) 0.010 (0,25) 0.004 (0,10) 0.310 (7,87) 0.290 (7,37) Lid 0.120 (3,05) 0.090 (2,29) 1 20 0.050 (1,27) 0.680 (17,27) 0.660 (16,76)

ccii

Abstract: rta2 PLH11L 72F14 ML/82x33/587/OS/TL/F/1553 bus controller
Contextual Info: UT1553 BCRTMP □ Tune tagging and message logging in RT mode F eatures □ Packaged in 144-pin pingrid array, 132-lead flatpack □ Comprehensive MIL-STD-1553 dual-redundant Bus Controller BC and Remote Terminal (RT) functions □ Low-power CMOS technology

GDFP1-F10

Abstract: MO-092AA S-GDFP-F10
Contextual Info: MECHANICAL DATA MCFP001A – JANUARY 1995 – REVISED DECEMBER 1995 U S-GDFP-F10 CERAMIC DUAL FLATPACK Base and Seating Plane 0.250 (6,35) 0.246 (6,10) 0.045 (1,14) 0.026 (0,66) 0.008 (0,20) 0.004 (0,10) 0.080 (2,03) 0.050 (1,27) 0.300 (7,62) MAX 1 0.019 (0,48)

Contextual Info: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20