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jedec package MO-247 Abstract: MO-247 DS813B Amkor TSCSP DS813 Contextual Info: data sheet advanced product development tsCSP Features: Thin Substrate CSP tsCSP : Very Thin, Superior Performance, Cost Effective Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard	Original	jedec package mo-247 mo-247 ds813b amkor tscsp +1ds813	PDF

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jedec package MO-247

Abstract: MO-247 DS813B Amkor TSCSP DS813
Contextual Info: data sheet advanced product development tsCSP Features: Thin Substrate CSP tsCSP : Very Thin, Superior Performance, Cost Effective Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard

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jedec package mo-247 mo-247 ds813b amkor tscsp +1

PDF