DS18011 Search Results

MMBZ5223B

Abstract: Zener Diode SOT-23 marking kh5 MMBZ5221B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B
Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE SPICE MODELS: MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B MMBZ5237B MMBZ5238B MMBZ5239B MMBZ5240B MMBZ5241B MMBZ5242B MMBZ5243B MMBZ5245B MMBZ5246B MMBZ5248B MMBZ5250B

BZ5231B

Abstract: BZ5239B BZ5221B bz5240b BZ5245B BZ5236B BZ5226B MBZ5242B BZ5229B BZ5251B
Contextual Info: MMBZ5221B - MMBZ5262B 350mW SURFACE MOUNT ZENER DIODE Features • • • • Planar Die Construction 350m W Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOT-23 H h m ; I— a ! t B Mechanical Data_

ym 238 2008

Abstract: Zener Diode SOT-23 marking kh5 MMBZ5254B Zener Diode SOT-23 J-STD-020D MMBZ5221B MMBZ5222B MMBZ5223B MMBZ5225B MMBZ5226B
Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Please click here to visit our online spice models database. Features • • • • • Mechanical Data • • Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current

embedded dram timing

Contextual Info: ASIC DATA BOOK TC300 Series Embedded DRAM 2003 TC300 Series Embedded DRAM Published in December, 2003 Document ID: BDE0067A C Copyright 2003 TOSHIBA Corporation All Rights Reserved The information contained herein is subject to change without notice. The information contained herein is presented only as a guide for the applications of our products.

MMBZ5222B

Contextual Info: MMBZ5221B - MMBZ5259B Lead-free 350mW SURFACE MOUNT ZENER DIODE SPICE MODELS: MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B MMBZ5237B MMBZ5238B MMBZ5239B MMBZ5240B MMBZ5241B

Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE SPICE MODELS: MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B MMBZ5237B MMBZ5238B MMBZ5239B MMBZ5240B MMBZ5241B MMBZ5242B MMBZ5243B

KN1 SOT-23

Abstract: MARKING KN1
Contextual Info: MMBZ5221B - MMBZ5262B 350mW SURFACE MOUNT ZENER DIODE POWER SEMICONDUCTOR Features • • • • Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOT-23 Dim Min Max

marking M2 SOT23 diodes

Abstract: marking code J1 sot23
Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • • Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2

MARKING KN1

Abstract: KE1 sot23 BZ5226
Contextual Info: MMBZ5221B - MMBZ5262B 500mW SURFACE MOUNT ZENER DIODE Features • • • • Planar Die Construction 500m W Power Dissipation on FR-4 PCB SOT-23 H h m General Purpose, Medium Current Ideally Suited for Automated Assembly Processes ; I— a ! t B Mechanical Data_

8J marking

Abstract: diode IR 100 8K
Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOT-23 A B Mechanical Data · · · · ·

MMBZ5221B

Abstract: MMBZ5222B MMBZ5223B MMBZ5225B MMBZ5259B
Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Lead, Halogen and Antimony Free, RoHS Compliant "Green"

Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • • Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2

Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE /L I T E M î l 'j I POWER S E M IC O N D U C TO R / Features Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes

Zener diode 81e

Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE POWER SEMICONDUCTOR Features • • • • Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOT-23 A B Mechanical Data

Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE SPICE MODELS: MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B MMBZ5237B MMBZ5238B MMBZ5239B MMBZ5240B MMBZ5241B

ym 238 2008

Abstract: ym 238 2003
Contextual Info: MMBZ5221B - MMBZ5259B Lead-free 350mW SURFACE MOUNT ZENER DIODE SPICE MODELS: MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B MMBZ5237B MMBZ5238B MMBZ5239B MMBZ5240B MMBZ5241B

Contextual Info: MMBZ5221B - MMBZ5259B Lead-free 350mW SURFACE MOUNT ZENER DIODE SPICE MODELS: MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B MMBZ5237B MMBZ5238B MMBZ5239B MMBZ5240B MMBZ5241B

Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Please click here to visit our online spice models database. Features • • • • • Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes

MMBZ5221B

Abstract: MMBZ5222B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5262B MMBZ5231B vishay
Contextual Info: MMBZ5221B - MMBZ5262B VISHAY 350mW SURFACE MOUNT ZENER DIODE LITEMZI y POWER SEMICONDUCTOR Features • • • • Planar Die Construction 350m W Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes

Zener Diode SOT-23 marking kh5

Abstract: diode zener marking 58 J-STD-020A MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5234B-7 MMBZ5259B MMBZ5255B
Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOT-23 A B C Mechanical Data · · · ·

Zener Diode kh5 datasheet

Abstract: MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B
Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE SPICE MODELS: MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B MMBZ5237B MMBZ5238B MMBZ5239B MMBZ5240B MMBZ5241B

ym 238

Abstract: zener diode marking code C3 sot23
Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • • Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2

KC3 SOT23

Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOT-23 A B Mechanical Data · · · · ·

Contextual Info: MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE SPICE MODELS: MMBZ5221B MMBZ5223B MMBZ5225B MMBZ5226B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B MMBZ5237B MMBZ5238B MMBZ5239B MMBZ5240B MMBZ5241B