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54122-812722250LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch |
PDF
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10137927-2221LF
|
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Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and DIP Hold Down Header, Black Color, Gold Flash plating, 22 Positions, GW Compatible LCP, Tape and Reel withcap. |
PDF
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10137927-2222LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and DIP Hold Down Header, Black Color, Gold Flash plating, 22 Positions, Non GW Compatible LCP, Tape and Reel withcap. |
PDF
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UCC27222PWPG4
|
|
Texas Instruments
|
High-Efficiency Predictive Synchronous Buck Driver 14-HTSSOP -40 to 105 |
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LM27222MX/NOPB
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Texas Instruments
|
High-Speed 4.5A Synchronous MOSFET Driver 8-SOIC -40 to 125 |
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